EP2S130F1508C4RB - 132K LE Stratix II FPGA, 1508-FBGA | Altera
MPN: EP2S130F1508C4RB β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1695 | $16,950.00 |
| 100 | $1540 | $154,000.00 |
| 500 | $1380 | $690,000.00 |
| 1,000 | $1245 | $1,245,000.00 |
EP2S130F1508C4RB Overview
A Field-Programmable Gate Array (FPGA) is a programmable semiconductor that belongs to the broader category of programmable logic devices (PLDs) and ultimately to digital integrated circuits. Within the FPGA taxonomy, the Stratix II family sits at the high-density, high-performance tier, leveraging an innovative adaptive logic module (ALM) architecture that delivers up to 2.5x the performance and 50% lower power versus the original Stratix generation. The EP2S130 sits at the top of the Stratix II density range, intended for ASIC-prototype, telecom line-card, and DSP-intensive applications.
Key features of the EP2S130F1508C4RB include dedicated on-chip memory (TriMatrix blocks totaling 6.75 Mbit), up to 36 DSP blocks providing roughly 384 18-bit x 18-bit multipliers, support for external memory interfaces including DDR, DDR2, QDR II, and RLDRAM II, and up to 12 high-speed transceiver channels (depending on variant). The device also embeds a flexible PLD-style clock network and hardware multipliers that simplify high-throughput signal-processing pipelines.
The architecture is built around 16 ALMs per logic array block (LAB), each ALM containing an 8-input fracturable look-up table (LUT), two dedicated adders, and registers. The 1.2 V core supply is paired with dedicated phase-locked loops (PLLs) and a global clock tree supporting frequency synthesis across the device. According to public listings, the device operates at up to approximately 711.24 MHz internal clock frequencies, with maximum performance dependent on the Quartus II compile and the speed grade.
Typical applications include high-speed data acquisition and processing, telecom baseband and line-card designs, ASIC prototyping, military and aerospace signal processing, image and video processing pipelines, software-defined radio (SDR) platforms, and high-performance DSP co-processing. The 1,126 user I/O count also makes it well suited for systems with very wide parallel buses or large external memory banks.
When designing with this device, plan power-rail sequencing for the 1.2 V core alongside dedicated PLL and transceiver supplies, and ensure the PCB footprint and BGA escape routing accommodate the 1508-ball FC-FBGA. Designers should use the latest Quartus II design software (or a compatible third-party flow) for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design considerations not found in the manufacturer datasheet.
Drop-in alternatives for EP2S130F1508C4RB β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2S130F1508C4RB (same form factor and footprint) β differing in Package, Speed Grade, Process Technology, Operating Temperature, RoHS Status.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2S130F1508C4N
β Drop-Inβ In Stock
$4435.83 / Unit
View Datasheet βEP2S130F1508C4
β Drop-Inβ In Stock
$1295 / Unit
View Datasheet βEP2S130F1508C3N
β Drop-Inβ In Stock
$270 / Unit
View Datasheet βEP2S130F1508C3
β Drop-Inβ In Stock
$1350 / Unit
View Datasheet βEP2S130F1020C4RB
β Drop-Inβ In Stock
$1310 / Unit
View Datasheet βEP2S130F1508C4RB Maximum Ratings & Electrical Characteristics
| Family | Stratix II |
| Logic Elements | 132,540 |
| Embedded Memory Bits | 6,747,840 bits |
| Embedded Memory Type | TriMatrix (MRAM/M512/M4K/M-RAM) |
| DSP Blocks | Up to 36 (18-bit x 18-bit multipliers) |
| User I/O Count | 1,126 |
| Process Technology | 90 nm CMOS, all-layer copper |
| Core Voltage | 1.2 V |
| Speed Grade | C4 (commercial, -4) |
| Temperature Grade | Commercial (0C to +85C) |
| Package | 1508-ball FC-FBGA |
| Operating Temperature | 0C to +85C (commercial) |
| Mounting Type | Surface Mount (BGA) |
| Configuration Scheme | SRAM-based, requires external configuration device (EPCS) |
EP2S130F1508C4RB 1508-ball fc-fbga Pin Configuration Guide
Pin configuration for EP2S130F1508C4RB (1508-ball fc-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2S130F1508C4RB.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2S130F1508C4RB is suitable for 6 applications: ASIC Prototyping and Validation, High-Speed Data Acquisition Systems, Telecom Line-Card and Baseband Processing, Software-Defined Radio (SDR) Platforms, Image and Video Processing Pipelines, Military and Aerospace Signal Processing.
ASIC Prototyping and Validation
The EP2S130F1508C4RB's 132,540 logic elements and 6,747,840 embedded memory bits make it one of the largest Stratix II silicon available for ASIC prototyping. Its 1.2 V 90 nm process and Quartus II support allow design teams to map multi-million-gate ASICs onto a single FPGA. The 1508-ball FC-FBGA exposes 1,126 user I/O, which lets engineers replicate wide parallel buses and external memory interfaces that mirror the target ASIC, while the -C4 speed grade keeps timing closure reasonable for high-frequency paths.
Recommended
High-Speed Data Acquisition Systems
With up to 36 DSP blocks providing roughly 384 18-bit x 18-bit multipliers and 6.75 Mbit of TriMatrix on-chip memory, the EP2S130F1508C4RB is well matched to multi-channel data-acquisition boards running FIR filters, FFT pipelines, and real-time DSP. The 1,126 user I/O support wide LVDS/PECL front-end banks feeding the FPGA, and the dedicated PLL network synthesizes the multiple sample-rate clocks needed by interleaved ADC front-ends. Compared with smaller Stratix II parts, the EP2S130 leaves headroom for double-buffered acquisition and processing on the same die.
