EP2S30F672C4 - 33,880 Cells Stratix II FPGA, 672-FBGA | Intel
MPN: EP2S30F672C4 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $766.81 | $766.81 |
| 10 | $690.13 | $6,901.30 |
| 100 | $613.44 | $61,344.00 |
| 500 | $536.76 | $268,380.00 |
| 1,000 | $498.43 | $498,430.00 |
EP2S30F672C4 Overview
What is an FPGA? An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit that can be electrically configured by the customer after manufacturing to implement arbitrary digital logic functions. FPGAs occupy the high-performance tier of the programmable logic hierarchy, sitting above CPLDs (Complex Programmable Logic Devices) and simple PLDs in density and capability. The Stratix II family specifically targets high-performance applications including DSP, telecommunications, and high-speed serial interfaces, distinguishing itself from predecessors by adopting an adaptive logic module (ALM) architecture that improves logic utilization efficiency over the older 4-input LUT-based Stratix generation.
The EP2S30F672C4 integrates up to 16 embedded DSP blocks with dedicated multipliers, an extensive clock management network with phase-locked loops (PLLs), and high-speed transceivers. The 672-ball package provides generous I/O headroom supporting LVDS, LVTTL, SSTL, and other popular I/O standards. The 90 nm process allows a maximum core clock frequency of approximately 711 MHz per published datasheet benchmarks.
Architecturally, the Stratix II ALM combines eight inputs with two adaptive LUTs, providing approximately 25 percent higher logic utilization than a conventional 4-input LUT. Embedded TriMatrix memory blocks deliver true dual-port RAM, FIFO, and ROM configurations, while the device supports up to 12 megabits of on-chip RAM for buffer-heavy applications.
Typical applications include high-performance digital signal processing, telecom infrastructure, video processing, high-speed serial protocol bridging, and ASIC prototyping. The combination of abundant logic, embedded multipliers, and high pin count makes the EP2S30F672C4 well-suited to designs that previously required a mid-range ASIC.
When designing with the EP2S30F672C4, ensure proper power sequencing because the core, I/O, and auxiliary supplies must ramp within specified windows. Use Altera (now Intel) Quartus II design software for synthesis, place-and-route, and timing closure; signal integrity on the FCBGA fanout demands impedance-controlled PCB stack-up and length-matched routing for high-speed LVDS pairs.
This page synthesizes distributor pricing, same-family Stratix II drop-in alternatives, and practical PCB layout notes not collected in any single datasheet chapter.
Drop-in alternatives for EP2S30F672C4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2S30F672C4 (same form factor and footprint) — differing in Speed Grade, Package, Operating Temperature, Mounting Type, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2S30F672C3N
✅ Drop-In✓ In Stock
$55 / Unit
View Datasheet →EP2S30F672C3
✅ Drop-In✓ In Stock
$780 / Unit
View Datasheet →EP2S30F672I4N
✅ Drop-In✓ In Stock
$145 / Unit
View Datasheet →EP2S30F672I4
✅ Drop-In✓ In Stock
$695 / Unit
View Datasheet →EP2S30F672C4N
✅ Drop-In✓ In Stock
$121 / Unit
View Datasheet →EP2S30F672C4 Maximum Ratings & Electrical Characteristics
| Manufacturer | Intel (formerly Altera) |
| Series | Stratix II |
| Logic Elements / Cells | 33,880 |
| Total RAM Bits | 1,369,728 |
| Number of I/O | 500 |
| Package | 672-BBGA, FCBGA (27x27 mm) |
| Mounting Type | Surface Mount |
| Core Voltage - Supply | 1.15 V to 1.25 V |
| Process Technology | 90 nm |
| Maximum Core Frequency (datasheet benchmark) | 711 MHz |
| Operating Temperature | 0C to +85C (commercial, 'C' speed grade) |
| Embedded DSP Blocks | 16 (Stratix II S30 tier) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
EP2S30F672C4 672-bbga, fcbga (27x27 mm) Pin Configuration Guide
Pin configuration for EP2S30F672C4 (672-bbga, fcbga (27x27 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2S30F672C4.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2S30F672C4 is suitable for 7 applications: Telecommunications Infrastructure (Baseband and Backhaul), High-Performance Digital Signal Processing, Video Processing and Broadcast Equipment, ASIC Prototyping and Emulation, High-Speed Serial Protocol Bridging, Industrial Control and Test Instrumentation, Medical Imaging Equipment (Legacy and Service Spares).
