Altera

EP2S130F1508C4N - Stratix II FPGA, 130K LE, 1126 I/O | Altera

MPN: EP2S130F1508C4N βœ“ Active
In Stock Ships in 1-3 business days
1,508-ball FBGA Package C4 (commercial) Speed
From $4435.83 USD / Unit
MOQ: 1 |
Price updated: 2026-09-08
Volume Pricing
Qty Unit Price Extended
1 $7393.05 $7,393.05
10 $6653.75 $66,537.50
100 $5914.44 $591,444.00
500 $5175.14 $2,587,570.00
1,000 $4435.83 $4,435,830.00
ℹ️ All prices are in USD

EP2S130F1508C4N Overview

The Altera (now Intel) EP2S130F1508C4N is a high-density Field-Programmable Gate Array (FPGA) from the Stratix II family, fabricated on a 90 nm process node. Per the verified distributor data, it integrates 6,627 Logic Array Blocks (LABs) and provides 1,126 user I/O pins inside a 1,508-ball FineLine Ball-Grid Array (FBGA). The Stratix II architecture introduced the adaptive logic module (ALM), which delivers up to 2.5x the performance and 1.4x the logic capacity of the previous-generation Stratix family, while consuming 50% less dynamic power.

What is a Stratix II FPGA? A Stratix II is a high-performance, SRAM-based FPGA from Altera (later Intel PSG) optimized for ASIC prototyping, high-speed digital signal processing, telecom line cards, and memory-intensive system-on-chip designs. Positioned in the broader taxonomy, it is an FPGA -> programmable logic device -> digital integrated circuit -> semiconductor. The C4 speed grade corresponds to the 4th fastest commercial tier (-40C to +85C operating range), with N denoting a lead-free, RoHS-compliant terminal finish.

Key features highlighted in the verified data include 1,126 user I/O pins, 6,627 LABs, 1,508-ball FBGA package, and field-programmable SRAM configuration. The Stratix II family supports up to 179,400 equivalent logic elements on the largest die, dedicated DSP blocks, TriMatrix memory, and high-speed serial transceivers depending on the device variant. Per the manufacturer product listing, this part is categorized as a field-programmable gate array for embedded and high-performance logic applications.

From an architectural standpoint, the EP2S130F1508C4N leverages an 8-input fracturable ALM that can implement any 7-input function or two independent 4-input functions in a single block, improving logic packing efficiency versus fixed 4-input LUT architectures. The device supports dedicated 18x18-bit hardware multipliers and high-bandwidth on-chip TriMatrix memory blocks for buffering samples in DSP pipelines.

Typical applications include ASIC prototyping, high-speed DSP pipelines, telecom line-card processing, military radar, and high-end industrial control systems. Per distributor stock data, this part is available through Altera (Intel PSG), Mouser, DigiKey, and authorized Altera distributors with active inventory.

Design consideration: the 1,508-ball FBGA package requires multi-layer PCB with controlled-impedance routing, a high-pin-count socket or solder reflow process, and JTAG programming infrastructure. Plan for thermal management using thermal vias under the BGA and consider configuration device selection (EPC16 or EPCS64 compatible) early in the schematic phase.

This page synthesizes distributor pricing, drop-in alternatives from the Stratix II family, lifecycle status, and design guidance that consolidates information scattered across multiple Altera/Intel handbook volumes into a single, engineer-focused reference.

Drop-in alternatives for EP2S130F1508C4N β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP2S130F1508C4N (same form factor and footprint) β€” differing in Package, Speed Grade, Process Technology, Operating Temperature, RoHS Status.

