EP2S90F1508I4 - Stratix II FPGA, 90K LE, 1508-FBGA | Intel/Altera
MPN: EP2S90F1508I4 β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5046.98 | $5,046.98 |
| 10 | $4795.5 | $47,955.00 |
| 100 | $4289.5 | $428,950.00 |
| 500 | $3879.2 | $1,939,600.00 |
| 1,000 | $3525.1 | $3,525,100.00 |
EP2S90F1508I4 Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs sit at the top of the programmable-logic hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. Stratix II is positioned in Intel's (formerly Altera's) high-performance, transceiver-rich tier for ASIC prototyping, DSP pipelines, and parallel processing.
Key differentiating features include 12 dedicated DSP blocks capable of 300 MHz operation, embedded TriMatrix memory up to 4.5 Mbits with true dual-port and FIFO modes, up to 36 embedded multipliers (18x18), and support for multiple I/O standards including LVDS, LVPECL, SSTL, and HSTL. The device also includes dedicated circuitry for source-synchronous interfaces such as DDR2 SDRAM controllers and SPI-4.2 phases.
Technically, the EP2S90F1508I4 is fabricated in a 90 nm process, uses a 1.2V core with multi-voltage I/O support, and integrates 8 PLLs and 16 global clock networks. The 1508-ball FineLine BGA package provides high signal integrity and thermal performance for high-density designs; an exposed die on the bottom enables direct heatsink attachment for sustained high-utilization workloads.
Typical applications include ASIC prototyping, high-speed DSP (radar, software-defined radio, video processing), communications infrastructure (baseband, line cards), high-performance computing accelerators, and test & measurement equipment. It is also commonly used in storage area network controllers and military/aerospace signal processing.
When designing with the EP2S90F1508I4, allocate a minimum of six PCB layers with continuous ground and power planes to control SSO noise and maintain signal integrity across the 902 user I/Os. Use Altera Quartus II design software (later updated to Intel Quartus Prime) for synthesis, place-and-route, and timing closure.
This page synthesizes distributor pricing, same-package drop-in alternatives (EP2S90F1508C5/C5N/C4/C4N/C3/C3N and larger EP2S180F1508 variants), and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for EP2S90F1508I4 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2S90F1508I4 (same form factor and footprint) β differing in Package, Configuration Method, Speed Grade, Process Technology, Logic Elements.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2S90F1508C5N
β Drop-Inβ In Stock
$3780 / Unit
View Datasheet βEP2S90F1508C5
β Drop-Inβ In Stock
$2590 / Unit
View Datasheet βEP2S90F1508C4N
β Drop-Inβ In Stock
$1390 / Unit
View Datasheet βEP2S90F1508C4
β Drop-Inβ In Stock
$1320 / Unit
View Datasheet βEP2S90F1508C3
β Drop-Inβ In Stock
$3719.39 / Unit
View Datasheet βEP2S130F1508I4
β Drop-Inβ In Stock
$3950 / Unit
View Datasheet βEP2S180F1508I4
β Drop-Inβ In Stock
$2050 / Unit
View Datasheet βEP2S90F1508I4 Maximum Ratings & Electrical Characteristics
| Family | Stratix II |
| Logic Elements | 90,960 |
| Adaptive Logic Modules (ALMs) | 45,960 |
| Total Embedded Memory Bits | 4,520,488 (~4.5 Mbits) |
| Embedded Multipliers (18x18) | 36 |
| DSP Blocks | 12 |
| User I/O Pins | 902 |
| Package | 1508-BBGA, FCBGA (FineLine BGA) |
| Operating Temperature | -40C to +100C (Industrial, I4 grade) |
| Core Voltage | 1.2 V (typical) |
| Process Technology | 90 nm CMOS |
| PLLs | 8 |
| Global Clock Networks | 16 |
| Configuration Method | Passive Serial, Fast Passive Parallel, JTAG |
| Mounting Type | Surface Mount (BGA) |
| MSL Level | 3 (per JEDEC J-STD-020) |
EP2S90F1508I4 1508-bbga, fcbga (fineline bga) Pin Configuration Guide
Pin configuration for EP2S90F1508I4 (1508-bbga, fcbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2S90F1508I4.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2S90F1508I4 is suitable for 6 applications: ASIC Prototyping and Emulation, High-Speed DSP and Signal Processing, Communications Infrastructure, Test and Measurement Equipment, Storage Area Network Controllers, Military and Aerospace Signal Processing.
ASIC Prototyping and Emulation
The EP2S90F1508I4 with 90,960 logic elements and 902 user I/Os in a 1508-ball FineLine BGA package is ideal for ASIC prototyping and in-circuit emulation. Its 36 18x18 multipliers and 4.5 Mbits of embedded TriMatrix memory handle large gate-level netlists that approach 1-2 million ASIC gates. Quartus II place-and-route delivers timing-accurate emulation at speeds up to 100 MHz across most designs. Use the device to validate register-transfer logic, peripheral interfaces (DDR2, SPI-4.2), and DSP pipelines before taping out.
Recommended
High-Speed DSP and Signal Processing
The EP2S90F1508I4's 12 dedicated DSP blocks operating at 300 MHz and 36 embedded 18x18 multipliers make it well-suited for high-throughput DSP pipelines such as radar processing, software-defined radio baseband, and real-time video codecs. The 4.5 Mbits of true dual-port TriMatrix memory provides low-latency sample buffering between DSP stages. Compared to discrete DSP processor solutions, this FPGA achieves 5-10x higher throughput per watt on parallel filter and FFT workloads.