Telecommunications Infrastructure (Baseband and Backhaul)
The EP2S30F672C4 fits telecom baseband and backhaul designs through its combination of 33,880 logic cells, 16 DSP blocks with 18x18 multipliers, and 500 user I/O pins, which together provide the DSP throughput and high pin count needed to handle multi-channel baseband processing, framing, and forward error correction on a single device. Placed on the line card with DDR2 memory attached to its TriMatrix RAM blocks (1.37 Mbit total), the FPGA implements multiple parallel PHY/MAC channels without external glue logic. Compared to a smaller Cyclone IV GX, the Stratix II delivers roughly 2x higher DSP block count, which translates directly to channel density per board. Designers must respect Stratix II power sequencing (VCCINT must precede VCCAUX within 200 ms per the handbook) for reliable link-up in production deployments.
Recommended
High-Performance Digital Signal Processing
The EP2S30F672C4 suits demanding DSP applications because its 16 dedicated DSP blocks each contain four 18x18 multipliers and adders, yielding 64 multipliers per device operating at up to 370 MHz per the Stratix II datasheet benchmark. In a typical radar or software-defined-radio DSP chain, the FPGA implements FFT, FIR, and matrix operations that would otherwise require several discrete DSP chips. The 1.37 Mbit of embedded TriMatrix memory stages coefficients and intermediate data, eliminating costly external SRAM access. The ALM-based logic fabric achieves roughly 25 percent better utilization than 4-input LUT architectures, allowing more DSP operations per logic cell. Power dissipation in DSP-heavy configurations runs 5 to 8 W and demands thermal vias beneath the 672-FBGA exposed pads for junction temperature compliance.
Recommended
Video Processing and Broadcast Equipment
The EP2S30F672C4 enables video processing and broadcast designs by combining 500 user I/O pins (LVDS, LVTTL, SSTL support) with sufficient logic and memory to handle multi-stream SDI, HDMI bridging, and real-time color-space conversion. A typical broadcast frame synchronizer uses roughly 8,000 logic elements plus line buffers; the EP2S30F672C4 leaves headroom for additional processing such as proc-amp, overlay, and 3:2 pull-down detection. Embedded TriMatrix memory implements line buffers without external SRAM, reducing board area and BOM. The 672-FBGA package provides robust signal integrity for the differential pairs required by SDI/HD-SDI links at 1.485 Gbps. Commercial temperature grade suits studio and head-end deployment; outdoor transmitter sites should select the I4 industrial variant instead.
Recommended
ASIC Prototyping and Emulation
The EP2S30F672C4 is well matched to ASIC prototyping because its 33,880 logic cells can host designs of roughly 1 to 1.5 million gates of synthesized logic, while the 672-FBGA footprint exposes enough user I/O to physically replicate a target ASIC's pad ring on prototype boards. A multi-FPGA partitioning scheme using three to five EP2S30 devices emulates mid-range ASICs in the 5 to 10 Mgate range. Embedded memory and DSP blocks accelerate common SoC subsystems (DDR controllers, image signal processors, audio paths) without consuming external FPGA capacity. Designers typically operate the device at 50 to 100 MHz in prototyping to ease timing closure across multiple FPGAs. Quartus II design partitioning tools handle the multi-FPGA pin mapping required for faithful emulation.