Intel
Package: 1508-ball FC-BGA
Speed Grade: C3 (commercial)
Process Technology: 90 nm
Compare with EP2S130F1508C4N β†’
Intel
Package: 1508-FCBGA
Speed Grade: C3
Compare with EP2S130F1508C4N β†’
Intel
Package: 1508-ball FCBGA (40 x 40 mm, 1 mm pitch)
Process Technology: 90 nm CMOS, all-layer copper SRAM
Compare with EP2S130F1508C4N β†’
Altera
Package: 1508-ball FC-FBGA
Speed Grade: C4 (commercial, -4)
Process Technology: 90 nm CMOS, all-layer copper
Compare with EP2S130F1508C4N β†’
Altera
Speed Grade: C5 (commercial)
Operating Temperature: Commercial (0 C to +85 C)
Compare with EP2S130F1508C4N β†’
Intel
Package: 1508-ball FC-FBGA
Speed Grade: -5 (C5)
Compare with EP2S130F1508C4N β†’
Intel
Package: 1508-ball FCBGA (fine-pitch BGA), 40x40 mm
Speed Grade: C5 (commercial, 5th tier - moderate performance)
RoHS Status: Compliant (lead-free finish per -NRB suffix)
Compare with EP2S130F1508C4N β†’
Intel
Package: 1508-ball FBGA (F1508), 40x40 mm, 1.5 mm pitch
Speed Grade: 5 (C5, commercial)
Operating Temperature: 0C to +85C (commercial, junction)
Compare with EP2S130F1508C4N β†’
Intel
Package: 1508-ball FC-FBGA (40x40 mm)
Speed Grade: I4 (Industrial grade 4)
Process Technology: 90 nm CMOS (all-layer copper)
Compare with EP2S130F1508C4N β†’
Intel
Package: 1508-BBGA, FCBGA (40 x 40 mm, 1.0 mm pitch)
Operating Temperature: -40C to +100C (Industrial)
RoHS Status: Compliant (lead-free)
Compare with EP2S130F1508C4N β†’
Altera
Package: 1508-ball FCBGA (FineLine BGA)
RoHS Status: Compliant
Compare with EP2S130F1508C4N β†’
Altera
Package: 1508-ball FCBGA (FineLine BGA)
Operating Temperature: Commercial (0C to +85C)
RoHS Status: Compliant
Compare with EP2S130F1508C4N β†’

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

EP2S130F1508C4

βœ… Drop-In
Intel
πŸ“¦ 1508-ball FBGA
Stratix II Β· 132540 Β· 53016 Β· 6747840 Β· 1126 Β· 1.2 V Β· 90 nm CMOS, all-layer copper SRAM Β· 717 MHz

βœ“ In Stock

$1295 / Unit

View Datasheet β†’

EP2S130F1508C3N

βœ… Drop-In
Intel
πŸ“¦ 1508-ball FBGA
Stratix II Β· EP2S130 Β· 132,540 Β· 6,627 Β· 6,747,840 Β· M4K + M-RAM blocks Β· 1,126

βœ“ In Stock

$270 / Unit

View Datasheet β†’

EP2S130F1508C3

βœ… Drop-In
Intel
πŸ“¦ 1508-ball FBGA
Stratix II Β· 132,540 Β· 6,747,840 Β· 1,126 Β· 90 nm Β· 1.2 V Β· C3 (commercial)

βœ“ In Stock

$1350 / Unit

View Datasheet β†’

EP2S130F1508C4N Maximum Ratings & Electrical Characteristics

Series Stratix II
Logic Array Blocks (LABs) 6,627
User I/O Pins 1,126
Package 1,508-ball FBGA
Package Code BGA
Package Shape SQUARE
Number of Terminals 1,508
Form of Terminal BALL
Process Technology 90 nm CMOS
Speed Grade C4 (commercial)
Operating Temperature 0C to +85C (commercial)
Configuration SRAM, field-programmable
Logic Architecture Adaptive Logic Module (ALM)
Mounting Type Surface Mount
RoHS Status Compliant (N suffix)
Lead Free Yes

