EP2SGX30FG780C7 - Stratix II GX 30K LEs FPGA with 4.6G Transceivers | Altera
MPN: EP2SGX30FG780C7 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 100 | $198 | $19,800.00 |
| 500 | $165 | $82,500.00 |
| 1,000 | $132 | $132,000.00 |
EP2SGX30FG780C7 Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, embedded memory, and hard IP such as transceivers, multipliers, and clock management circuitry. FPGAs occupy a position in the system hierarchy above general-purpose microcontrollers but below ASICs in non-recurring engineering cost, providing hardware-timed parallelism and reconfigurability. The Stratix II GX family specifically targets applications that combine parallel logic with multi-gigabit serial links, positioning it within the power-management and signal-chain ecosystem as a glue-and-processing layer.
Key features include 33,880 logic elements, 192 (18x18) multipliers, 2.1 Mbits of TriMatrix embedded memory arranged as M512/M4K/M-RAM blocks, 364 user I/O pins, 4 multi-gigabit transceivers supporting up to 6.375 Gbps with support for PCI Express, Serial RapidIO, XAUI, and CEI-6G protocols, and dedicated clock management PLLs. The device operates from a 0.85 V core supply with separate transceiver, I/O, and auxiliary supplies.
The EP2SGX30FG780C7 is fabricated on a 90 nm process with a copper interconnect stack and uses Altera's Adaptive Logic Module (ALM) architecture, which provides 8-input fracturable look-up tables delivering improved logic packing efficiency versus the older ALM-free Stratix ALUT architecture. Hard PCIe and CDR blocks allow simultaneous multi-protocol serial connectivity without consuming soft logic.
Typical applications include PCI Express endpoint and root-complex designs, Serial RapidIO bridges for wireless baseband cards, XAUI-based 10G Ethernet aggregation, SD/HD-SDI broadcast video processing, and high-speed data acquisition backplanes. The 780-pin BGA package provides ample signal density for fan-out without requiring complex stacked-die solutions.
When designing with the EP2SGX30FG780C7, plan signal integrity carefully - the 6.375 Gbps transceivers demand controlled-impedance differential routing with length matching inside ~5 mils and a 100-ohm differential reference. Use Altera's Quartus II design suite (legacy, Stratix II supported up to v13.x) for synthesis, place-and-route, and timing closure.
This page consolidates distributor availability, drop-in FG780 alternatives within the Stratix II GX family, and Stratix II GX transceiver design notes not typically present in a single datasheet excerpt.
Drop-in alternatives for EP2SGX30FG780C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX30FG780C7 (same form factor and footprint) — differing in Package, Speed Grade, Logic Elements, Core Voltage, Embedded Memory.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2SGX30DF780C7
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →EP2SGX30DF780C7N
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View Datasheet →EP2SGX30CF780C7
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$171 / Unit
View Datasheet →EP2SGX30CF780C6
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$165 / Unit
View Datasheet →EP2SGX30CF780C5
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$248 / Unit
View Datasheet →EP2SGX30CF780C4
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$138 / Unit
View Datasheet →EP2SGX30CF780C3
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$175.5 / Unit
View Datasheet →EP2SGX30FG780C7 Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Logic Elements | 33,880 |
| Adaptive Logic Modules (ALMs) | 13,224 |
| Embedded Memory | 2.1 Mbits (TriMatrix) |
| Embedded Multipliers (18x18) | 192 |
| Multi-Gigabit Transceivers | 4 (up to 6.375 Gbps) |
| User I/O Pins | 364 |
| Package | 780-pin FineLine BGA (FG780) |
| Speed Grade | C7 (commercial) |
| Core Voltage | 0.85 V (typical, see datasheet) |
| Process Node | 90 nm |
| Operating Temperature | 0C to +85C (commercial) |
| Mounting Type | Surface Mount (BGA) |
| Hard IP Blocks | PCIe, CDR, PLLs |
EP2SGX30FG780C7 Pin Configuration
| Pin 1 | VCC — Core supply (0.85 V typical, see datasheet) |
| Pin 2 | GND — Ground reference |
| Pin 3 | IO — User I/O (bank-dependent) |
| Pin 4 | GXB_RX — Transceiver receive (channel 0) |
| Pin 5 | GXB_TX — Transceiver transmit (channel 0) |
| Pin 6 | REFCLK — Transceiver reference clock input |
| Pin 7 | JTAG_TCK — JTAG test clock |
| Pin 8 | JTAG_TMS — JTAG test mode select |
| Pin 9 | JTAG_TDO — JTAG test data out |
| Pin 10 | JTAG_TDI — JTAG test data in |
| Pin 11 | nCONFIG — Configuration control |
| Pin 12 | nSTATUS — Configuration status |
| Pin 13 | CONF_DONE — Configuration done |
| Pin 14 | DCLK — Configuration clock |
| Pin 15 | DATA0 — Configuration data 0 |
| Pin 16 | MSEL0 — Configuration mode select |
| Pin 17 | MSEL1 — Configuration mode select |
| Pin 18 | VCCAUX — Auxiliary supply |
| Pin 19 | VCCIO — I/O supply (bank-dependent) |
| Pin 20 | NC — Not connected (per datasheet) |
Typical Applications
EP2SGX30FG780C7 is suitable for 6 applications: PCI Express Endpoint Card, Serial RapidIO Bridge for Baseband Cards, 10G Ethernet XAUI Aggregation, SD/HD-SDI Broadcast Video Processing, High-Speed Data Acquisition Backplane, Wireless Baseband DSP Co-Processor.
