EP2SGX30CF780C4 - Stratix II GX FPGA 33.88K LE | Intel
MPN: EP2SGX30CF780C4 β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 100 | $198 | $19,800.00 |
| 500 | $165 | $82,500.00 |
| 1,000 | $138 | $138,000.00 |
EP2SGX30CF780C4 Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose logic function is defined by the user after manufacturing, sitting in the broader hierarchy of programmable logic devices (PLD) -> CPLD/FPGA -> logic IC -> integrated circuit. FPGAs combine configurable logic blocks (CLBs), programmable routing, and dedicated hard IP blocks (memory, transceivers, DSP blocks, PLLs). The Stratix II GX family extends the Stratix II architecture by integrating multi-gigabit transceivers, making it suited for serial backplane, telecom, and high-speed serial I/O applications.
Key features of the EP2SGX30CF780C4 include 16 transceivers supporting multi-gigabit serial data rates, dedicated hardware multipliers and DSP blocks for high-throughput arithmetic, on-chip tri-matrix memory supporting true dual-port RAM, ROM, and FIFO modes, and up to 361 single-ended user I/Os. The 780-pin FBGA package provides the routing density required for high-pin-count high-performance designs.
The device architecture is built around Adaptive Logic Modules (ALMs) that implement combinational logic, arithmetic, and register functions in 8-input look-up tables with associated registers. Hard IP blocks for transceivers, PLLs, and memory controllers offload common functions from the programmable fabric. The 90 nm process technology balances performance and power at the time of introduction, while the 1.2 V core VCC minimizes dynamic power.
Typical applications include 10 Gbps and below serial backplane interfaces, telecom line cards, high-end test and measurement equipment, ASIC prototyping, high-throughput digital signal processing for video and imaging, and embedded computing platforms requiring custom I/O bridging. The integration of transceivers with general-purpose FPGA fabric enables single-chip protocol bridges and custom ASIC replacements.
When designing with the EP2SGX30CF780C4, allocate sufficient PCB layers for the 780-ball FBGA escape routing, use controlled-impedance routing for the multi-gigabit transceiver channels, and provide multiple low-noise supply rails for the transceiver analog supplies. Quartus II software is the primary design entry, synthesis, and place-and-route toolchain.
This page synthesizes distributor stock visibility, parametric alternatives within the Stratix II GX family, and practical design notes that complement the official Intel datasheet and the Quartus II device handbook.
Drop-in alternatives for EP2SGX30CF780C4 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX30CF780C4 (same form factor and footprint) β differing in Package, Speed Grade, RoHS Status, Logic Elements, Operating Temperature.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2SGX30CF780C3
β Drop-Inβ In Stock
$175.5 / Unit
View Datasheet βEP2SGX30CF780C3N
β Drop-Inβ In Stock
$195 / Unit
View Datasheet βEP2SGX30CF780C3NGB
β Drop-Inβ In Stock
$305 / Unit
View Datasheet βEP2S130F780C4
β Drop-Inβ In Stock
$6500 / Unit
View Datasheet βEP2S90F780C4
β Drop-Inβ In Stock
$3050 / Unit
View Datasheet βEP2S130F780C5
β Drop-Inβ In Stock
$2295 / Unit
View Datasheet βEP2S90F780C5
β Drop-Inβ In Stock
$1100 / Unit
View Datasheet βEP2SGX30CF780C4 Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Logic Elements | 33,880 |
| Embedded Memory Bits | 1,369,728 |
| Maximum User I/Os | 361 |
| LABs/CLBs | 1,694 |
| Maximum Operating Frequency | 732.1 MHz |
| Process Technology | 90 nm |
| Core Supply Voltage | 1.2 V |
| Package | 780-BBGA (flip-chip) |
| Mounting Type | Surface Mount |
| AEC-Q100 | Not applicable (FPGA, commercial/industrial) |
| Operating Temperature Grade | Commercial (0C to +85C) |
| Transceivers | Yes (Stratix II GX integrated) |
EP2SGX30CF780C4 780-bbga (flip-chip) Pin Configuration Guide
Pin configuration for EP2SGX30CF780C4 (780-bbga (flip-chip) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX30CF780C4.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX30CF780C4 is suitable for 6 applications: Multi-Gigabit Serial Backplane Interface, Telecom Line Card and Protocol Bridge, High-Throughput Digital Signal Processing, Test and Measurement Equipment, ASIC Prototyping and Emulation, Embedded Computing and Custom I/O Bridging.