Recommended
Telecom Line-Card and Baseband Processing
The combination of large logic capacity, embedded memory bandwidth, and external memory interfaces (DDR, DDR2, QDR II, RLDRAM II) makes the EP2S130F1508C4RB a fit for telecom line-card designs and baseband processing. The dedicated 18-bit x 18-bit DSP blocks accelerate channelization, FEC decoding, and symbol-rate conversion, while the 1,126 user I/O let the device fan out to multiple SFP/SerDes sites. Operating at 1.2 V core keeps dynamic power acceptable for densely populated chassis.
Recommended
Software-Defined Radio (SDR) Platforms
Software-defined radio designs benefit from the EP2S130F1508C4RB's large multiplier density (up to 36 DSP blocks), flexible TriMatrix memory for sample buffering, and support for high-speed external memory that holds waveform tables and channelization coefficients. The 1508-ball FC-FBGA footprint is well suited to wide IF/RF front-end buses, and the Stratix II PLL network synthesizes the multiple clocks needed by digital down-conversion chains. The -C4 commercial speed grade is typically adequate for sample rates into the hundreds of MHz in well-pipelined designs.
Recommended
Image and Video Processing Pipelines
Image and video processing systems need both wide pixel buses and high on-chip throughput. The EP2S130F1508C4RB's 1,126 user I/O accepts multi-channel LVDS camera-link or HDMI-style pixel streams, and its 6,747,840 embedded memory bits hold line buffers and look-up tables for color-space conversion, filtering, and motion estimation. The DSP blocks accelerate convolution and DCT operations that would otherwise be the bottleneck in software pipelines. Operating at 1.2 V core, the device dissipates reasonable power even when many ALMs run in parallel.
Recommended
Military and Aerospace Signal Processing
Although the EP2S130F1508C4RB itself is commercial-temperature (0C to +85C), its 132,540-logic-element Stratix II architecture has been widely deployed in military and aerospace signal-processing programs where design heritage is more important than the latest process node. The device's robust TriMatrix memory and DSP pipeline support radar, EW, and SIGINT workloads; for extended-temperature deployments, designers typically move to the industrial-temperature EP2S130F1508I4 family on the same 1508-FBGA footprint.
Recommended
Recommended Products Summary
Engineering reference data for EP2S130F1508C4RB β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2S130F1508C4N | EP2S130F1508C4 | EP2S130F1508C3N | EP2S130F1508C3 |
|---|---|---|---|---|---|
| Package | 1508-ball FC-FBGA | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same | 1508-ball FC-FBGA - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 |
| Embedded Memory Bits | 6,747,840 | 6,747,840 | 6,747,840 | 6,747,840 | 6,747,840 |
| User I/O | 1,126 | 1,126 | 1,126 | 1,126 | 1,126 |
| Speed Grade | -C4 (commercial) | -C4 (commercial) | -C4 (commercial) | -C3 (commercial) | -C3 (commercial) |
| Packaging Form | Tape & Reel | Tray | Tray | Tray | Tray |
Key Differentiators
- Tape-and-reel packaging on the highest-density Stratix II silicon (vs EP2S130F1508C4)
- RoHS lead-free vs legacy leaded finish (vs EP2S130F1508C4N)
- Maximum commercial speed grade in the family (vs EP2S130F1508C3N)
Design Notes
The Stratix II EP2S130 requires a clean 1.2 V core rail capable of delivering several amps under dynamic load, plus separate analog PLL supplies (typically 2.5 V and 1.2 V) and dedicated configuration-bank VCCIO rails. Use a star-ground topology with ferrite beads between the 1.2 V core and the PLL analog supply, and place low-ESR ceramic decoupling (10 uF bulk plus 0.1 uF and 0.01 uF high-frequency) within 5 mm of every supply pin. Power-rail sequencing must bring the 1.2 V core up before or simultaneously with the PLL supplies to avoid latch-up.
The 1508-ball FC-FBGA package requires a multi-layer PCB (typically 12+ layers) with microvia stacks to escape the ball grid. Use the manufacturer's BGA ball-map file to plan layer transitions; pair each user-I/O ball with a controlled-impedance escape (50 ohm SE or 100 ohm diff) routed on inner stripline layers to keep the top side free for decoupling and series-termination components. Signal-integrity simulation of the breakout region is strongly recommended above 250 MHz toggling rates.
The Stratix II is SRAM-based, so the EP2S130F1508C4RB loses its configuration when power is removed and requires an external configuration device (EPCS family) or JTAG download on every power-up. Do not omit the configuration EEPROM and the MSEL[2:0] strap resistors; incorrect MSEL settings leave the device unable to configure. Also note that because the part is in the Altera/Intel EOL pipeline, design teams should plan a Stratix IV / Cyclone 10 migration path instead of treating the EP2S130 as a long-term production part.
Compliance Information
Lead-free status not stated in the Verified Web Data. The 'N' suffix variants (e.g. EP2S130F1508C4N) are documented by Altera/Intel as RoHS lead-free; the 'RB' non-N suffix on EP2S130F1508C4RB suggests legacy termination but is not explicitly confirmed by the provided data. Confirm with the manufacturer's product environmental compliance documentation before specifying for RoHS-regulated markets.
