EP2C50F484I8N - Cyclone II FPGA, 50K LEs, 484-FBGA | Intel / Altera
MPN: EP2C50F484I8N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $233.16 | $233.16 |
| 10 | $215.5 | $2,155.00 |
| 100 | $188.4 | $18,840.00 |
| 500 | $165.2 | $82,600.00 |
| 1,000 | $148.9 | $148,900.00 |
EP2C50F484I8N Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable routing, and embedded memory and multiplier blocks that can be re-programmed in the field to implement arbitrary digital logic. FPGAs sit above microcontrollers and below ASICs in the design hierarchy, offering parallel processing throughput that microcontrollers cannot match while avoiding the NRE cost of ASICs. The Cyclone II family is Intel/Altera's low-cost FPGA line, optimized for consumer, industrial, and communications applications.
Key features include 50,528 logic elements organized into 4,508 logic array blocks, 594 Kbits of embedded RAM arranged in M4K blocks, 150 embedded 18x18 multipliers, and 4 phase-locked loops (PLLs) for clock management. The device supports LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O standards across 8 I/O banks, with per-pin dynamic slew rate and drive strength control. Configuration is supported through passive serial (AS), active serial, and JTAG modes, with on-chip configuration bitstream decryption via the optional AES block.
The Cyclone II architecture pairs a fine-grained 4-input LUT-based logic fabric with column-based M4K memory blocks and 18x18 multiplier blocks, enabling DSP-intensive functions such as FIR filters and FFTs without external multipliers. The 90nm process and 1.2V core deliver a favorable performance-per-watt ratio for its class, with typical static power below 200 mW and dynamic power dominated by switching activity on user I/O and clock trees.
Typical applications include video processing and display controllers, motor control and industrial automation, software-defined radio baseband, low-cost ASIC prototyping, and PCI/PCI Express bridge designs. The Cyclone II's combination of abundant multipliers and block RAM makes it well-suited to DSP pipelines, while its high I/O count in 484-FBGA suits parallel bus-intensive designs.
When designing with this device, plan I/O bank assignments early: each bank has its own VCCIO rail, and LVDS usage requires the dedicated reference-voltage pins. Decoupling must include both bulk capacitors and 0.1uF ceramics placed adjacent to every VCCINT/VCCIO pair, and the configuration mode pins (MSEL) must be hard-wired to select the desired configuration scheme at power-up.
This page synthesizes distributor pricing, drop-in same-brand variants, and practical design notes not found on a single distributor page, helping engineers evaluate the EP2C50F484I8N for new designs and legacy production support.
Drop-in alternatives for EP2C50F484I8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2C50F484I8N (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, Total RAM Bits, Core Voltage.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2C50F484C8N
✅ Drop-In✓ In Stock
$68.2 / Unit
View Datasheet →EP2C50F484C7N
✅ Drop-In✓ In Stock
$155 / Unit
View Datasheet →EP2C50F484C6N
✅ Drop-In✓ In Stock
$180.47 / Unit
View Datasheet →EP2C50F484I8
✅ Drop-In✓ In Stock
$180.1 / Unit
View Datasheet →EP2C35F484I8N
✅ Drop-In✓ In Stock
$56.01 / Unit
View Datasheet →EP2C20F484I8N
✅ Drop-In✓ In Stock
$49.1 / Unit
View Datasheet →EP2C50F484I8N Maximum Ratings & Electrical Characteristics
| Family | Cyclone II |
| Logic Elements (LEs) | 50,528 |
| Logic Array Blocks (LABs) | 4,508 |
| Total RAM Bits | 594,432 bits |
| Embedded Multipliers (18x18) | 150 |
| PLLs | 4 |
| User I/Os | 294 |
| I/O Banks | 8 |
| Process Technology | 90 nm CMOS |
| Core Voltage (VCCINT) | 1.2 V |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| Package | 484-ball FineLine BGA (FBGA-484) |
| Speed Grade | -8 |
| Operating Temperature | -40C to +100C (Industrial) |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG |
| RoHS Status | Compliant |
EP2C50F484I8N Pin Configuration
| Pin A1 | I/O — General-purpose user I/O, bank 1 |
| Pin A2 | I/O — General-purpose user I/O, bank 1 |
| Pin A3 | I/O — General-purpose user I/O, bank 1 |
| Pin A4 | VCCIO1 — I/O bank 1 supply voltage |
| Pin A5 | I/O — General-purpose user I/O, bank 1 |
| Pin B1 | I/O — General-purpose user I/O, bank 1 |
| Pin B2 | I/O — General-purpose user I/O, bank 1 |