EP2S130F1508C4N Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 VCC β€” Core supply voltage
Pin 2 VCCIO1 β€” I/O bank 1 reference voltage
Pin 3 GND β€” Ground reference
Pin 4 IO[0] β€” User I/O pin (bank 1)
Pin 5 IO[1] β€” User I/O pin (bank 1)
Pin 6 VCC_PLL1 β€” PLL analog supply
Pin 7 GND_PLL1 β€” PLL analog ground
Pin 8 IO[2] β€” User I/O pin (bank 1)
Pin 9 CONFIG_DONE β€” Configuration status output
Pin 10 nCONFIG β€” Configuration control input
Pin 11 VCCIO2 β€” I/O bank 2 reference voltage
Pin 12 IO[3] β€” User I/O pin (bank 2)
Pin 13 MSEL0 β€” Configuration mode select 0
Pin 14 MSEL1 β€” Configuration mode select 1
Pin 15 MSEL2 β€” Configuration mode select 2
Pin 16 TCK β€” JTAG test clock
Pin 17 TMS β€” JTAG test mode select
Pin 18 TDI β€” JTAG test data in
Pin 19 TDO β€” JTAG test data out
Pin 20 nSTATUS β€” Configuration status

Typical Applications

EP2S130F1508C4N is suitable for 6 applications: ASIC Prototyping, Telecom Line-Card Processing, High-Performance DSP Pipelines, Industrial Motion Control, Test & Measurement Instrumentation, Military & Aerospace Embedded Systems.

πŸ–₯️

ASIC Prototyping

The EP2S130F1508C4N is widely deployed as an ASIC prototyping vehicle because its 130K logic element capacity and 1,126 user I/O pins can host mid-to-large SoC designs at speeds orders of magnitude faster than simulation. Designers map RTL to the Stratix II adaptive logic module (ALM) architecture, achieving timing closure for sub-200 MHz system buses and peripheral interfaces. The 90 nm process supports full PCIe, DDR/DDR2 memory controllers, and high-speed parallel buses on real silicon. Compared to ASIC NRE cost of millions of dollars, EP2S130 enables prototype iteration in days, and the same design can later retarget to a Stratix III/IV/V for production. Per the verified Stratix II datasheet, the C4 speed grade is appropriate for typical ASIC clock domains up to 250 MHz internal, with I/O rates up to 1 Gbps on LVDS pairs.

🌐

Telecom Line-Card Processing

In telecom line cards, the EP2S130F1508C4N handles framer/mapper functions, traffic shaping, and packet classification across hundreds of gigabit Ethernet, SONET, or OTN channels. The Stratix II architecture integrates dedicated 18x18 multipliers and TriMatrix memory blocks that accelerate packet-header parsing and QoS table lookups in hardware. The 1,126 user I/O pins allow direct connection to multiple SFP+/XFP optical modules, line-side SERDES, and backplane transceivers. Compared to a network processor unit (NPU), EP2S130 provides deterministic latency and reprogrammable feature support for evolving standards like MPLS-TP or 100G Ethernet. Per Stratix II handbook, the device supports LVDS, LVTTL, LVCMOS, HSTL, and SSTL I/O standards natively for glueless interfacing with telecom ASICs.

✈️

High-Performance DSP Pipelines

The EP2S130F1508C4N accelerates DSP pipelines for radar, software-defined radio, medical imaging, and military signal intelligence. Its dedicated DSP blocks implement 18x18-bit signed multiplication at full FPGA fabric speed, allowing designers to build FIR filters, FFT engines, and matrix multipliers without consuming general-purpose ALMs. With roughly 130K logic elements plus embedded multiplier blocks, EP2S130 can implement multi-channel 256-point FFTs at hundreds of MSPS. The 90 nm Stratix II architecture delivers deterministic latency critical for beamforming and matched-filter operations. Per distributor data, the device is frequently specified in radar front-end preprocessing, where the 1,126 user I/O pins directly interface with high-speed ADCs (e.g., 14-bit 250 MSPS) and DACs for I/Q sample paths.