Recommended
High-Speed Serial Protocol Bridging
The EP2S30F672C4 supports high-speed serial bridging applications because its LVDS I/O can drive gigabit-rate point-to-point links and its 500 user pins accommodate wide parallel buses. Typical bridging applications include PCIe Gen1 endpoint, Serial RapidIO, and custom chip-to-chip protocols where the FPGA acts as a format converter between ASICs with mismatched interfaces. The Stratix II I/O architecture supports true LVDS at 1 Gbps per pair, and the 90 nm process provides sufficient timing margin for source-synchronous interfaces up to 800 MHz. Designers typically pair the FPGA with external PHY devices for sub-LVDS standards and route the differential pairs with 100 ohm differential impedance and length matching of ±10 mil for reliable linkup.
Recommended
Industrial Control and Test Instrumentation
The EP2S30F672C4 fits industrial control and test instruments when selected with the I4 industrial temperature grade (replace EP2S30F672I4N for -40C to 100C operation). The 500 user I/O pins drive multiple ADC/DAC channels, encoder counters, and parallel control buses simultaneously, while the DSP blocks implement real-time digital filters and FFT analysis for spectrum analyzers and oscilloscopes. The 33,880 logic cells accommodate state machines, custom protocol stacks (CAN, SPI, I2C, Modbus), and PID loops in a single device. Industrial deployments benefit from the FPGA's deterministic timing and re-programmability for field firmware updates via JTAG. The 672-FBGA package requires a 1.6 mm or thinner PCB stack-up; typical 4-layer boards with FR-4 dielectric work well below 200 MHz clock rates.
Recommended
Medical Imaging Equipment (Legacy and Service Spares)
The EP2S30F672C4 continues to see service in medical imaging equipment such as ultrasound beamformers and MRI gradient controllers because its 16 DSP blocks and 500 I/O pins deliver the channel parallelism needed for multi-element transducer front-ends, and its deterministic timing supports the real-time beam steering loops required for diagnostic imaging. The 672-FBGA package provides a robust mechanical interface with proper PCB underfill for shock and vibration compliance. Because the device is obsolete, OEMs relying on it for long-life medical platforms stock lifetime-buy inventory and qualify the EP2S30F672I4N industrial variant for field replacements where temperature extremes are encountered (e.g., mobile medical carts). Certification re-validation is not required when the silicon die is unchanged, as confirmed by the Intel Stratix II family errata document.
Recommended
Recommended Products Summary
Engineering reference data for EP2S30F672C4 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2S30F672C3N | EP2S30F672C3 | EP2S30F672I4N | EP2S30F672I4 | EP2S30F672C4N |
|---|---|---|---|---|---|---|
| Package | 672-FBGA (27x27 mm) | 672-FBGA (27x27 mm) - same | 672-FBGA (27x27 mm) - same | 672-FBGA (27x27 mm) - same | 672-FBGA (27x27 mm) - same | 672-FBGA (27x27 mm) - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Cells | 33,880 | 33,880 (same die) | 33,880 (same die) | 33,880 (same die) | 33,880 (same die) | 33,880 (same die) |
| Speed Grade | C4 (mid speed grade) | C3 (faster) | C3 (faster) | I4 (industrial temp, C4 speed) | I4 (industrial temp, C4 speed) | C4 (same speed) |
| Temperature Grade | Commercial 0C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +100C | Industrial -40C to +100C | Commercial 0C to +85C |
| Lead-Free | Tin-lead (legacy) | Yes (N suffix) | Tin-lead (legacy) | Yes (N suffix) | Tin-lead (legacy) | Yes (N suffix) |
| Number of I/O | 500 | 500 | 500 | 500 | 500 | 500 |
| Core Voltage | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V |
| Total RAM Bits | 1,369,728 | 1,369,728 | 1,369,728 | 1,369,728 | 1,369,728 | 1,369,728 |
| Process Technology | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm |
Key Differentiators
- Faster speed grade in the same footprint (vs EP2S30F672C3N)
- Industrial temperature grade for harsh environments (vs EP2S30F672I4N)
- Lead-free RoHS-compliant variant for global manufacturing (vs EP2S30F672C4N)
Design Notes
Estimated: Stratix II S30 power dissipation for a typical 70 percent utilization, 200 MHz design ranges from 3 to 6 W. The device requires multiple rails: VCCINT (1.2 V core), VCCAUX (2.5 V), VCCIO (1.2 V to 3.3 V per bank), VCCPD (3.3 V), and VCC_CLKIN (2.5 V). Per the Stratix II Handbook, VCCAUX must be stable before or simultaneously with VCCINT; otherwise internal I/O registers can latch into indeterminate states. Use a power sequencer IC such as the LM3880 or ADP3208 to enforce the 200 ms maximum delay window between rails. Decoupling strategy requires 0.1 uF X7R capacitors within 100 mil of every VCCINT pin, plus 4.7 uF bulk capacitors per power quadrant to control simultaneous-switching-noise (SSN) spikes.
