EP2SGX30DF780C7N - 30K LE Stratix II GX FPGA 780-BGA | Altera
MPN: EP2SGX30DF780C7N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $320 | $320.00 |
| 10 | $295 | $2,950.00 |
| 100 | $268 | $26,800.00 |
| 500 | $245 | $122,500.00 |
| 1,000 | $225 | $225,000.00 |
EP2SGX30DF780C7N Overview
A Field Programmable Gate Array (FPGA) is a programmable logic IC whose internal lookup tables, flip-flops, routing, and hard IP blocks can be configured by the user after manufacture to implement arbitrary digital functions, ranging from simple glue logic to complete processor subsystems. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs), with high-end FPGAs like Stratix II GX further embedding transceivers, DSP blocks, and large block RAMs to compete with ASICs in throughput-intensive applications. The -7 speed grade places this part in the standard-performance tier of the family, balanced for both timing closure and power.
Key features include 361 user I/O pins, dedicated 3.125 Gbps multi-gigabit transceivers (MGTs), embedded multiplier blocks for DSP, and on-chip Phase-Locked Loops (PLLs) for clock management. The FineLine BGA-780 package supports high pin density with controlled-impedance signal integrity for parallel interfaces and serial links. The integrated transceiver hard IP allows designers to implement protocols such as PCI Express, Serial RapidIO, Gigabit Ethernet, and XAUI without consuming general-purpose logic resources.
Architecturally, Stratix II GX uses the ALM as its basic logic element, where each ALM contains two adaptive look-up tables (ALUTs) and four programmable registers, giving finer granularity than the 4-LUT structures used in earlier Stratix generations. The transceiver blocks include physical coding sublayer (PCS) and physical medium attachment (PMA) layers to handle 8b/10b encoding, clock data recovery, and serializer/deserializer functions. Combined with the Quartus II design toolchain, this part accelerates time-to-prototype for communication and signal-processing systems.
Typical applications include high-speed serial backplanes, telecom line cards, wireless baseband processing, broadcast video routers, and military signal-processing systems. The combination of high logic density, embedded transceivers, and substantial block RAM makes it well suited for protocol bridging, packet processing, and high-throughput DSP pipelines where a hard ASIC would be uneconomical at low volumes.
When designing with this device, engineers must allocate sufficient PCB layers (typically 10+ layers) to route the BGA-780 breakout and maintain signal integrity on the transceiver channels. Thermal management must account for the worst-case junction temperature under full transceiver utilization, and power estimation in Quartus II should be run early to size decoupling and the regulator tree correctly.
This page synthesizes distributor availability, drop-in package-compatible Stratix II GX speed-grade and temperature-grade variants, and practical design notes not consolidated on any single manufacturer or distributor page.
Drop-in alternatives for EP2SGX30DF780C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX30DF780C7N (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature, RoHS Status, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
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View Datasheet →EP2SGX30DF780C7N Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Logic Elements | 33,880 |
| Embedded Memory (bits) | 1,369,728 |
| Total Block RAM (M512 + M4K + M-RAM) | 361 blocks |
| Maximum User I/O | 361 |
| Transceiver Data Rate | 3.125 Gbps |
| Process Technology | 90 nm |
| Speed Grade | C7 (standard) |
| Package | 780-ball FineLine BGA (DF) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant (per Altera product family) |
EP2SGX30DF780C7N 780-ball fineline bga (df) Pin Configuration Guide
Pin configuration for EP2SGX30DF780C7N (780-ball fineline bga (df) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX30DF780C7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX30DF780C7N is suitable for 7 applications: Telecom Line Card with Serial Backplane, Wireless Baseband Signal Processing, Broadcast Video Routing Switcher, High-Speed Protocol Bridge (PCIe to Serial RapidIO), Industrial Inspection and Machine Vision, Military and Aerospace Signal Processing, Test and Measurement Instrumentation.
Telecom Line Card with Serial Backplane
The EP2SGX30DF780C7N is well suited for telecom line-card designs that bridge a multi-gigabit serial backplane (XAUI or Serial RapidIO) to a parallel framer ASIC, because its 3.125 Gbps MGT hard IP implements the PCS and PMA layers without consuming fabric resources. The 1,369,728 bits of block RAM buffer packets across clock domains, while 33,880 LEs absorb packet-classification and OAM logic. Compared with a discrete SERDES plus CPLD implementation, this single-chip approach reduces board area and BOM while simplifying timing closure. Designers typically instantiate the Altera XAUI or SRIO mega-function and reserve 4-8 transceiver channels plus their reference-clock PLL.