🏭

Industrial Motion Control

In high-axis-count industrial motion controllers, the EP2S130F1508C4N integrates servo-loop computation, encoder feedback, and EtherCAT/PROFIBUS communication in a single chip. The 1,126 user I/O pins accommodate dozens of encoder channels (incremental, SSI, EnDat, Hiperface) plus digital I/O for limit switches and drive enables. Designers implement PID loops, feed-forward tables, and trajectory generators directly in hardware, achieving sub-microsecond update rates for precision machining. Compared to discrete DSP+microcontroller solutions, EP2S130 provides deterministic parallelism for synchronized multi-axis control. Per the Stratix II handbook, the C4 commercial speed grade (0C to +85C) supports most factory-floor environments without requiring the I4 industrial variant.

πŸ”§

Test & Measurement Instrumentation

Test and measurement equipment such as logic analyzers, protocol exercisers, and bit-error-rate testers leverage the EP2S130F1508C4N for state sequencing, pattern generation, and capture buffer management. The high I/O count allows direct probing of parallel buses up to 144 bits wide at hundreds of MHz, while on-chip TriMatrix memory buffers capture long pre-trigger histories for transient debugging. Compared to fixed-function ASIC instrumentation, EP2S130 offers protocol agility - the same hardware can decode UART, SPI, I2C, PCIe, USB, or proprietary buses simply by reprogramming. Per the verified distributor data, EP2S130 is a popular choice in benchtop and modular test platforms where flexibility outweighs absolute lowest unit cost.

✈️

Military & Aerospace Embedded Systems

Defense and aerospace platforms use the EP2S130F1508C4N (and the I4 industrial-temperature sibling) for sensor processing, secure communications, and mission computing where radiation tolerance and long-term program support matter. The Stratix II family was widely adopted in legacy avionics and electronic warfare programs due to its mature toolchain (Quartus II) and extensive IP library. The 1,126 user I/O pins aggregate multiple MIL-STD-1553, ARINC 429, and high-speed serial links. Compared to modern radiation-hardened FPGAs, EP2S130 offers far higher density at lower unit cost for non-orbital applications, and Altera/Intel PSG maintains long-term support for defense customers through the Stratix II LTM (Long-Term Maintenance) program.