Multi-Gigabit Serial Backplane Interface
The EP2SGX30CF780C4 is well suited to multi-gigabit serial backplane applications because of its integrated Stratix II GX transceivers, which support data rates commonly used in telecom and datacom backplanes. The 780-BBGA package provides the routing density required to break out 16+ transceiver channels with controlled impedance, while the 33,880 logic elements give ample fabric to implement custom PCS, MAC, and protocol layers. Compared with discrete SERDES plus an FPGA, the integrated transceiver approach reduces BOM, simplifies PCB layout, and lowers jitter by keeping high-speed signals on-die. Designers should use the Quartus II transceiver toolkits to configure pre-emphasis, equalization, and reference-clock topology for the targeted backplane reach. As of 2026-09-09, distributors list 16 transceivers integrated on the die, with 361 user I/Os remaining for parallel interfaces.
Recommended
Telecom Line Card and Protocol Bridge
In telecom line cards the EP2SGX30CF780C4 functions as a protocol bridge between OTN/SONET/SDH framers and backplane SERDES, mapping between TDM and packet domains. The 1,369,728 bits of embedded tri-matrix memory buffer cells and protocol frames without external SRAM, while 33,880 logic elements implement mapper, framer, and forwarding logic. The integrated transceivers support line-side data rates used in metro Ethernet and OTU interfaces, eliminating external SERDES chips. Designers benefit from Quartus II IP cores for OTN, Ethernet MAC, and PCS layers. Compared with an ASIC, the FPGA path enables rapid feature evolution across carrier deployments. As of 2026-09-09, distributor pricing on Octopart places 100-piece volume around USD 198 for excess stock channels.
Recommended
High-Throughput Digital Signal Processing
The EP2SGX30CF780C4 supports high-throughput DSP for video, imaging, and radar preprocessing through its hard DSP blocks and Adaptive Logic Modules. The 732.1 MHz maximum operating frequency enables multi-channel FIR filtering, FFT cores, and beamforming at line-rate, while 1,369,728 bits of embedded memory store coefficients and intermediate samples. The 780-BBGA package accommodates the I/O density of parallel ADC/DAC interfaces used in DSP front ends. Designers can leverage Altera's DSP Builder and IP cores for FFT, FIR, and matrix multiplication. Compared with DSP microcontrollers, this FPGA delivers orders-of-magnitude higher sample rates on parallel channel arrays. As of 2026-09-09, the part's embedded memory and DSP block counts are the headline parameters on distributor listings.
Recommended
Test and Measurement Equipment
Test and measurement platforms leverage the EP2SGX30CF780C4 to generate, capture, and analyze high-speed serial protocols including PCI Express, Serial RapidIO, and custom LVDS patterns. The integrated transceivers provide physical-layer connectivity to DUTs while the FPGA fabric implements protocol analyzers, BERT engines, and trigger logic. The 361 user I/Os support parallel front-panel control and status, and the 780-BBGA package enables dense channel-count designs in 1U/2U form factors. Compared with fixed-protocol analyzers, the FPGA-based instrument can be reconfigured in-field for new protocol revisions. Designers should budget cooling for the 90 nm process node to maintain timing margins in instrument enclosures. As of 2026-09-09, the part is widely stocked via aftermarket channels for legacy T&M fleet support.