Recommended
Wireless Baseband Signal Processing
For wireless baseband processing the EP2SGX30DF780C7N combines dedicated 18x18 embedded multipliers for FFT, Viterbi, and Turbo decoding with ample block RAM for storing soft-decision samples. The 33,880 LEs accommodate channel-coding and rate-matching glue logic, while the 780-BGA package exposes sufficient user I/O to interface with analog front-end ADCs/DACs and CPRI/OBSAI links to the radio equipment controller. The -7 commercial speed grade comfortably meets typical LTE and WiMAX baseband clock rates when timing constraints are carefully pipelined. Power estimation in Quartus II should be run early because full DSP utilization can drive junction temperature well above ambient.
Recommended
Broadcast Video Routing Switcher
The EP2SGX30DF780C7N is a strong fit for broadcast video routers and format converters that must switch SDI streams at 270 Mbps, 1.485 Gbps (HD-SDI), and 2.97 Gbps (3G-SDI). The integrated MGTs handle 3G-SDI serialization directly, while the block RAM stores line and frame buffers for format upscaling, color-space conversion, and genlock timing. The 361 user I/O pins support HDMI, DisplayPort bridging, and parallel TTL control interfaces. Designers typically pair the device with external cable equalizers and reclockers, then use the FPGA for crosspoint switching and on-screen-display overlay. Compared to an ASIC, this FPGA lets studios add new formats via firmware updates.
Recommended
High-Speed Protocol Bridge (PCIe to Serial RapidIO)
As a PCI Express Gen1 endpoint or root complex, the EP2SGX30DF780C7N leverages its hard PCIe IP block to implement x1/x4 lanes at 2.5 Gbps without consuming fabric LUTs, leaving the 33,880 LEs free for protocol-translation logic that bridges PCIe to Serial RapidIO, Gigabit Ethernet, or custom proprietary links. The 780-BGA footprint provides sufficient user I/O for local bus interfaces to companion DSPs or processors. This application is common in defense signal-processing subsystems and high-end industrial inspection platforms where COTS hardware must bridge incompatible legacy fabrics. Designers must follow Altera's PCIe layout guidelines for the transceiver channels.
Recommended
Industrial Inspection and Machine Vision
For multi-camera machine-vision inspection lines, the EP2SGX30DF780C7N aggregates image data from multiple Camera Link, GigE Vision, or CoaXPress sensors using its 3.125 Gbps transceivers, while the 33,880 LEs perform real-time defect detection, blob analysis, and overlay rendering. The 1,369,728-bit block RAM acts as line buffers and statistical accumulators, reducing external memory traffic. The commercial -7 speed grade handles typical Camera Link clock rates up to 85 MHz with comfortable margin. Compared to a DSP-plus-FPGA split architecture, this single-FPGA approach simplifies PCB layout and reduces latency, but careful power budgeting is required at full transceiver utilization.
Recommended
Military and Aerospace Signal Processing
Defense signal-processing subsystems for radar, electronic warfare, and software-defined radio leverage the EP2SGX30DF780C7N for its combination of transceiver density, DSP blocks, and ruggedized BGA packaging. The 3.125 Gbps MGTs handle digital IF data from downconverters, while the embedded multipliers implement pulse-compression, beamforming, and FFT pipelines. Designers typically map critical functions into triple-modular-redundant (TMR) flip-flops using Altera's Quartus TMR tool to mitigate single-event upsets. Note that the -C7 commercial temperature grade limits deployment to controlled environments; for -55C to +125C operation, an industrial or military-grade EP2SGX30 variant in the same DF BGA must be selected instead.