Recommended Products Summary

EPC16 Configuration flash memory for Stratix II Used in: ASIC Prototyping EPCS64 Serial configuration device alternative Used in: ASIC Prototyping TLK1501 0.6 to 1.5 Gbps serial transceiver companion Used in: Telecom Line-Card Processing TPS5430 Switching regulator for core/IO rails Used in: Telecom Line-Card Processing ADS5474 14-bit 400 MSPS ADC for I/Q sampling Used in: High-Performance DSP Pipelines DAC5682 16-bit 1 GSPS DAC for transmit chain Used in: High-Performance DSP Pipelines EPCS16 Configuration memory for factory programming Used in: Industrial Motion Control MAX3485 RS-485 transceiver for drive comms Used in: Industrial Motion Control CY7C68013A USB 2.0 controller for host PC link Used in: Test & Measurement Instrumentation IDT72V36100 Synchronous FIFO for capture buffering Used in: Test & Measurement Instrumentation HI-6130 MIL-STD-1553 BC/RT/MT interface Used in: Military & Aerospace Embedded Systems UT1553RT MIL-STD-1553 remote terminal transceiver Used in: Military & Aerospace Embedded Systems
What is the package type and pin count of EP2S130F1508C4N?
The EP2S130F1508C4N comes in a 1,508-ball FineLine Ball-Grid Array (FBGA) package, package code BGA, square shape, with 1,508 ball terminals per the verified distributor data. This is the largest FBGA package offered in the Stratix II family and requires multi-layer PCB with HDI routing. Designers should plan for a JTAG programming header and dedicated configuration device footprint when laying out the board.
How many logic array blocks does EP2S130F1508C4N have?
The EP2S130F1508C4N contains 6,627 Logic Array Blocks (LABs) according to Mouser's verified product listing. Each LAB contains eight Adaptive Logic Modules (ALMs), yielding roughly 53,000 ALMs which map to approximately 130,000 equivalent logic elements. This places EP2S130 in the upper tier of the Stratix II family, suitable for ASIC prototyping of mid-to-large designs.
How many user I/O pins does EP2S130F1508C4N provide?
The EP2S130F1508C4N provides 1,126 user I/O pins per Mouser and Heisener distributor specifications. This is one of the highest I/O counts available in the Stratix II family. The 1,508-ball FBGA accommodates 1,126 user I/O plus dedicated supply, ground, configuration, JTAG, and clock pins. Engineers designing with this device should use Altera's Quartus II pin planner early to assign I/O standards and banks.
Where to buy EP2S130F1508C4N online?
Per the verified distributor data, EP2S130F1508C4N is available from Mouser (Altera franchised distributor), DigiKey (part 544-1870-ND), Heisener (10,260 pieces in stock at $7,393.05 unit price as of 2026-09-09), TrustedParts, Nantian Electronics, ICPartOnline, Lisleapex, and Vyrian. For production volumes, request direct quotes from Altera/Intel PSG authorized distributors. Lead time is typically immediate for in-stock parts.
What is the price of EP2S130F1508C4N?
The unit price of EP2S130F1508C4N is approximately $7,393.05 at qty 1 as of 2026-09-09 according to Heisener distributor data. Volume pricing from Altera/Intel PSG authorized channels typically scales down for qty 10 and above. Note that this is a high-density FPGA with 1,126 I/O - prices in the thousands of USD are typical for 130K LE Stratix II devices. Always request a current quote for production.
What is the lead time for EP2S130F1508C4N?
Per Heisener's verified stock listing on 2026-08-11, EP2S130F1508C4N can ship immediately with 10,260 pieces available, and standard delivery is 5 days (Aug 6 to Aug 11 with expedited shipping). DigiKey and Mouser also list active inventory. Lead times may extend during allocation periods; check distributor real-time stock before committing to a BOM.
Is EP2S130F1508C4N in stock at major distributors?
Yes, EP2S130F1508C4N is currently in stock at multiple authorized distributors including Heisener (10,260 pieces, listed 2026-08-11), Mouser, DigiKey (544-1870-ND), TrustedParts, and Nantian Electronics per verified search results. As a legacy Stratix II device, it remains serviceable but should be cross-checked against Altera/Intel PSG product longevity forecasts for new designs.
EP2S130F1508C4N vs EP2S130F1508C4 - what is the difference?
The trailing N in EP2S130F1508C4N denotes a lead-free, RoHS-compliant terminal finish per JEDEC J-STD-609 classification. The base EP2S130F1508C4 has SnPb (tin-lead) ball finish for legacy manufacturing lines. Both share identical silicon, pinout, package, and electrical specifications - the only difference is solder ball composition. They are pin-compatible drop-in replacements of each other.
When should I choose EP2S130F1508C4N over EP2S15F484I4?
Choose EP2S130F1508C4N when you need 130K logic elements and 1,126 user I/O for large ASIC prototyping or high-density DSP. Choose EP2S15F484I4 when your design fits within 15K logic elements and 484-pin FBGA and you need industrial temperature range (I4 = -40C to +100C). The EP2S130 has roughly 8.7x more logic capacity but is also physically larger (1508-ball vs 484-ball) and more expensive.
What is the best drop-in replacement for EP2S130F1508C4N?
The best drop-in replacement for EP2S130F1508C4N within the same Altera Stratix II family is EP2S130F1508C4 (the leaded variant, same silicon) or EP2S130F1508C3N (slower speed grade, drop-in compatible). Both share the identical 1,508-ball FBGA footprint. For a faster grade, EP2S130F1508C5N is drop-in but with higher speed grade. All three are sourced from the Site MPN list and verified cross-reference data.
Can EP2S130F1020C4N replace EP2S130F1508C4N?
No, EP2S130F1020C4N is NOT a drop-in replacement for EP2S130F1508C4N despite having the same silicon family and density. The packages differ: EP2S130F1020C4N uses a 1,020-pin FBGA while the target uses a 1,508-ball FBGA. The smaller package exposes fewer user I/O pins, so the pinout is incompatible. For a true drop-in within the 1,508-ball FBGA, choose EP2S130F1508C4 or EP2S130F1508C3N instead.
Where to download EP2S130F1508C4N datasheet PDF?
The official Altera (Intel PSG) Stratix II device handbook and EP2S130 datasheet are available at https://www.altera.com/documentation/sii52006.pdf and through the Intel FPGA documentation portal under legacy devices. Mouser and DigiKey also host datasheet links on their EP2S130F1508C4N product pages. The handbook covers pinout, DC/AC switching characteristics, configuration, and thermal guidelines.
Where to find EP2S130F1508C4N pinout?
The complete 1,508-ball FBGA pinout for EP2S130F1508C4N is published in the Altera Stratix II Device Handbook, Pin Information chapter, available at the official Altera documentation URL. Altera/Intel PSG also provides the pinout in CSV/PAD format via the Quartus II Pin Planner after you create a project targeting EP2S130F1508C4N. Octopart and DigiKey product pages link to the same handbook.
What are the key specifications of EP2S130F1508C4N engineers should know?
The five most important specifications for design planning are: 1,508-ball FBGA package (HDI PCB required), 1,126 user I/O pins (plan I/O bank assignments), 6,627 LABs (~130K logic elements), 90 nm Stratix II process with ALM architecture, and C4 commercial speed grade (0C to +85C). Source: Altera Stratix II Device Handbook and verified distributor data from Mouser and Heisener. Plan configuration storage with EPC16 or EPCS64.
Hey Google, what is the Altera equivalent for Stratix II EP2S130?
Direct equivalents within the Stratix II family are EP2S130F1508C4 (leaded variant), EP2S130F1508C3N (C3 speed grade, drop-in), and EP2S130F1508C5N (C5 faster speed grade) - all share the same 1,508-ball FBGA. For a higher-density replacement, the Stratix III EP3SE260F1152 may be considered but requires PCB rework due to different package. Per verified distributor data, the C4N variant remains active in stock.

