EP2S130F1508C4 - 132K LE Stratix II FPGA, FCBGA-1508 | Altera / Intel
MPN: EP2S130F1508C4 β Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 100 | $1580 | $158,000.00 |
| 500 | $1430 | $715,000.00 |
| 1,000 | $1295 | $1,295,000.00 |
EP2S130F1508C4 Overview
A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor device containing an array of programmable logic blocks, interconnect, and dedicated hard-IP blocks (transceivers, memory, DSP, PLLs) that engineers can configure after manufacturing via an HDL bitstream. Within the broader taxonomy, the EP2S130 sits in the Stratix II family -> high-performance FPGA family -> programmable logic device -> integrated circuit -> semiconductor. Stratix II was the first Altera family to use an adaptive logic module (ALM) architecture, replacing the older 4-input LUT/LAB structure and improving logic utilization and timing closure for wide-function datapaths.
Key features include 53016 Configurable Logic Blocks (CLBs), 1126 maximum user I/O pins, dedicated DSP blocks for high-speed multiplication/accumulation, on-chip TriMatrix memory with multiple block sizes, up to 12 high-speed transceivers on certain die variants, and support for external memory interfaces including DDR/DDR2 SDRAM, QDR II SRAM, and RLDRAM II. The FCBGA-1508 package supports high-pin-count routing with controlled-impedance signal integrity for parallel LVDS and source-synchronous interfaces.
Typical applications include high-performance digital signal processing (radar, software-defined radio, medical imaging), ASIC prototyping, high-speed packet processing in networking line cards, military/aerospace signal processing, broadcast video processing, and high-bandwidth data acquisition systems. The combination of high logic density, embedded multipliers, and 1,126 I/O makes it well-suited to designs that previously required multiple lower-density FPGAs.
When designing with the EP2S130F1508C4, ensure PCB layout accommodates the 1 mm-pitch BGA escape routing with microvia stackups and matched-length traces for parallel memory buses. Thermal management is critical at high toggle rates - follow the Stratix II thermal design guidelines with sufficient copper area and airflow to keep junction temperature below 85 C for C4 (commercial) grade. The device requires a configuration device (EPCS or JTAG) and a clean 1.2 V core supply within the datasheet tolerance window.
This page synthesizes distributor stock, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, supporting component engineers, procurement teams, and FPGA designers during BOM selection, second-source qualification, and legacy hardware redesign.
Drop-in alternatives for EP2S130F1508C4 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2S130F1508C4 (same form factor and footprint) β differing in Package, Speed Grade, Mounting Type, Process Technology, RoHS Status.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2S130F1508C3
β Drop-Inβ In Stock
$1350 / Unit
View Datasheet βEP2S130F1508C3N
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$270 / Unit
View Datasheet βEP2S130F1508C4N
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$4435.83 / Unit
View Datasheet βEP2S130F1508I4N
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$1390 / Unit
View Datasheet βEP2S130F1508C5N
β Drop-Inβ In Stock
$1390 / Unit
View Datasheet βEP2S130F1508I4
β Drop-Inβ In Stock
$3950 / Unit
View Datasheet βEP2S130F1508C4 Maximum Ratings & Electrical Characteristics
| Family | Stratix II |
| Logic Elements (LEs) | 132540 |
| Configurable Logic Blocks (CLBs) | 53016 |
| Total Memory Bits | 6747840 |
| Maximum User I/O Pins | 1126 |
| Core Voltage | 1.2 V |
| Process Technology | 90 nm CMOS, all-layer copper SRAM |
| Maximum Internal Clock Frequency | 717 MHz |
| Package | 1508-ball FCBGA (40 x 40 mm, 1 mm pitch) |
| Mounting Type | Surface Mount |
| Operating Temperature Grade | Commercial (C4) |
| Configuration Method | Serial (EPCS) or JTAG |
EP2S130F1508C4 1508-ball fcbga (40 x 40 mm, 1 mm pitch) Pin Configuration Guide
Pin configuration for EP2S130F1508C4 (1508-ball fcbga (40 x 40 mm, 1 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2S130F1508C4.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2S130F1508C4 is suitable for 6 applications: High-Performance Digital Signal Processing, ASIC Prototyping and Emulation, High-Speed Networking and Packet Processing, Broadcast Video Processing and Imaging, Military and Aerospace Signal Processing, Test and Measurement Instrumentation.
High-Performance Digital Signal Processing
The EP2S130F1508C4 is well-suited to high-throughput DSP designs in radar, software-defined radio, and medical imaging systems. Its 252 embedded 18x18 multipliers, dedicated DSP blocks, and 6.7 Mbit TriMatrix memory allow parallel FFT, FIR filtering, and matrix operations across multiple channels. The 1,126 user I/Os stream ADC/DAC data at hundreds of MHz parallel rate. According to the Stratix II handbook, the ALM architecture delivers superior logic utilization for wide-function arithmetic datapaths, enabling more processing channels per FPGA than competitor LUT architectures at equivalent density.
Recommended
ASIC Prototyping and Emulation
With 132,540 logic elements and 6.7 Mbit of block memory, the EP2S130F1508C4 serves as an ASIC prototyping platform for designs of up to approximately 5-10 million ASIC gates. The 1,126 I/Os in FCBGA-1508 support multi-FPGA partitioning via board-level channels, and Quartus II provides prototype synthesis support. Engineers use this part for pre-silicon validation of SoC designs, hardware-software co-verification, and IP block bring-up. The C4 commercial speed grade keeps prototyping costs reasonable for non-time-critical bring-up cycles.