Recommended
Test and Measurement Instrumentation
In logic analyzers, protocol exercisers, and bit-error-rate testers, the EP2SGX30DF780C7N generates and analyzes high-speed serial traffic up to 3.125 Gbps using its MGTs, while the 33,880 LEs implement pattern generation, error counting, and protocol-aware decoding. The 1,369,728 bits of block RAM store captured waveform windows and statistical counters, and the 361 user I/O support parallel stimulus/response buses to the unit under test. The -7 commercial speed grade provides sufficient timing margin for most SATA, Fibre Channel, and GigE test scenarios. This FPGA approach lets test vendors ship a single hardware platform that supports multiple standards through firmware upgrades.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX30DF780C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX30DF780C7 | EP2SGX30DF780C6 | EP2SGX30DF780C5N | EP2SGX30DF780C5 | EP2SGX30DF780C4N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) | Altera (Intel FPGA) |
| Package | 780-ball FineLine BGA (DF) | 780-ball FineLine BGA (DF) - same | 780-ball FineLine BGA (DF) - same | 780-ball FineLine BGA (DF) - same | 780-ball FineLine BGA (DF) - same | 780-ball FineLine BGA (DF) - same |
| Speed Grade | -7 (C7) | -7 (C7) | -6 (C6, faster) | -5 (C5, fastest standard) | -5 (C5, fastest standard) | -4 (C4) |
| Logic Elements | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 | 33,880 |
| Embedded Memory (bits) | 1,369,728 | 1,369,728 | 1,369,728 | 1,369,728 | 1,369,728 | 1,369,728 |
| Total RAM Blocks | 361 | 361 | 361 | 361 | 361 | 361 |
| Maximum User I/O | 361 | 361 | 361 | 361 | 361 | 361 |
| Transceiver Data Rate | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps |
| Lead-Free Finish | Yes (N suffix) | No (no N suffix) | No (no N suffix) | Yes | No | Yes |
Key Differentiators
- Lead-free finish for RoHS-compliant assembly (vs EP2SGX30DF780C7)
- Slower speed grade offers cost savings when timing margin is non-critical (vs EP2SGX30DF780C6)
- Mature design ecosystem with documented reference designs (vs Newer Intel Agilex 7 family)
Design Notes
Estimated: The 780-ball FineLine BGA at 1.00 mm ball pitch requires a minimum of 10 PCB layers with microvia (laser-drilled) or via-in-pad technology for reliable fan-out. Surface traces must be length-matched within +/-10 mils for the parallel buses, and the MGT transceiver channels need 100-ohm differential routing with controlled impedance per Altera's Stratix II GX layout guidelines. Use of high-speed PCB stackup materials such as FR4-370HR or Megtron 6 is recommended at full transceiver utilization.
Estimated: Under full transceiver and DSP utilization at 100 percent toggle rate, junction power can approach 8-10 W on the 780-BGA package. Designers must allocate at least 4 inner ground/power planes and copper pours directly under the BGA to keep theta_JA low. Forced-air cooling or a heatsink with thermal interface material is required for sealed enclosures. Run the Quartus II PowerPlay early power estimator before final PCB layout to size the cooling solution.
Do not confuse the EP2SGX30DF780C7N (DF BGA ball-map revision) with the EP2SGX30CF780C7N (CF ball-map revision); the ball assignments differ and they are NOT pin-compatible drop-in substitutes. Always cross-check the ball map in Volume 2 of the Stratix II GX Device Handbook before substituting variants. Also note that the -C7 commercial temperature grade restricts deployment to 0C to +85C; for industrial or military environments, choose the -I or -M variants in the same DF BGA package family.
MGT transceiver reference clocks must be supplied from a low-jitter clock source such as a dedicated PLL with sub-ps RMS jitter; use the Altera-provided ALTPLL megafunction with the appropriate transceiver clock pin assignment. Maintain a clean, isolated ground return path under each transceiver channel, and avoid routing noisy digital signals across the MGT power and ground islands. Series AC-coupling capacitors (typically 100 nF) are required on each transmit and receive differential pair per the protocol standard.
Enable spread-spectrum clocking on the global clocks feeding non-transceiver logic to reduce EMI peak energy, particularly in consumer-facing products. Decouple each VCCINT and VCCA supply pin with a 0.1 uF X7R ceramic capacitor placed within 100 mils of the pin, and add bulk tantalum or polymer capacitors (22-47 uF) near each power island. Follow Altera's recommended decoupling network for the Stratix II GX family to suppress conducted and radiated noise during simultaneous switching events.
Compliance Information
RoHS compliant per the N suffix on the part number; verified against the Altera (Intel FPGA) RoHS substance declaration. AEC-Q100 not applicable as this is a programmable logic IC, not an automotive-qualified standard part. Halogen-free status not explicitly listed in the public datasheet; refer to the Intel FPGA material declaration for definitive halogen status. Conflict-minerals declaration available from Altera / Intel supplier responsibility program.
