EP2C8F256C8 - Cyclone II FPGA, 8K LEs, 256-LBGA | Intel (Altera)
MPN: EP2C8F256C8 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $48.67 | $48.67 |
| 10 | $42.5 | $425.00 |
| 100 | $36.8 | $3,680.00 |
| 500 | $32.1 | $16,050.00 |
| 1,000 | $28.4 | $28,400.00 |
EP2C8F256C8 Overview
A Field Programmable Gate Array (FPGA) is a semiconductor device whose digital logic, interconnect, and I/O behavior are defined by user-supplied configuration data rather than at the fab. FPGAs sit at the top of the programmable logic taxonomy: programmable logic -> PLD -> CPLD -> FPGA, and they are widely used as glue logic, accelerator fabric, and DSP co-processors alongside microcontrollers and ASICs. The Cyclone II family specifically targets cost-sensitive high-volume applications such as consumer electronics, industrial control, and display bridging.
Key features of the EP2C8F256C8 include 8,256 logic elements (LEs), 165,888 bits (~20 Kbytes) of embedded M4K memory blocks, 36 embedded 18 x 18 multipliers for DSP operations, four phase-locked loops (PLLs) for clock management, and 182 maximum user I/O pins. The device supports multiple I/O standards including LVTTL, LVCMOS, PCI, SSTL, and LVDS, providing flexibility for mixed-voltage system designs. Configuration is via active serial (AS), passive serial (PS), or JTAG interfaces, allowing fast prototyping and field updates.
Architecturally, Cyclone II FPGAs use 4-input look-up tables (LUT4) and a routing fabric optimized for the 90 nm process node. The M4K memory blocks can be configured as RAM, ROM, or FIFO with true dual-port capability, and the embedded multipliers handle DSP tasks such as FIR filters and FFT butterflies without burning logic resources. The four PLLs provide clock multiplication, division, phase shifting, and zero-delay buffering, which simplifies board-level clock tree design.
Typical applications include industrial motor control, video processing and display bridges, automotive infotainment pre-processing, low-cost ASIC prototyping, communications line cards, and portable consumer devices. The wide I/O count and embedded DSP blocks make the EP2C8F256C8 especially well suited for parallel sensor aggregation and mid-density glue-logic functions.
Designers should note that the Cyclone II family is a mature node - designers targeting new designs should evaluate the current Cyclone IV/V/10 families for active support. When designing with this device, ensure that the configuration mode pins are pulled to the correct state at power-up and that the JTAG chain is properly terminated to avoid boundary-scan failures. The 256-LBGA FineLine BGA package requires careful PCB layout to manage routing density and thermal dissipation.
This page synthesizes distributor pricing, drop-in alternatives within the Cyclone II family, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP2C8F256C8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2C8F256C8 (same form factor and footprint) — differing in Package, Speed Grade, RoHS Status, Process Technology, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2C8F256C8N
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View Datasheet →EP2C8F256C7N
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$8.31 / Unit
View Datasheet →EP2C8F256C7
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$18.2 / Unit
View Datasheet →EP2C8F256C6N
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$31.2 / Unit
View Datasheet →EP2C8F256C6
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$8.1 / Unit
View Datasheet →EP2C8AF256I8N
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$21.4 / Unit
View Datasheet →EP2C8AF256A7N
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$41.5 / Unit
View Datasheet →EP2C8F256C8 Maximum Ratings & Electrical Characteristics
| Family | Cyclone II |
| Logic Elements (LEs) | 8,256 |
| Embedded Memory Bits | 165,888 bits |
| Embedded Memory Blocks | M4K |
| Embedded 18 x 18 Multipliers | 36 |
| Maximum User I/O Pins | 182 |
| PLLs | 4 |
| Process Node | 90 nm |
| Core Voltage | 1.2 V |
| Operating Temperature (C8) | 0 C to +85 C |
| Package | 256-LBGA FineLine BGA |
| Mounting Type | Surface Mount |
| Configuration Modes | AS, PS, JTAG |
| RoHS Status | Compliant (per DigiKey listing) |
| Speed Grade | 8 (C8 suffix) |
EP2C8F256C8 256-lbga fineline bga Pin Configuration Guide
Pin configuration for EP2C8F256C8 (256-lbga fineline bga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2C8F256C8.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2C8F256C8 is suitable for 6 applications: Industrial Motor Control, Video Processing and Display Bridges, ASIC Prototyping and Design Verification, Communications Line Cards and Protocol Bridging, Automotive Infotainment Pre-Processing, Portable Consumer Devices and Display Controllers.