| Pin B3 | GND — Ground reference |
| Pin B4 | I/O — General-purpose user I/O, bank 1 |
| Pin B5 | I/O — General-purpose user I/O, bank 1 |
| Pin C1 | I/O — General-purpose user I/O, bank 2 |
| Pin C2 | VCCINT — Core logic supply voltage (1.2 V) |
| Pin C3 | I/O — General-purpose user I/O, bank 1 |
| Pin C4 | I/O — General-purpose user I/O, bank 2 |
| Pin C5 | VCCIO2 — I/O bank 2 supply voltage |
| Pin D1 | I/O — General-purpose user I/O, bank 2 |
| Pin D2 | GND — Ground reference |
| Pin D3 | VCCINT — Core logic supply voltage (1.2 V) |
| Pin D4 | GND — Ground reference |
| Pin D5 | I/O — General-purpose user I/O, bank 2 |
| Pin E1 | I/O — General-purpose user I/O, bank 3 |
| Pin E2 | I/O — General-purpose user I/O, bank 3 |
| Pin E3 | VCCIO3 — I/O bank 3 supply voltage |
| Pin E4 | I/O — General-purpose user I/O, bank 3 |
| Pin E5 | I/O — General-purpose user I/O, bank 3 |
| Pin F1 | GND — Ground reference |
| Pin F2 | VCCINT — Core logic supply voltage (1.2 V) |
| Pin F3 | I/O — General-purpose user I/O, bank 3 |
| Pin F4 | I/O — General-purpose user I/O, bank 4 |
| Pin F5 | VCCIO4 — I/O bank 4 supply voltage |
Typical Applications
EP2C50F484I8N is suitable for 6 applications: Video Processing and Display Controllers, Industrial Motor Control and Automation, Software-Defined Radio Baseband, ASIC Prototyping and Emulation, PCI / PCI Express Bridge Designs, Legacy Production Support and Long-Life Programs.
Video Processing and Display Controllers
The EP2C50F484I8N's 50,528 logic elements and 150 embedded 18x18 multipliers make it well-suited to real-time video pipelines including deinterlacing, scaling, color-space conversion, and overlay compositing. The 594 Kbits of block RAM provide line buffers and frame-staging memory sufficient for SD and progressive HD streams without external SRAM, while 294 user I/Os comfortably accommodate parallel RGB/YCbCr buses, BT.656/601 timing, and HSYNC/VSYNC/DE control signals. Designers typically instantiate DDR2 memory controllers and HDMI/DVI transmitter IP on the same fabric. Use the EP2C50F484I8N over the EP2C35F484I8N when the design exceeds ~30K LEs after adding video DMA and OSD layers.
Recommended
Industrial Motor Control and Automation
Cyclone II devices including the EP2C50F484I8N are widely deployed in industrial motion control, where field-oriented control (FOC) of three-phase PMSM and induction motors demands deterministic DSP performance. The 150 hardware 18x18 multipliers execute Park/Clarke transforms, PI controllers, and SVPWM modulators in hardware with sub-microsecond loop latency, while the 4 PLLs generate precisely phased PWM carriers from a single crystal reference. Industrial -40C to +100C temperature rating supports cabinet and motor-mounted installations, and the 1.2 V core keeps typical dissipation low enough for fan-less sealed enclosures. Use the I8N (industrial) suffix rather than the C8N for any installation outside a climate-controlled panel.
Recommended
Software-Defined Radio Baseband
The EP2C50F484I8N's combination of abundant multipliers and block RAM enables moderate-bandwidth SDR baseband processing including digital down-conversion, channelization, and demodulation. Designers typically pair the FPGA with an external ADC sampling at 50-100 MSPS and use the on-chip multipliers for FIR filtering and CORDIC-based frequency translation, with M4K blocks buffering symbol-rate data. The 294 user I/Os accommodate LVDS- or LVCMOS-parallel ADC interfaces and provide headroom for external DAC, RF front-end control, and Ethernet MAC hand-off. Choose the EP2C50F484I8N over the EP2C35F484I8N when the channel count or FFT size requires >33K LEs after DSP and control logic are placed.
Recommended
ASIC Prototyping and Emulation
Engineers routinely use the EP2C50F484I8N as a low-cost ASIC prototype vehicle for mid-complexity SoC designs, especially when targeting 90 nm or 130 nm ASIC processes. The 50K logic elements fit partitioned ASIC blocks plus FPGA-to-ASIC debug logic, while 4 PLLs support multi-clock-domain ASIC emulation. JTAG-based configuration allows rapid design-iteration turnaround during bring-up, and the 1.0 mm pitch 484-FBGA package is compatible with standard ASIC emulation PCBs. For very large ASICs, designers chain multiple Cyclone II devices using LVDS bridging; for smaller designs, the EP2C20F484I8N may suffice and reduces per-unit emulation cost.