Recommended
Communications Infrastructure
The EP2S90F1508I4 is widely deployed in communications infrastructure - line cards, base station baseband, and cross-connect switches - because it supports LVDS, LVPECL, SSTL, and HSTL I/O standards required by network PHYs. With 902 user I/Os and source-synchronous interface circuitry, it implements SPI-4.2, SFI-4, and custom multi-gigabit serial protocols at low risk. The 8 PLLs and 16 global clock networks simplify multi-rate clocking for SONET/SDH and Ethernet aggregation designs.
Recommended
Test and Measurement Equipment
The EP2S90F1508I4 serves as the processing engine in test and measurement instruments - logic analyzers, protocol analyzers, and arbitrary waveform generators - because it combines high logic density with deterministic timing and 902 flexible I/Os. Its source-synchronous interface blocks capture data at rates up to 1 Gbps per differential pair, supporting protocol decoding for DDR2, PCI Express Gen1, and Serial RapidIO. The industrial -40C to +100C temperature range enables deployment in outdoor and laboratory environments.
Recommended
Storage Area Network Controllers
The EP2S90F1508I4's combination of 36 multipliers, 4.5 Mbits embedded memory, and 902 user I/Os makes it a strong fit for storage controllers implementing RAID acceleration, iSCSI offload, and Fibre Channel framing. Its source-synchronous interface blocks handle 2-4 Gbps Fibre Channel links directly, while the embedded memory buffers large frames before DMA to the host CPU. Compared to ASIC-based storage controllers, the FPGA version supports rapid firmware updates and customer-specific protocol customization.
Recommended
Military and Aerospace Signal Processing
The EP2S90F1508I4 in its industrial I4 temperature grade (-40C to +100C) is used in military and aerospace applications such as electronic warfare, radar front-end processing, and avionics databus interfaces. Its 1508-ball FineLine BGA package provides excellent thermal and vibration performance for ruggedized enclosures. Designers typically pair it with MIL-STD-1553 or ARINC 429 protocol cores available in the Altera IP catalog to build complete avionics interfaces.
Recommended
Recommended Products Summary
Engineering reference data for EP2S90F1508I4 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2S90F1508C5N | EP2S130F1508I4 | EP2S180F1508I4 |
|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel |
| Package | 1508-BBGA, FCBGA | 1508-BBGA, FCBGA - same | 1508-BBGA, FCBGA - same | 1508-BBGA, FCBGA - same |
| Logic Elements | 90,960 | 90,960 | 132,540 | 179,400 |
| Embedded Memory (bits) | 4,520,488 | 4,520,488 | 6,747,840 | 9,383,040 |
| 18x18 Multipliers | 36 | 36 | 48 | 96 |
| User I/O Pins | 902 | 902 | 922 | 902 |
| Operating Temperature | -40C to +100C (Industrial, I4) | 0C to +85C (Commercial, C5) | -40C to +100C (Industrial, I4) | -40C to +100C (Industrial, I4) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Highest logic density in EP2S90 family at F1508 package (vs EP2S60F1508 family variants)
- Pin-compatible upgrade path to EP2S130 and EP2S180 (vs EP2S130F1508I4 and EP2S180F1508I4)
- Industrial temperature grade I4 (-40C to +100C) (vs EP2S90F1508C5N)
Design Notes
The 1508-ball FineLine BGA requires a minimum 6-layer PCB stackup with continuous ground and power planes to control simultaneous switching output (SSO) noise across the 902 user I/Os. Use 0.5 mm pitch escape routing in the top two signal layers and stitch vias around the BGA perimeter every 1-2 mm. Per JEDEC JESD51, the junction-to-ambient thermal resistance of the F1508 package is in the range of 5-10 C/W with proper thermal via array on the bottom pads.
Estimated: at 50 percent logic utilization and 100 MHz operation, the EP2S90F1508I4 typically dissipates 8-12 W. With a thermal resistance theta_JA of approximately 5-10 C/W and an industrial 100C max ambient, the junction temperature reaches 60-90C above ambient - well within the 125C max junction. For sustained high-utilization workloads (>85 percent), attach a heatsink via thermal interface material or use forced-air cooling. The exposed die on the bottom of the package simplifies heatsink mounting.
Do not confuse EP2S90F1508I4 (industrial grade) with EP2S90F1508C5N (commercial grade) - they share the same die but differ in temperature range. The 'N' suffix indicates RoHS compliance; parts without 'N' may be Pb-bearing and unacceptable for RoHS markets. When migrating to EP2S130F1508I4 or EP2S180F1508I4, regenerate the Quartus II bitstream and re-verify timing constraints - the JTAG ID and IDCODE differ between family members.
Route LVDS pairs with 100 ohm differential impedance and within 150 mils of each other to maintain signal integrity at speeds up to 1 Gbps. Place source-synchronous clock signals 2x trace width away from data lines to minimize crosstalk. Use Altera's Quartus II SignalTap II logic analyzer and TimeQuest timing analyzer to validate setup/hold margins on DDR2 and SPI-4.2 interfaces.
Compliance Information
Compliance status not confirmed in provided data; the 'N' suffix variants (e.g., EP2S90F1508C5N) are typically RoHS/lead-free, while non-N variants may be Pb-bearing. AEC-Q100 is not applicable to FPGAs (different qualification standard).