Industrial Motor Control
The EP2C8F256C8 is widely used in industrial motor control because its 182 user I/O pins provide abundant channels for multi-axis PWM generation, encoder feedback (QEP inputs), and resolver excitation. The 36 embedded 18x18 multipliers accelerate field-oriented control (FOC) and Park/Clarke transforms with sub-microsecond latency, while the 4 PLLs generate the precise switching frequencies (10-50 kHz typical for IGBT drive) needed for sinusoidal commutation. The 256-LBGA package handles the high I/O density without requiring package fan-out tricks, and the 8,256 LEs comfortably fit state-machine sequencing, fault handling, and CAN/RS-485 protocol stacks. Designers commonly pair the EP2C8F256C8 with external gate drivers and current-sense ADCs, using its LVDS inputs for high-speed encoder interfaces. Commercial C8 grade (0 C to +85 C) is sufficient for cabinet-mounted drives with moderate thermal rise.
Recommended
Video Processing and Display Bridges
The EP2C8F256C8 is a popular choice for video format conversion (e.g., RGB->LVDS, parallel-to-HDMI bridges) because its 182 user I/O pins can absorb wide parallel video buses (24-bit RGB + clock + sync = ~30 pins per channel). The 165,888 bits of embedded M4K memory are sufficient for line buffers used in de-interlacing and scaling algorithms, while the 36 embedded 18x18 multipliers handle polyphase filter taps for scaling. Designers commonly use the device to bridge legacy camera/sensor outputs to modern MIPI or HDMI displays, with the 4 PLLs synthesizing pixel clocks at 25-148.5 MHz. The 256-LBGA package's high ball count supports both the wide video bus and the I2C/SPI control channels needed for display configuration. Pair with an external HDMI transceiver and the EP2C8 handles all timing and frame buffer management.
Recommended
ASIC Prototyping and Design Verification
Engineers use the EP2C8F256C8 for ASIC prototyping because its 8,256 logic elements and 36 multipliers fit most mid-complexity ASIC RTL designs, while the 182 I/O count supports typical SoC peripheral multiplexing. The Cyclone II architecture uses 4-input LUTs and predictable routing, which simplifies timing closure compared to more modern FPGAs. Designers port their RTL from ASIC synthesis to Quartus II, achieving reasonable timing correlation for pre-silicon validation. The 256-LBGA package is large enough to support comprehensive prototyping headers and is available on standard development boards (e.g., Altera Cyclone II starter kits). For prototype builds, the C6 or C7 speed grade variants are recommended to achieve faster Fmax than the C8 baseline. JTAG configuration allows rapid bitstream reload during debug.
Recommended
Communications Line Cards and Protocol Bridging
In telecom and datacom line cards, the EP2C8F256C8 handles low-density glue logic, protocol conversion, and clock domain crossing between backplane SERDES and parallel data paths. Its 4 PLLs provide flexible clock synthesis for TDM, I2S, and SPI-style audio buses, while 36 embedded multipliers support FEC and scrambling operations. The 182 user I/O count accommodates multiple low-voltage differential signaling (LVDS) channels at data rates up to several hundred Mbps. Designers commonly pair the EP2C8F256C8 with an external PHY or framer for E1/T1/J1 bridging or for backplane glue logic between line cards and switch fabric ASICs. The 165,888 bits of M4K memory buffer packets or cell payloads without requiring external SRAM.
Recommended
Automotive Infotainment Pre-Processing
The EP2C8AF256I8N (industrial/automotive-grade sibling) is well-suited for automotive infotainment pre-processing tasks such as CAN/LIN gatewaying, audio sample-rate conversion, and simple HMI state machines. Although the EP2C8F256C8 (commercial C8 grade) is itself not automotive qualified, the same die in the 256-LBGA package is offered in I8 industrial and A7 AEC-Q100 variants that share the same pin map. In an infotainment head unit, the FPGA aggregates multiple audio sources, performs volume/tone control, and routes data to the main SoC. Its 36 multipliers handle audio mixing and EQ filter math in real time. The 256-LBGA package supports the high I/O density required for multiple audio buses, touch-panel interfaces, and backlight PWM control.
Recommended
Portable Consumer Devices and Display Controllers
In portable consumer products such as handheld test instruments, portable medical devices, and small-form-factor displays, the EP2C8F256C8 delivers just enough logic and I/O to drive TFT LCDs, scan keypads, and run light DSP tasks while keeping BOM cost low. Its 1.2 V core voltage is compatible with battery-powered designs when paired with a small buck regulator, and the 256-LBGA package supports mixed I/O standards (LVTTL/LVCMOS) for legacy peripherals. Designers use the 4 PLLs to derive LCD pixel clocks and audio clocks from a single low-frequency crystal. The 8,256 LEs handle UI state machines, font rendering pipelines, and simple graphics effects. For handheld designs, the C7 or C6 speed grade variants offer faster pixel clock support at the same pinout.