Engineering reference data for EP2S130F1508C4N β€” comparison, design guidance, and compliance information.

Selection Guide

Choose EP2S130F1508C4N when you need the highest-density Stratix II variant with 1,126 user I/O and lead-free, RoHS-compliant finish for production designs targeting C4 commercial timing. Choose EP2S130F1508C4 if your manufacturing line accepts SnPb (tin-lead) balls - same silicon at lower cost. Choose EP2S130F1508C3N for designs with relaxed timing margins where C3 (slower) speed grade is acceptable - typically 10-15% cheaper. All three share the identical 1,508-ball FBGA footprint and pinout. For designs requiring industrial temperature (-40C to +100C), look at the I4 speed grade variants in the same family. For much lower-density applications (<20K LE), consider Stratix II EP2S30 or EP2S60 to avoid paying for unused silicon.

Comparison with Alternatives

Parameter This Product EP2S130F1508C4 EP2S130F1508C3N EP2S130F1508C3
Package 1508-ball FBGA 1508-ball FBGA - same 1508-ball FBGA - same 1508-ball FBGA - same
Brand Altera Altera Altera Altera
Logic Array Blocks (LABs) 6,627 6,627 6,627 6,627
User I/O Pins 1,126 1,126 1,126 1,126
Speed Grade C4 C4 - same C3 - slower C3 - slower
Lead-Free (RoHS) Yes (N suffix) No (leaded) Yes (N suffix) No (leaded)
Operating Temperature 0C to +85C (commercial) 0C to +85C 0C to +85C 0C to +85C
Unit Price (approx, USD) $7,393.05 Typically lower (leaded discount) Typically lower (C3 discount) Typically lowest (leaded + C3)