Recommended
PCI / PCI Express Bridge Designs
The EP2C50F484I8N is a popular host for PCI 32/64-bit and entry-level PCI Express bridge designs where a third-party MAC IP plus glue logic fits well within 50K LEs. The 294 user I/Os expose enough pins for x1 PCIe lanes alongside 32-bit local-bus glue to legacy peripherals, while block RAM buffers packet headers and descriptors with deterministic latency. Industrial temperature rating supports in-chassis deployment, and the 484-FBGA package provides the signal-integrity headroom required for 2.5 GT/s SerDes reference clock routing when paired with external PHY devices. Use the EP2C35F484I8N as a cost-down option if your bridge fits within 33K LEs after IP integration.
Recommended
Legacy Production Support and Long-Life Programs
Because the EP2C50F484I8N remains in Intel's NRND (Not Recommended for New Designs) but still-supported product tree, it is the natural choice for sustaining production of medical, defense, and industrial-control equipment with multi-decade lifecycles already in the field. The 484-FBGA footprint matches boards already qualified under long-running regulatory approvals, eliminating re-certification cost when re-spinning designs would require new EMC and safety testing. For new designs starting in 2026, Intel recommends migrating to Cyclone IV EP4CE50F484 in the same package family; for ongoing legacy builds, the I8N (industrial temp) and C8N (commercial temp) variants remain the recommended sources.
Recommended
Recommended Products Summary
Engineering reference data for EP2C50F484I8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2C50F484C8N | EP2C50F484C7N | EP2C35F484I8N | EP2C20F484I8N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA | 484-FBGA (same) | 484-FBGA (same) | 484-FBGA (same) | 484-FBGA (same) |
| Logic Elements | 50,528 | 50,528 (same) | 50,528 (same) | 33,216 (-34%) | 18,752 (-63%) |
| Speed Grade | -8 (fastest) | -8 (same) | -7 (slower) | -8 (same) | -8 (same) |
| Temperature Range | Industrial -40C to +100C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C (same) | Industrial -40C to +100C (same) |
| Embedded RAM (bits) | 594,432 | 594,432 (same) | 594,432 (same) | 483,840 (-19%) | 239,616 (-60%) |
| Embedded 18x18 Multipliers | 150 | 150 (same) | 150 (same) | 105 (-30%) | 52 (-65%) |
| User I/Os | 294 | 294 (same) | 294 (same) | 322 (+10%) | 315 (+7%) |
Key Differentiators
- Highest logic density in Cyclone II 484-FBGA footprint (vs EP2C35F484I8N)
- Industrial temperature range for harsh environments (vs EP2C50F484C8N)
- Fastest speed grade -8 for timing-critical paths (vs EP2C50F484C7N)
- Same package and pinout as smaller Cyclone II 484-FBGA variants (vs EP2C20F484I8N)
Design Notes
Estimated: based on 1.2 V VCCINT and ~1.5 A core current typical for a fully utilized EP2C50, static core power is roughly 1.8 W; add per-bank VCCIO power at 1.5/1.8/2.5/3.3 V depending on bank count. Provide bulk decoupling (47-100 uF tantalum or polymer) on each VCCINT and VCCIO rail, with one 0.1 uF X7R ceramic placed within 5 mm of every VCCINT/VCCIO pin pair to control switching noise during configuration clock bursts.
The 484-FBGA uses 1.0 mm ball pitch and demands either microvia or via-in-pad PCB technology for reliable breakout; standard 8 mil drills on 1.0 mm pitch leave insufficient pad for dog-bone fan-out. Reference the Cyclone II Handbook Chapter 7 PCB layout guidelines for stack-up recommendations (typically 4-6 layer with continuous reference planes on layers 2 and 5) and matched-length rules for LVDS and DDR interfaces.
MSEL[2:0] pins must be hard-wired to select the configuration mode at power-up; floating MSEL pins leave the device in an undefined state and prevent configuration. Do not leave nCONFIG or nSTATUS floating - both require a 10 kohm pull-up to VCCIO of the bank they reside in. Also note that the JTAG TCK signal requires a 10 kohm pull-down if not driven, to prevent spurious clocking during board test.
When using LVDS I/O on the EP2C50F484I8N, each LVDS pair consumes one true differential pair and requires the bank reference-voltage pin (VREF) to be bypassed with a 0.1 uF and 10 uF capacitor pair. Match differential pair lengths to within 150 mils to preserve duty cycle, and route LVDS over a continuous ground reference plane; crossing power-plane splits introduces common-mode noise that violates LVDS thresholds.
Estimated: at 100% utilization with all I/O toggling, the EP2C50F484I8N dissipates roughly 3-5 W in still air. The 484-FBGA theta-JA is approximately 18 C/W with a JEDEC-compliant 4-layer test board, giving a ~70-90 C junction rise above 25 C ambient. For sealed industrial enclosures, derate clock frequency or attach a small clip-on heatsink on the top of the BGA package to keep junction temperature below 100 C.
Compliance Information
RoHS and lead-free per Altera/Intel product declaration. AEC-Q100 not applicable for FPGAs (automotive qualification program targets discrete semiconductors and standard ICs, not programmable logic). Halogen-free status not explicitly listed in current distributor data.
