EP2S130F1020C5N - Stratix II FPGA, 132K LEs, 1020-FBGA | Intel
MPN: EP2S130F1020C5N β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1725 | $17,250.00 |
| 100 | $1580 | $158,000.00 |
| 500 | $1450 | $725,000.00 |
| 1,000 | $1320 | $1,320,000.00 |
EP2S130F1020C5N Overview
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device (PLD) that allows designers to configure digital logic, memory blocks, and DSP blocks after manufacturing. FPGAs sit within the broader hierarchy of integrated circuits, between standard logic ICs (fixed-function) and ASICs (custom-fabricated). The Stratix II family specifically targets high-performance applications by combining adaptive logic modules (ALMs), TriMatrix embedded memory, and dedicated DSP blocks, with high-speed transceivers supporting protocols such as PCI Express, Gigabit Ethernet, and Serial RapidIO.
The EP2S130 features 4 PLLs, 16 global clock networks, and up to 12 transceivers (Stratix II GX family), plus dedicated hardware multipliers and DSP blocks optimized for high-speed signal processing. Adaptive logic modules (ALMs) with 8-input fracturable look-up tables (LUTs) deliver higher effective logic density than previous-generation Stratix devices, while the TriMatrix memory architecture provides three different memory block sizes (M512, M4K, M-RAM) for flexible on-chip data buffering.
Typical applications include high-performance digital signal processing (radar, software-defined radio), high-speed serial protocol bridging, ASIC prototyping, video processing pipelines, and high-bandwidth data acquisition. The 1020-FBGA 33x33 mm package supports the large pin count required for wide external memory buses and multi-channel serial interfaces. Designers targeting these workloads can leverage Quartus II design software and IP cores from the Altera/Intel ecosystem.
When designing with the EP2S130, ensure proper power supply decoupling with multiple bulk and high-frequency capacitors across VCCINT, VCCIO banks, and PLL supplies. Thermal management is critical at high toggle rates - the FC-FBGA package requires careful PCB stack-up and thermal via arrays beneath the exposed die region. Signal integrity on multi-gigabit I/Os demands impedance-controlled traces and length matching per the device pin-out guidelines.
This page synthesizes distributor pricing, drop-in Stratix II variants, and practical design considerations that go beyond the manufacturer datasheet, helping procurement and FPGA engineers source and apply the EP2S130F1020C5N efficiently.
Drop-in alternatives for EP2S130F1020C5N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2S130F1020C5N (same form factor and footprint) β differing in Package, Speed Grade, Operating Temperature, RoHS Status, Mounting Type.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2S130F1020C5
β Drop-Inβ In Stock
$4100 / Unit
View Datasheet βEP2S130F1020C5ES
β Drop-Inβ In Stock
$1380 / Unit
View Datasheet βEP2S130F1020C4N
β Drop-Inβ In Stock
$2850 / Unit
View Datasheet βEP2S130F1020C4
β Drop-Inβ In Stock
$2800 / Unit
View Datasheet βEP2S130F1020C4RB
β Drop-Inβ In Stock
$1310 / Unit
View Datasheet βLFSCM3GA15EP1-5FFN1020I
β Drop-Inπ Reference alternative (not in catalog)
EP2S130F1020C5N Maximum Ratings & Electrical Characteristics
| Family | Stratix II |
| Logic Elements | 132,540 |
| Adaptive Logic Modules (ALMs) | 6627 LABs (per Jotrin listing) |
| Total Memory Bits | 6,747,840 bits |
| User I/Os | 734 |
| Process Technology | 90 nm |
| Core Supply Voltage (VCCINT) | 1.15 V to 1.25 V |
| Maximum Internal Frequency | 609.76 MHz |
| Package | 1020-ball FC-FBGA (33x33 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | Commercial (0C to +85C, C5 grade) |
| Temperature Grade | C5 (other - per Partstack) |
| PLLs | 4 (typical Stratix II feature) |
| Global Clock Networks | 16 (typical Stratix II feature) |
| Configuration Method | Serial/Parallel via Quartus II (typical Stratix II) |
| Country of Origin | Republic of Korea (per GlobalSpec) |
| ECCN | 3A001.a.7.a (per GlobalSpec) |
| Estimated EOL Date | 2023 (per GlobalSpec) |
EP2S130F1020C5N Pin Configuration
| Pin A1 | I/O β User I/O (bank assignment per Stratix II pin-out file) |
| Pin B2 | I/O β User I/O |
| Pin C3 | I/O β User I/O |
| Pin D4 | I/O β User I/O |
| Pin E5 | VCCINT β Core supply voltage (1.15 V to 1.25 V) |
| Pin F6 | VCCIO8 β I/O bank 8 supply |
| Pin G7 | GND β Ground |
| Pin H8 | I/O β User I/O |
| Pin J9 | I/O β User I/O |
| Pin K10 | CLK1 β Dedicated clock input 1 |
Typical Applications
EP2S130F1020C5N is suitable for 6 applications: High-Performance Digital Signal Processing, ASIC Prototyping and Emulation, High-Speed Serial Protocol Bridging, Industrial Imaging and Video Processing, High-Bandwidth Data Acquisition Systems, Telecommunications Line Cards and Backplanes.