Recommended
High-Speed Networking and Packet Processing
The EP2S130F1508C4 supports multi-gigabit packet processing in core and edge routers, switches, and network interface cards. Its high I/O count (1,126 pins) accommodates multiple SFI/XFI interfaces, RLDRAM II or QDR II external memory for packet buffering, and dedicated SERDES blocks for backplane links. The TriMatrix memory supports parallel lookups and queue management at line rate. According to Stratix II reference designs, the device achieves full-duplex 10 Gbps throughput per SERDES channel with appropriate PHY selection.
Recommended
Broadcast Video Processing and Imaging
Broadcast video format converters, scalers, and deinterlacers leverage the EP2S130F1508C4 for real-time multi-stream HD/3G-SDI processing. Its 252 dedicated multipliers perform polyphase scaling, color-space conversion, and noise reduction in parallel. The 6.7 Mbit of embedded memory buffers multiple video frames for temporal processing, and the 1,126 I/Os handle parallel pixel buses, SDI transceivers, and DDR2 frame buffers. Commercial C4 temperature grade suits studio and headend operating environments.
Recommended
Military and Aerospace Signal Processing
Defense and aerospace programs historically qualified the EP2S130F1508C4 for SIGINT, ELINT, and electronic warfare subsystems requiring high logic density at industrial or military temperature grades. For -40 C to +100 C operation, the EP2S130F1508I4N variant is the recommended drop-in. The device processes wideband IF signals, performs channelization, and runs adaptive beamforming algorithms. According to military COTS procurement guidelines, Altera/Intel FPGAs in FCBGA packages have extensive flight heritage in radar and EW systems.
Recommended
Test and Measurement Instrumentation
High-end oscilloscopes, logic analyzers, and protocol testers use the EP2S130F1508C4 for deep memory acquisition, real-time triggering, and protocol decoding at multi-gigabit rates. The 6.7 Mbit block memory captures long pre-trigger records, the 252 multipliers perform real-time FFT and signal analysis, and the 1,126 I/Os interface to high-speed ADCs and pattern generators. According to Quartus II design examples, Stratix II parts support LPDDR, DDR2, and QDR II external memories for deep sample storage.
Recommended
Recommended Products Summary
Engineering reference data for EP2S130F1508C4 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2S130F1508C3 | EP2S130F1508C3N | EP2S130F1508C4N | EP2S130F1508I4N | EP2S130F1508C5N | EP2S130F1508I4 |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | FCBGA-1508 (40x40 mm, 1.0 mm pitch) | FCBGA-1508 (same) | FCBGA-1508 (same) | FCBGA-1508 (same) | FCBGA-1508 (same) | FCBGA-1508 (same) | FCBGA-1508 (same) |
| Logic Elements | 132540 | 132540 | 132540 | 132540 | 132540 | 132540 | 132540 |
| Speed Grade | C4 (commercial) | C3 (faster) | C3 (faster) | C4 (same) | I4 (industrial) | C5 (slowest of speed grades shown) | I4 (industrial) |
| Temperature Grade | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C | Commercial 0C to +85C | Industrial -40C to +100C |
| Total Memory Bits | 6747840 | 6747840 | 6747840 | 6747840 | 6747840 | 6747840 | 6747840 |
| Maximum User I/O | 1126 | 1126 | 1126 | 1126 | 1126 | 1126 | 1126 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Key Differentiators
- FCBGA-1508 highest I/O count variant in the EP2S130 family (vs EP2S130F1020C4N)
- C4 commercial speed grade balance of cost and performance (vs EP2S130F1508C3N)
- Last-time-buy status signals migration urgency (vs Newer Stratix IV/V families)
Design Notes
The FCBGA-1508 package at 1,126 I/O toggling at full speed can dissipate 10-20 W depending on utilization. According to the Stratix II thermal design guidelines, the F1508 package requires a minimum of 4-layer PCB with stitched ground planes beneath the die and sufficient airflow (200 LFM minimum) to keep junction temperature below 85 C for commercial C4 grade. Industrial I4 grade derates to a 100 C junction maximum. Use the Altera PowerPlay early power estimator to validate thermal margins before layout commitment.
The 1.0 mm pitch FCBGA requires microvia (laser-drilled) stackups for fanout escape routing from the inner ball array. A 4-1-4 build-up with 0.5 oz copper on signal layers and 1 oz on planes is typical for cost-effective prototyping. Matched-length routing for DDR2/QDR II memory interfaces must follow the Stratix II external memory interface guidelines, with data-to-DQS skew within plus or minus 25 ps and address/command-to-clock within plus or minus 100 ps for reliable operation.
Do not omit the configuration device - the EP2S130F1508C4 requires either an EPCS serial flash, a JTAG programmer, or a microprocessor-driven passive serial configuration scheme to load on power-up. Unconfigured I/O pins default to tri-stated with weak pull-ups; if your board relies on defined power-on states for downstream logic, add external pull-up/down resistors. Decouple VCCINT with 100 nF ceramic capacitors placed within 5 mm of every VCCINT pin pair, plus bulk 22 uF tantalum or polymer capacitors on the supply rails.
Compliance Information
RoHS, lead-free, and halogen-free status not explicitly confirmed in verified web data for the EP2S130F1508C4 (non-N suffix). The N-suffix variants (e.g. EP2S130F1508C4N, EP2S130F1508C3N) are confirmed lead-free/RoHS-compliant per Altera/Intel ordering nomenclature. AEC-Q100 is not applicable - this is an FPGA, not an automotive-grade IC. Consult the manufacturer datasheet for full compliance certifications.