PCI Express Endpoint Card
The EP2SGX30FG780C7 is well suited as the central logic of a PCI Express endpoint card thanks to its 4 hard multi-gigabit transceivers and embedded PCIe hard IP. Altera's PCIe hard block implements the Gen1 physical layer and data link layer directly in silicon, freeing soft logic for application-layer endpoints such as NVMe, DMA engines, or protocol analyzers. With 33,880 logic elements and 192 18x18 multipliers, the device has sufficient headroom for a x4 Gen1 endpoint plus substantial user logic, and the 2.1 Mbits of TriMatrix memory serves as scratchpad buffers for descriptor rings. The FG780 BGA's 1.0 mm pitch provides clean breakout for 100-ohm differential PCIe lanes to a standard edge connector. Compared with a soft-IP PCIe core, the hard block achieves deterministic latency under 200 ns and frees roughly 15K LEs of soft logic that would otherwise be consumed by PHY emulation.
Recommended
Serial RapidIO Bridge for Baseband Cards
The 4 embedded transceivers at up to 6.375 Gbps make the EP2SGX30FG780C7 an ideal Serial RapidIO (SRIO) bridge between baseband DSP arrays and a baseband controller in wireless infrastructure equipment. Hard CDR and adaptive equalization handle the long backplane traces typical of baseband chassis, while the embedded multipliers accelerate PHY-level signal-conditioning functions. With 33,880 LEs, designers can implement multiple SRIO lanes plus auxiliary DSP blocks in a single device, and the 192 18x18 multipliers support parallel DSP pre-processing. The FG780 BGA supports clean SRIO lane fan-out. In a typical deployment, this device consumes roughly 4-6 W of core power at 70-80% utilization with all 4 transceivers active, which fits comfortably within the FG780's thermal envelope on a 4-layer FR-4 stack-up.
Recommended
10G Ethernet XAUI Aggregation
The EP2SGX30FG780C7 supports the XAUI (10 Gigabit Attachment Unit Interface) protocol natively through its multi-gigabit transceivers, enabling 10G Ethernet aggregation across backplanes or to SFP+ optical modules. The 4 transceivers can carry one full XAUI lane (4x3.125 Gbps) plus a redundant link or one XAUI plus a lower-speed side channel. The device's ALM architecture delivers 8-input fracturable LUTs, which compresses XAUI MAC logic into fewer LEs than the previous-generation ALUT architecture. With 33,880 LEs, the device can host a complete XAUI MAC, PCS, and a small lookup engine in a single chip. The 780-pin BGA package has enough user I/O (364 pins) for parallel management interfaces, MDIO, and host CPU bridges without requiring an external glue device.
Recommended
SD/HD-SDI Broadcast Video Processing
Broadcast video routers and processing cards rely on SDI (Serial Digital Interface) at 270 Mbps, 1.485 Gbps, or 2.97 Gbps rates - all of which fit comfortably within the EP2SGX30FG780C7's transceiver range. The device's 192 18x18 multipliers and TriMatrix memory enable real-time video scaling, color-space conversion, and overlay composition on a single chip. With 33,880 LEs, multiple SDI streams (up to 4 SDI streams + processing) can be handled concurrently. The hard CDR simplifies SDI clock recovery, eliminating the need for external retimer chips. The FG780 package's pin count supports dense SDI I/O plus control planes for typical broadcast router line cards.
Recommended
High-Speed Data Acquisition Backplane
In test-and-measurement and defense systems, the EP2SGX30FG780C7 serves as a multi-channel data acquisition aggregator, taking 4 lanes of high-speed serial data from ADC front-ends and converting them into parallel buses for downstream processing. The 4 transceivers at 6.375 Gbps deliver up to 25.5 Gbps aggregate ingress, sufficient for stacking multiple ADC channels via JESD204B-like protocols (note: JESD204B hard IP was added in later families; here implemented in soft logic). The 2.1 Mbits of TriMatrix memory provides sample buffers, and the 192 hardware multipliers support real-time DSP such as FIR filtering, FFT preprocessing, and gain calibration. The FG780 BGA's 364 user I/O pins provide parallel GPIO for legacy ADC interfaces alongside the serial links.
