EP2S130F1508I4RB - Stratix II FPGA, 132K LEs, 1508-FCBGA | Intel
MPN: EP2S130F1508I4RB ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 100 | $1590 | $159,000.00 |
| 500 | $1480 | $740,000.00 |
| 1,000 | $1395 | $1,395,000.00 |
EP2S130F1508I4RB Overview
An FPGA is a programmable logic device that engineers configure after manufacturing to implement arbitrary digital circuits, replacing fixed-function ASICs while providing faster time-to-market, in-system re-programmability, and integrated hard IP blocks such as transceivers, memory controllers, and DSP blocks. The Stratix II sits in the high-end of the Altera/Intel FPGA portfolio, between the Cyclone II cost-optimized family and the Stratix III mid-range, and is commonly used in telecom line cards, military signal processing, and ASIC prototyping.
Key features include 132,540 equivalent logic elements (LEs), 6,747,840 embedded RAM bits organized in M512/M4K/M-RAM blocks, 1,126 user I/O pins with support for multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X), 12 dedicated clock pins, up to 1 Gbps LVDS performance, and embedded multiplier blocks for DSP. The 1508-FCBGA package uses Intel's flip-chip BGA technology for low-inductance power distribution and high pin count at modest board area (40 mm x 40 mm typ.).
The Stratix II architecture introduces the ALM (8-input fracturable look-up table) which can be split into two independent 4-input LUTs, increasing effective logic utilization versus older 4-input LUT architectures. Each ALM also contains two dedicated adders and registers, enabling high-speed arithmetic paths without consuming general routing. TriMatrix memory provides three block sizes (M512, M4K, M-RAM) so that small FIFOs and large buffers share the same fabric with predictable timing.
Typical applications include high-speed digital signal processing, ASIC prototyping, telecom line-card packet processing, military radar and signal intelligence, broadcast video processing, and high-throughput data-acquisition front-ends. The device is well matched to designs that need hundreds of DSP multipliers and megabits of on-chip buffering on a single die.
When designing the PCB, allocate a continuous GND reference under the BGA, use at least 8 PCB layers with dedicated VCCINT/VCCIO planes, and decouple every 6-10 balls with 100 nF X7R capacitors plus bulk tantalum or polymer capacitors near the package. Configuration can be loaded via fast passive parallel (FPP), passive serial (PS), or JTAG, and the EP2S130 supports remote upgrade through the dedicated AS/PS configuration flash port.
Drop-in alternatives for EP2S130F1508I4RB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2S130F1508I4RB (same form factor and footprint) — differing in Package, Speed Grade, Mounting Type, Operating Temperature, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2S130F1508I4N
✅ Drop-In✓ In Stock
$1390 / Unit
View Datasheet →EP2S130F1508C5RB
✅ Drop-In✓ In Stock
$2050 / Unit
View Datasheet →EP2S130F1508C4RB
✅ Drop-In✓ In Stock
$1245 / Unit
View Datasheet →EP2S130F1508C3N
✅ Drop-In✓ In Stock
$270 / Unit
View Datasheet →EP2S130F1508C5NRB
✅ Drop-In✓ In Stock
$1990 / Unit
View Datasheet →EP2S130F1508C4N
✅ Drop-In✓ In Stock
$4435.83 / Unit
View Datasheet →EP2S130F1508I4RB Maximum Ratings & Electrical Characteristics
| Family | Stratix II |
| Logic Elements (LEs) | 132,540 |
| Adaptive Logic Modules (ALMs) | 53,016 |
| Embedded Memory Bits | 6,747,840 |
| Total RAM Blocks | M512 + M4K + M-RAM (TriMatrix) |
| Embedded Multiplier 9x9 Blocks | 252 (estimated from family table) |
| User I/O Pins | 1126 |
| Package | 1508-ball FCBGA (FineLine BGA) |
| User I/O Voltage Standards | LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X |
| Process Technology | 90 nm CMOS |
| Operating Temperature Grade | Industrial (-40C to +100C Tj) |
| Configuration Modes | Fast Passive Parallel (FPP), Passive Serial (PS), JTAG, AS |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Delivery Form | Tape & Reel (suffix RB) |
EP2S130F1508I4RB 1508-ball fcbga (fineline bga) Pin Configuration Guide
Pin configuration for EP2S130F1508I4RB (1508-ball fcbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2S130F1508I4RB.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2S130F1508I4RB is suitable for 6 applications: ASIC Prototyping and Emulation, Telecom Line-Card Packet Processing, Military Radar and Signal Intelligence, High-Throughput Data Acquisition Front-End, Broadcast Video Processing and Format Conversion, Industrial Automation and Machine Vision.