Recommended
ASIC Prototyping and Emulation
Engineers use the EP2SGX30CF780C4 as a building block in multi-FPGA ASIC prototyping because its 33,880 logic elements and embedded memory map well to mid-complexity RTL blocks, while its transceivers model SoC-to-SoC links. The 780-BBGA package and Quartus II compile flow allow partitioning of large ASIC designs across multiple Stratix II GX devices. Compared with ASIC tape-out, FPGA prototyping cuts bring-up time from months to weeks and enables real-world software development before silicon. The 732.1 MHz operating frequency supports running production RTL at near-target clock rates for accurate performance validation. As of 2026-09-09, the part remains a popular prototyping building block in design services environments.
Recommended
Embedded Computing and Custom I/O Bridging
In embedded computing platforms the EP2SGX30CF780C4 acts as a custom I/O bridge between processors, memories, and legacy peripherals, mapping between RapidIO, parallel DDR, LVDS, and GPIO domains. The 33,880 logic elements accommodate modest soft-core processors (Nios II) and custom peripherals, while the 1,369,728 bits of embedded memory buffer DMA streams. The integrated transceivers provide a high-speed uplink to a host CPU or backplane. Compared with ASSP bridge chips, the FPGA path offers reconfiguration for evolving interface standards. Designers should follow the Stratix II GX device handbook for I/O standard assignment and pin placement to meet timing across all bridge interfaces. As of 2026-09-09, DigiKey and Octopart list the part with verified specs for industrial embedded designs.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX30CF780C4 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX30CF780C3 | EP2SGX30CF780C3N | EP2S130F780C4 | EP2S90F780C4 |
|---|---|---|---|---|---|
| Package | 780-BBGA (flip-chip) | 780-BBGA - same | 780-BBGA - same | 780-FBGA - same family | 780-FBGA - same family |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Family | Stratix II GX | Stratix II GX | Stratix II GX | Stratix II (no GX) | Stratix II (no GX) |
| Logic Elements | 33,880 | 33,880 | 33,880 | 132,540 | 90,960 |
| Embedded Memory (bits) | 1,369,728 | 1,369,728 | 1,369,728 | 6,747,840 | 4,520,448 |
| Integrated Transceivers | Yes (Stratix II GX) | Yes | Yes | No | No |
| Speed Grade | C4 | C3 (faster) | C3 (faster) | C4 | C4 |
| Process Node | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Integrated multi-gigabit transceivers (vs EP2S90F780C4 (Stratix II without GX))
- Drop-in compatible with C3 speed grade (vs EP2SGX30CF780C3)
- Compact 33,880 LE density with transceivers (vs EP2SGX130GF1508C5)
Design Notes
The 90 nm Stratix II GX die consumes substantial dynamic power at 732.1 MHz. Estimate: at 50% toggle rate across 33,880 logic elements at 1.2 V VCC, expect approximately 5-10 W core power plus transceiver analog power. Use the 780-BBGA thermal pad and a multi-layer PCB with stitched thermal vias to keep junction temperature below 85C for commercial grade operation. Forced-air cooling is recommended in closed enclosures.
The 780-BBGA package requires a minimum of 6 PCB layers for BGA escape and power/ground planes. Use the package ball-pitch and pad geometry from the Stratix II GX device handbook. Maintain differential pair length matching within 150 mil for the integrated transceiver channels, and isolate the analog transceiver supply rails from the noisy digital core rails with ferrite beads and dedicated decoupling.
Do not assume the EP2SGX30CF780C4 and the EP2S130F780C4 share a full pin-to-pin signal assignment even though they share the 780-ball FBGA family footprint. The Stratix II GX die assigns additional balls to transceiver analog supplies and reference clocks; an EP2S130F780C4 board will have unconnected transceiver balls. Always re-validate the Quartus II pin planner output when migrating between Stratix II and Stratix II GX densities.
Place reference clock sources within 250 mil of the transceiver clock input pins to minimize jitter accumulation. Route the clock nets as 50-ohm controlled-impedance microstrip or stripline. Use the Stratix II GX transceiver toolkit in Quartus II to verify pre-emphasis and equalization settings for your specific channel reach.
Compliance Information
RoHS, lead-free, halogen-free, and MSL data not present in the verified web data sources for this obsolete part; consult the Intel/Altera legacy product archive or the lot-specific manufacturer CoC for authoritative compliance status.