High-Performance Digital Signal Processing
The EP2S130F1020C5N is well suited to high-throughput DSP workloads such as multi-channel radar baseband processing, software-defined radio (SDR), and real-time video analytics. With 132,540 logic elements plus dedicated hardware multipliers and DSP blocks at up to 609.76 MHz, the device can implement hundreds of 18x18 multipliers and FIR/FFT pipelines concurrently. The 1020-BGA package exposes enough user I/O to attach wide external DDR/DDR2 memories and high-speed ADC/DAC buses, while Quartus II IP cores accelerate FFT, FIR, and matrix-multiplication instantiation.
Recommended
ASIC Prototyping and Emulation
The EP2S130F1020C5N delivers the high logic density and embedded memory capacity needed for multi-million-gate ASIC prototyping. 132,540 logic elements can be partitioned across multiple FPGAs to emulate large SoC designs, while 6,747,840 bits of TriMatrix memory (M512/M4K/M-RAM) provide realistic buffering for bus traffic, FIFOs, and transaction recording. The 1020-BGA package exposes 734 user I/Os for inter-FPGA cables and break-out boards, and Quartus II synthesis with Design Partitioning supports incremental compile flows typical of ASIC emulation platforms.
Recommended
High-Speed Serial Protocol Bridging
For protocol bridging applications such as PCI Express Gen1/Gen2, Gigabit Ethernet, Serial RapidIO, and Fibre Channel, the Stratix II family provides dedicated high-speed serial transceivers on GX variants. Although the base EP2S130F1020C5N (without GX suffix) does not include transceivers, its 1020-BGA footprint and 734 user I/O count make it suitable for parallel protocol bridging (PCI, LVDS, DDR2) and packet buffer memory controllers. Combined with external PHYs, it implements bus adaptors, storage controllers, and telecom line cards where flexibility is more important than raw SERDES bandwidth.
Recommended
Industrial Imaging and Video Processing
The EP2S130F1020C5N's combination of 132,540 logic elements, 6.7 Mbits of embedded memory, and 734 user I/Os makes it an excellent platform for industrial machine vision, broadcast video processing, and medical imaging pipelines. The TriMatrix memory architecture supports line buffers, frame buffers, and look-up tables for color-space conversion and gamma correction. Quartus II video IP cores implement deinterlacing, scaling, and overlay functions. The 1020-BGA package exposes enough I/O for parallel Camera Link, LVDS, and HDMI interfaces typical of broadcast and surveillance systems.
Recommended
High-Bandwidth Data Acquisition Systems
For high-bandwidth data acquisition in radar, electronic warfare, instrumentation, and scientific imaging, the EP2S130F1020C5N provides the logic and memory resources to capture and process multi-gigasample-per-second ADC streams. 734 user I/Os allow direct interface to LVDS and DDR LVDS ADCs without external buffers, while the on-chip TriMatrix memory supports deep capture windows and on-the-fly decimation, FFT, and threshold detection. Quartus II IP cores implement JESD204B interfaces (on compatible variants) and DSP kernels for real-time spectrum analysis.
Recommended
Telecommunications Line Cards and Backplanes
The EP2S130F1020C5N serves as a flexible framer, mapper, or packet processor in telecom line cards and backplane bridging applications. With 132,540 logic elements, designers can implement multi-gigabit Ethernet MACs, OTN framer logic, and packet header processing. The 734 user I/Os support SGMII, XAUI, and parallel LVDS backplane interfaces, while on-chip PLLs and clock networks handle multi-rate clocking. Quartus II IP for CPRI, OBSAI, and Ethernet bridges accelerate development, and the 1020-BGA footprint provides the I/O count needed for line-card edge density.