ASIC Prototyping and Emulation
The EP2S130F1508I4RB's 132,540 logic elements and 6,747,840 bits of TriMatrix embedded memory make it well suited to ASIC and SoC prototyping where the entire design or a large partition must be implemented in a single FPGA for pre-silicon validation. With 1,126 user I/O pins the device can map the widest of multi-bus designs including AXI, AHB, DDR, and PCI Express interfaces without requiring external logic. Engineers typically partition an ASIC RTL across one to four EP2S130 devices using the Quartus II multi-FPGA partition flow, achieving 50-80 MHz operation versus the eventual ASIC clock rate. Compared to emulation ASICs the EP2S130 offers lower per-unit cost and full re-programmability across design iterations.
Recommended
Telecom Line-Card Packet Processing
Telecommunications line cards that handle multi-gigabit packet forwarding, classification, and queuing benefit from the EP2S130F1508I4RB's high logic density combined with its 1,126 user I/O count for multiple SFI/XAUI/SPI-4.2 interfaces. The 252 embedded 9x9 multiplier blocks accelerate hash, CRC, and policing functions used per packet, while 6.7 Mbits of on-chip buffer memory eliminate external RLDRAM lookups in many flow-through paths. The industrial temperature grade (I4) allows deployment in environmentally controlled central-office racks. Compared to network processors, the FPGA implementation achieves deterministic latency and can be field-upgraded to support new protocols such as MPLS-TP or segment routing without hardware replacement.
Recommended
Military Radar and Signal Intelligence
The EP2S130F1508I4RB is widely deployed in phased-array radar, electronic warfare, and signal-intelligence systems where hundreds of FIR filters, FFT butterflies, and pulse-compression correlators must execute in real time. The 252 hardware multipliers deliver the multiply-accumulate throughput required for 16- or 24-bit complex baseband processing at sample rates up to 250 MHz. The 1508-FCBGA package's low-inductance flip-chip interconnect minimizes ground bounce, an important consideration when dozens of LVDS channels switch simultaneously in the receive beamformer. The industrial temperature grade supports the conduction-cooled VITA-46 / VPX enclosures used in airborne and ground-mobile platforms.
Recommended
High-Throughput Data Acquisition Front-End
Scientific and medical imaging systems that digitize dozens of high-speed ADC channels (for example, 16+ channels of 14-bit 250 MSPS converters) are well served by the EP2S130F1508I4RB. Each ADC's parallel LVDS output bus can be captured in dedicated DDR input registers, and the on-chip memory buffers entire frames before they are packetized onto a 10-Gigabit Ethernet or PCIe interface. With 1,126 user I/O pins the device can ingest data from up to 24 LVDS DDR buses plus the high-speed serial links, all on a single FPGA. The industrial temperature grade supports deployment in chassis with 0-55C inlet air without derating.
Recommended
Broadcast Video Processing and Format Conversion
Broadcast studios and outside-broadcast trucks use the EP2S130F1508I4RB to implement multi-standard video format converters, color-space transformers, and frame synchronizers that must process 3G-SDI, HD-SDI, and HDMI streams simultaneously. The TriMatrix memory provides the line and frame buffers required for frame-rate conversion and de-interlacing without external SDRAM, reducing board complexity. The 1,126 user I/O count supports up to 16 simultaneous 3G-SDI inputs plus genlock, LTC, and tally GPIO in a single device. Engineers can deploy the same hardware across different broadcast standards by reconfiguring the FPGA bitstream in the field, eliminating SKU proliferation.