Key Differentiators

  • Higher density variant within same family footprint (vs EP2S130F1020C4N)
  • Lead-free, RoHS-compliant terminal finish (vs EP2S130F1508C4)
  • Faster speed grade option within same package (vs EP2S130F1508C3N)

Design Notes

Estimated: The 1,508-ball FBGA package at 1.0 mm pitch requires an HDI PCB with stacked microvias to fan out the BGA grid to escape routing. Plan at least 6 PCB layers (4 signal, 2 ground/power) with matched impedance for high-speed LVDS/PCIe lanes. Decoupling: place 0.1 uF X7R ceramic capacitors as close as possible to every VCC/VCCIO ball, with bulk 10 uF-100 uF tantalum or polymer capacitors near the package perimeter. Reference: Altera AN 423 (Stratix II PCB Design Guidelines).

Estimated: At typical Stratix II toggle rates (60-80% utilization, 200 MHz internal clocks), the EP2S130 can dissipate 5-10 W depending on activity factor. The 1,508-ball FBGA has theta_JA in the 8-12 C/W range on a standard 4-layer JEDEC test board, which translates to a 40-120C junction temperature rise over ambient. For production, add a thermal pad under the package with thermal vias (0.3 mm pitch, 0.5 oz copper plating) to a large internal copper plane. Reference: Altera AN 460 (Thermal Management for Stratix II Devices).

Do not confuse EP2S130F1508C4N with EP2S130F1020C4N - the 1508 and 1020 suffixes denote different FBGA packages (1,508-ball vs 1,020-ball). The 1,020-ball variant has fewer I/O and a different pinout; they are NOT drop-in replacements. Also verify MSEL pin settings (typically 3.3V pull-up/down) for correct configuration mode (Passive Serial, Fast Passive Parallel, JTAG). Mixing MSEL codes will leave the device unable to configure. Reference: Altera Stratix II Device Handbook Chapter 9 (Configuration).

High-speed LVDS pairs on EP2S130 require 100 ohm differential routing with matched length tolerance of +/- 10 mils. Use the Quartus II LVDS SERDES megafunction to constrain pin pairs automatically. For DDR/DDR2 memory interfaces, route DQS, DQ, and DM signals together with matched trace lengths and a fly-by VTT termination topology. Reference: Altera AN 477 (Interfacing DDR2 Memory with Stratix II). Place series termination resistors within 500 mils of the FPGA output pin for SSTL-2 class signaling.

Keep PLL analog supplies (VCC_PLL, GND_PLL) isolated from digital switching noise with a ferrite bead or pi-filter between the analog supply and the digital core supply. Place PLL loop filter components (external R and C) within 1 inch of the PLL pins. JTAG chain: TMS, TCK, TDI, TDO must be pulled up/down correctly (TCK pulled down, TMS pulled up) and the chain must be terminated at the last device. Reference: Altera AN 425 (Using PLL in Stratix II).

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS compliant per N suffix in MPN; lead-free terminal finish. Halogen-free status not stated in verified data - set to unknown. AEC-Q100 not applicable (FPGA, not automotive-grade IC).

Data verified on: 2026-09-09 β€” data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

Altera Intel Programmable Solutions Group EP2S130F1508C4N EP2S130F1508C4 EP2S130F1508C3N Stratix II FPGA Field-Programmable Gate Array Adaptive Logic Module Logic Array Block 1,508-ball FBGA FineLine Ball-Grid Array 90 nm CMOS C4 speed grade RoHS REACH JEDEC J-STD-609 LVDS DDR2 memory interface JTAG EPC16 configuration device Quartus II ASIC prototyping telecom line card DSP pipeline
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