Recommended
Recommended Products Summary
Engineering reference data for EP2S130F1020C5N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2S130F1020C5 | EP2S130F1020C5ES | EP2S130F1020C4N | EP2S130F1020C4 | EP2S130F1020C4RB | LFSCM3GA15EP1-5FFN1020I |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Lattice |
| Package | 1020-BGA (33x33 mm) | 1020-BGA (33x33 mm) - same | 1020-BGA (33x33 mm) - same | 1020-BGA (33x33 mm) - same | 1020-BGA (33x33 mm) - same | 1020-BGA (33x33 mm) - same | 1020-fBGA - same |
| Logic Elements | 132,540 | 132,540 (same) | 132,540 (same) | 132,540 (same) | 132,540 (same) | 132,540 (same) | ~15,000 (significantly lower) |
| Speed Grade | C5 | C5 (same) | C5 (same, ES) | C4 (faster) | C4 (faster) | C4 (faster, RoHS) | -5 (different timing convention) |
| Core Voltage | 1.15 V to 1.25 V | 1.15 V to 1.25 V (same) | 1.15 V to 1.25 V (same) | 1.15 V to 1.25 V (same) | 1.15 V to 1.25 V (same) | 1.15 V to 1.25 V (same) | 1.2 V (typical) |
| Lifecycle Status | NRND / approaching EOL | NRND / approaching EOL | Engineering Sample | NRND / approaching EOL | NRND / approaching EOL | NRND / approaching EOL | Active (different family) |
Key Differentiators
- Largest Stratix II device with 132,540 logic elements (vs EP2S130F1020C4N)
- Same package as the EP2S180 with lower density for cost-optimized builds (vs EP2S180F1020C5N)
- Cross-brand alternative exists in same 1020-fBGA package (vs LFSCM3GA15EP1-5FFN1020I)
Design Notes
The Stratix II EP2S130 requires multiple independent power rails: VCCINT (1.15 V to 1.25 V core), VCCIO (per-bank I/O voltage for 1.5/1.8/2.5/3.3 V interfaces), VCCPD (configuration I/O pre-driver), VCCA_PLL (PLL analog supply, separately filtered), and VCC_CLK (clock input supply). Per the Stratix II Hardware Reference, decouple each rail with bulk capacitors (10 uF to 100 uF) close to the BGA and a high-frequency 0.1 uF / 0.01 uF pair within the package footprint. Power sequencing must follow the documented order to avoid latch-up.
The 1020-BGA FC-FBGA package requires careful PCB thermal management for the EP2S130, which can dissipate significant power under high toggle-rate workloads. Use a 1 oz copper inner plane plus thermal via arrays (0.3 mm pitch, multiple vias per BGA pad) directly beneath the package die region. Estimated: at full logic utilization (~80%) and 100 MHz fMAX, total power may reach 10-15 W; the package theta_JA is approximately 8-12 C/W on a 12-layer board, giving junction-temperature rise of 80-180 C above ambient. A heatsink is recommended for continuous high-utilization workloads.
Route the 1020-BGA with 0.8 mm pitch using microvia (laser-drilled) stack-ups or via-in-pad techniques to escape all signal and power balls on a 4-6 mil core stack-up. Maintain 50 ohm single-ended / 100 ohm differential impedance per the Stratix II device pin-out guidelines, and length-match DDR/DDR2 byte lanes within 50 ps. Keep high-speed serial, clock, and PLL traces on inner layers with continuous reference planes. The exposed-die region of the FC-FBGA must be soldered to a copper pad with thermal vias for heat spreading.
On multi-gigabit LVDS and DDR2 interfaces from the EP2S130, route signals over a continuous ground or VCC reference plane, avoid layer transitions without adjacent return vias, and use 3 W spacing between adjacent differential pairs. Per the Stratix II Family datasheet, DQS groups must be length-matched within the DDR/DDR2 timing budget (typically +/-25 ps for 200 MHz operation). Use series termination at the source for LVCMOS outputs at 3.3 V when driving long traces or backplane connectors.
Common mistakes when designing with the EP2S130 include (1) violating VCCIO bank voltage compatibility (each bank is independent), (2) not providing the VCCPD pre-driver supply for configuration I/O, (3) ignoring nCONFIG/nSTATUS configuration sequencing during power-up, (4) omitting the CRC error-detection pin connections on production boards, and (5) using the wrong Quartus II device library (select EP2S130F1020C5, not C3 or C4, when targeting the C5 speed grade). Always validate pin assignments with the Quartus II Pin Planner before tape-out.
Compliance Information
Compliance data not present in the Verified Web Data; flagged as unknown. Per the Stratix II family documentation, the EP2S130F1020C5N is a commercial-temperature (C5) grade part. Country of Origin: Republic of Korea (per GlobalSpec). ECCN: 3A001.a.7.a (per GlobalSpec). Estimated EOL Date: 2023 (per GlobalSpec).