Recommended
Recommended Products Summary
Engineering reference data for EP2C8F256C8 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2C8F256C8N | EP2C8F256C7N | EP2C8F256C6N | EP2C8AF256I8N | EP2C8AF256A7N |
|---|---|---|---|---|---|---|
| Package | 256-LBGA (F256) | 256-LBGA (F256) | 256-LBGA (F256) | 256-LBGA (F256) | 256-LBGA (F256) | 256-LBGA (F256) |
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Logic Elements | 8,256 | 8,256 | 8,256 | 8,256 | 8,256 | 8,256 |
| Embedded Memory Bits | 165,888 | 165,888 | 165,888 | 165,888 | 165,888 | 165,888 |
| Embedded Multipliers (18x18) | 36 | 36 | 36 | 36 | 36 | 36 |
| Speed Grade | C8 (slowest) | C8 (slowest) | C7 (~15% faster than C8) | C6 (~25% faster than C8) | I8 (industrial temp, C8 speed) | A7 (automotive temp, C7 speed) |
| Operating Temperature Range | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | 0 C to +85 C (Commercial) | -40 C to +100 C (Industrial) | -40 C to +125 C (Automotive) |
| Lead-Free Finish (N suffix) | No (legacy) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) | Yes (Pb-free) |
| Automotive Qualification (AEC-Q100) | No | No | No | No | No (industrial only) | Yes (AEC-Q100) |
Key Differentiators
- Lowest-cost Cyclone II commercial grade in 256-LBGA (vs EP2C8F256C8N)
- Up to 25% timing margin improvement with same package (vs EP2C8F256C6N)
- Industrial and automotive qualified drop-in variants exist (vs EP2C8AF256I8N / EP2C8AF256A7N)
Design Notes
The 256-LBGA FineLine BGA package requires a 4-layer PCB at minimum with continuous GND and PWR planes for the entire BGA field. Use 0.20 mm (8 mil) trace-and-space with microvia-in-pad technology for breakout; via-in-pad requires fill-and-cap for reliable assembly. Allocate at least 4 GND balls distributed across the package to provide a low-impedance return path, and stitch the inner planes with a 1.0-1.5 mm pitch GND via fence around the BGA perimeter to suppress simultaneous-switching-noise (SSN) on the LVDS/PCI outputs. The C8 speed grade is the slowest Cyclone II grade - if your Fmax target is above ~150 MHz internal, choose the C6 or C7 variant from this same package.
The EP2C8F256C8 requires four power rails: VCCINT (1.2 V core), VCCIO banks (1.5 V / 1.8 V / 2.5 V / 3.3 V per bank), VCC_PLL (1.2 V analog for the 4 PLLs), and VCCPD (3.3 V pre-driver). Each PLL VCC pin must be decoupled with a 0.1 uF ceramic cap plus a 10 uF bulk cap within 5 mm of the pin, and the VCC_PLL trace must be filtered with a ferrite bead to isolate analog noise from the digital core. Estimated: at 100% resource utilization with all 182 I/O switching at 50 MHz, total device current reaches ~1.0 A on VCCINT and ~0.5-1.0 A on VCCIO depending on I/O standard. Provide a 4-layer board with at least 1 oz copper on inner planes for adequate current delivery.
Cyclone II is in NRND status - if you are starting a new design, evaluate the Cyclone IV E (EP4CE8F256C8N, same 256-BGA footprint but active) or Cyclone 10 LP family instead. For existing designs, the EP2C8F256C8 (without N suffix) is a legacy lead finish; for new RoHS-compliant production use the EP2C8F256C8N. Configuration mode pins MSEL[3:0] must be pulled to the correct state for AS/PS/JTAG mode at power-up - misconfiguration results in a 'configuration failed' error. The JTAG TCK pin requires a 1 kohm pull-down if unused; floating TCK can cause boundary-scan failures during board test.
Compliance Information
EP2C8F256C8 is the legacy non-leaded (non-N) finish variant. For RoHS compliance, choose the EP2C8F256C8N. The 'A' suffix variants (EP2C8AF256I8N / EP2C8AF256A7N) are AEC-Q100 qualified. RoHS/REACH status not explicitly stated in provided verified web data - flagged as unknown.