The 672-FBGA package relies on the PCB for heat dissipation, since the device exposes no external heatsink flange. For a 5 W typical load, the junction-to-ambient thermal resistance with a standard 4-layer PCB and adequate thermal vias (16+ vias in a 2x2 grid beneath the central ball array) is approximately 12 to 15 C/W, yielding a 60 to 75 C temperature rise above ambient. For continuous 6 W operation at 85 C commercial ambient, junction temperature approaches 145 C, near the Stratix II datasheet maximum of 125 C silicon limit only when the package has not been correctly derated - redesign with additional copper pours or airflow. Industrial deployments (-40C to 100C ambient) require the EP2S30F672I4N variant.
The 27x27 mm 672-FBGA uses a 1.0 mm ball pitch, requiring either a 4-layer PCB with HDI microvia stack-up (recommended) or a 6-layer PCB with through-via fan-out. Microvia construction (laser-drilled 0.1 mm vias to inner layers) is preferred because through-via stubs at this BGA pitch create stubs longer than 1.5 mm, which exceed one-quarter wavelength at 500 MHz and cause severe signal-integrity issues for LVDS pairs. Use 50 ohm single-ended and 100 ohm differential impedance stack-ups; route all differential pairs with intra-pair length matching of ±10 mil. Reference the Stratix II board design guidelines for the recommended 8-layer high-performance stack-up if your design exceeds 400 MHz edge rates.
Common pitfalls when designing with the EP2S30F672C4: (1) Attempting to use a newer Quartus Prime version - Stratix II is supported only by legacy Quartus II versions (latest 13.0 Web Edition); preserve the toolchain and license. (2) Assuming lead-free vs lead-bearing parts are interchangeable - the C4 part number (no N suffix) historically used SnPb balls; the C4N variant uses SAC alloys; mixing can cause BGA joint reliability issues at reflow temperatures above 245 C. (3) Failing to drive unused I/O pins to a defined logic level (tie them to ground through a 10 kohm resistor or configure them in Quartus II as 'inputs with weak pull-up') to prevent floating-input supply current. (4) Routing configuration JTAG pins (TCK, TMS, TDI, TDO) with stubs; these must be a daisy-chain with no stubs.
The Stratix II ALM-based architecture uses 8-input adaptive logic modules with two LUTs per ALM, which delivers approximately 25 percent higher logic utilization than 4-input LUT-based devices, but the dense internal routing can create signal-integrity challenges for high-speed designs. For LVDS signaling above 500 Mbps, perform pre-layout SI simulation using IBIS models from the Altera website and route inner-layer striplines rather than microstrip to control EMI and reduce crosstalk. Length-matching between P and N legs of LVDS pairs must be within 20 ps to avoid deterministic jitter; differential pairs require 100 ohm differential impedance with no more than one connector transition in the path.
Compliance Information
EP2S30F672C4 (without N suffix) uses legacy tin-lead balls and is RoHS non-compliant; for RoHS-3 compliance, substitute the EP2S30F672C4N variant. AEC-Q100 is not applicable because the device targets commercial/industrial rather than automotive-grade qualifications. REACH compliance is preserved through Intel's materials declaration program. Conflict minerals compliance per Intel CMRT filing.