Recommended
Industrial Automation and Machine Vision
Factory automation controllers and machine-vision inspection systems leverage the EP2S130F1508I4RB to run real-time image processing pipelines, EtherCAT or PROFINET industrial Ethernet stacks, and motion-control loops in parallel. The 252 hardware multipliers and 6.7 Mbits of on-chip memory accelerate convolutional kernels and defect-detection algorithms on multi-megapixel camera inputs. With 1,126 user I/O pins a single device can interface to multiple Camera Link or CoaXPress cameras, encoder feedback, and digital I/O racks without external bus-expanders. The industrial temperature grade supports deployment in factory-floor enclosures where ambient temperatures can reach 70C.
Recommended
Recommended Products Summary
Engineering reference data for EP2S130F1508I4RB — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2S130F1508I4N | EP2S130F1508C5RB | EP2S130F1508C4RB | EP2S130F1508C3N |
|---|---|---|---|---|---|
| Package | 1508-FCBGA | 1508-FCBGA (same) | 1508-FCBGA (same) | 1508-FCBGA (same) | 1508-FCBGA (same) |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 |
| Embedded Memory Bits | 6,747,840 | 6,747,840 | 6,747,840 | 6,747,840 | 6,747,840 |
| User I/O Pins | 1126 | 1126 | 1126 | 1126 | 1126 |
| Speed Grade | I4 (industrial) | I4 | C5 (fastest commercial) | C4 (mid commercial) | C3 (slowest commercial) |
| Temperature Grade | Industrial (-40C to +100C Tj) | Industrial | Commercial | Commercial | Commercial |
| Delivery Form | Tape & Reel (RB) | Tray (N) | Tape & Reel (RB) | Tape & Reel (RB) | Tray (N) |
Key Differentiators
- Tape & Reel packaging for high-volume pick-and-place assembly (vs EP2S130F1508I4N)
- Industrial temperature grade for harsh environments (vs EP2S130F1508C5RB)
- Same 1508-FCBGA footprint as entire EP2S130 speed-grade family (vs EP2S130F1020I4)
Design Notes
The 1508-ball FCBGA at 1.0 mm pitch requires at least an 8-layer PCB stack-up with continuous VCCINT and VCCIO power planes directly adjacent to the BGA breakout layer. Use 0.4 mm laser-drilled micro-vias for the inner-row BGA fanout and a 4-mil trace-and-space rule on the breakout layer. Route all differential pairs (LVDS, LVPECL) with 100 ohm differential impedance and intra-pair skew below 20 ps.
The EP2S130 can draw transient currents of 10-15 A on VCCINT during simultaneous switching of large logic blocks, so a low-impedance power-delivery network is essential. Place 100 nF X7R 0402 decoupling capacitors at every group of 6-10 BGA balls plus 4.7 uF and 22 uF bulk tantalum or polymer capacitors within 1 cm of the package. Use a dedicated VCCINT buck converter with at least 30 A peak capability and remote-sense wires tied directly to the BGA-side of the plane to minimize IR drop.
Estimated: at full logic utilization (~70% toggle rate, 1.0 V VCCINT, 50 MHz fMAX) the EP2S130F1508I4RB can dissipate 6-10 W. The 1508-FCBGA theta_JA is approximately 8-12 C/W with a 1 square inch copper spreader on the top side. A heat spreader or heat sink is required for any application where the ambient exceeds 50C; otherwise the Tj could exceed the I4-grade 100C limit. The bottom of the package is a thermal pad that must be soldered to the PCB ground plane to achieve the published thermal resistance.
Do not mix the I4 (industrial) and C5/C4/C3 (commercial) speed-grade variants in the same multi-FPGA partition if the design uses absolute timing constraints across devices - the speed-grade offset will cause hold violations. Always generate the configuration bitstream with the Quartus II software version that supports the exact device variant (the latest Quartus Prime is back-compatible with Stratix II). Finally, ensure the MSL handling window is respected - the 1508-FCBGA is moisture-sensitive and any pre-bake of the reels is required after the floor-life expires.
Compliance Information
RoHS compliant per Intel/Altera product declaration. Lead-free FCBGA package. Not AEC-Q100 qualified (Stratix II family was not designed for automotive grade). REACH compliance maintained through Intel material declaration.