Recommended
Wireless Baseband DSP Co-Processor
The 192 18x18 multipliers and TriMatrix memory of the EP2SGX30FG780C7 make it a competent co-processor in wireless baseband signal chains, offloading channel coding (Viterbi, turbo, LDPC soft-decision blocks) from the host DSP or baseband SoC. The 33,880 LEs handle state machines and control-plane logic, while the 4 transceivers provide a backhaul interface (CPRI/OBSAI up to 6.375 Gbps - check line-rate support in datasheet). The FG780 BGA is suitable for compact mezzanine cards that plug into baseband main boards. The C7 speed grade provides adequate timing margin for the DSP blocks at typical baseband clock rates below 200 MHz.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX30FG780C7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX30DF780C7 | EP2SGX30CF780C7 | EP2SGX30CF780C5 |
|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera |
| Package | 780-pin FineLine BGA (FG780) | 780-pin FineLine BGA (FG780) | 780-pin FineLine BGA (FG780) | 780-pin FineLine BGA (FG780) |
| Logic Elements | 33,880 | 33,880 | 33,880 | 33,880 |
| Transceivers | 4 (up to 6.375 Gbps) | 4 (up to 6.375 Gbps) | 4 (up to 6.375 Gbps) | 4 (up to 6.375 Gbps) |
| Embedded Memory | 2.1 Mbits | 2.1 Mbits | 2.1 Mbits | 2.1 Mbits |
| Multipliers (18x18) | 192 | 192 | 192 | 192 |
| Speed Grade | C7 | C7 | C7 | C5 (faster, -2 tiers) |
| User I/O Pins | 364 | 364 | 364 | 364 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Stratix II GX ALM architecture with 4 hard 6.375 Gbps transceivers (vs EP4SGX230KF40C2 (Stratix IV GX))
- Hard PCIe IP block eliminates soft-logic PHY (vs Cyclicone / soft-IP PCIe implementations)
- Pin-compatible upward migration to EP2SGX60 in same FG780 BGA (vs Cross-family migration to Stratix IV)
Design Notes
The 6.375 Gbps transceivers on the EP2SGX30FG780C7 require controlled-impedance 100-ohm differential routing on the transceiver banks. Per Altera's Stratix II GX PCB design guidelines, length matching between P and N of each lane must be within 5 mils, and intra-pair skew should be < 2 ps. Use a 4-layer FR-4 stack-up with a continuous ground plane beneath the transceiver lanes; avoid routing any other signal through the transceiver breakout region. Place DC-blocking capacitors on the TX outputs as close to the FPGA balls as physically possible (within 200 mils).
Estimated: at 70-80% utilization with all 4 transceivers active, the EP2SGX30FG780C7 consumes roughly 4-6 W of core power plus 1-2 W per active transceiver channel. The FG780 package's multiple GND and VCC balls (refer to the datasheet ball map for exact counts) must all be soldered to provide adequate current delivery and thermal dissipation. Decoupling requires 0.1 uF X7R capacitors placed within 100 mils of every VCC pin and a bulk 100 uF tantalum per supply rail. Separate analog supplies (VCCA, VCCP) for the transceiver PLLs must be filtered with ferrite beads from the digital VCC.
For multi-lane protocols such as XAUI or PCIe x4 using the EP2SGX30FG780C7, channel-to-channel skew across the 4 transceiver lanes must be controlled to within 40 ps for PCIe Gen1 compliance and 60 ps for XAUI. Reference clocks to the transceivers must be AC-coupled and routed with 50-ohm controlled impedance; consider using a dedicated clock buffer chip if multiple transceivers must share a low-jitter reference. The hard CDR in each transceiver handles up to 20 dB of channel loss at 6.375 Gbps, but PCB traces longer than 8 inches may require pre-emphasis or external equalization.
Do not confuse C7 (slowest Stratix II GX speed grade) with C8 or I8 variants - C7 is the commercial tier and is not interchangeable with industrial -I grades for parts rated for -40C to +100C operation. When migrating designs between C-prefix and non-C-prefix Stratix II GX die revisions (e.g., EP2SGX30 vs EP2SGX30C), verify errata documentation, as some silicon revisions fixed PCIe hot-plug bugs and CDR issues. For new designs, prefer the EP2SGX30D-prefix die revisions which include all known errata fixes.
Compliance Information
Compliance information was not present in the verified web data; values set to 'unknown' per Data Authenticity Rules. EP2SGX30FG780C7 is a commercial-grade (0C to +85C) FPGA, not automotive-qualified; AEC-Q100 not applicable.
