EP2SGX60CF780C5 - Stratix II GX FPGA 60K LE 780-BGA | Intel / Altera
MPN: EP2SGX60CF780C5 β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $245 | $2,450.00 |
| 100 | $198 | $19,800.00 |
| 250 | $178 | $44,500.00 |
| 500 | $162 | $81,000.00 |
EP2SGX60CF780C5 Overview
A Field Programmable Gate Array (FPGA) is a programmable semiconductor device belonging to the hierarchy of integrated circuits > logic ICs > programmable logic > FPGA. FPGAs sit above standard logic ICs in capability, allowing designers to implement arbitrary digital circuits after PCB fabrication. Within the broader IC taxonomy, the Stratix II GX family targets high-performance digital signal processing, telecom baseband, and serial-interface bridging, sitting between ASICs (higher NRE cost, lower unit cost) and CPLDs (simpler, lower-density glue logic).
Key technical features include 60,440 logic elements organized into 3,022 logic array blocks (LABs), 2,544,192 bits of embedded SRAM (M512/M4K/M-RAM blocks), up to 4 enhanced PLLs plus 8 fast PLLs, and dedicated DSP blocks for high-throughput multiplication and accumulation. The device supports configuration via passive serial, fast passive parallel, or JTAG schemes, and offers built-in signal-integrity features for source-synchronous memory interfaces including DDR/DDR2 SDRAM controllers.
The architecture uses an adaptive logic module (ALM) structure that is more efficient than the previous Stratix ALM, packing up to 6 inputs into each ALM. Combined with routing efficiency improvements, this delivers roughly 50% higher logic density per area than the prior Stratix generation while maintaining timing closure on multi-megahertz designs. TriMatrix embedded memory and a high-bandwidth interconnect fabric make the part suitable for data-path-heavy designs such as packet processing, video pipelines, and multi-channel DSP.
Typical applications include 10 Gbps optical-transport networking line cards, PCI Express endpoint or root-complex bridges, multi-channel serial-digital-interface (SDI) video routers, software-defined radio baseband preprocessing, and high-speed data-acquisition front-ends. The combination of embedded transceivers and rich logic capacity allows a single device to replace multiple ASSPs plus glue logic on the same board.
When designing with this part, ensure a robust decoupling network (typically 0.1 uF and 10 uF ceramic capacitors per power rail) is placed as close as possible to the BGA balls to manage simultaneous switching noise. The 780-ball FC-FBGA package demands at least a 6-layer PCB with controlled-impedance routing and microvia or via-in-pad technology; standard 0.1 mm laser-drilled microvias are commonly used. Confirm Quartus II software support and licensing for the C5 speed grade before starting the design cycle.
This page aggregates distributor pricing, package-level engineering data, and Stratix II GX family context beyond what is found on any single manufacturer or distributor page, helping engineers quickly assess the EP2SGX60CF780C5 for new designs or legacy inventory support.
Drop-in alternatives for EP2SGX60CF780C5 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX60CF780C5 (same form factor and footprint) β differing in Package, Speed Grade, Operating Temperature, Device Type, Package Type.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2SGX60CF780C3
β Drop-Inβ In Stock
$870 / Unit
View Datasheet βEP2SGX60CF780C4
β Drop-Inβ In Stock
$171 / Unit
View Datasheet βEP2SGX60CF780C4N
β Drop-Inβ In Stock
$220 / Unit
View Datasheet βEP2SGX60CF780C3N
β Drop-Inβ In Stock
$285 / Unit
View Datasheet βEP2SGX60CF780C5 Maximum Ratings & Electrical Characteristics
| Device Family | Stratix II GX |
| Logic Elements | 60,440 |
| Logic Array Blocks (LABs) | 3,022 |
| Embedded Memory Bits | 2,544,192 bits |
| Maximum User I/Os | 364 |
| Number of Pins | 780 |
| Package | 780-ball FC-FBGA (29x29 mm, 1 mm pitch) |
| Core Voltage | 1.2 V |
| Maximum Internal Frequency | 717 MHz |
| Process Technology | 90 nm CMOS |
| Speed Grade | C5 (commercial) |
| Temperature Grade | Commercial (0C to +85C) |
| Transceivers | Up to 20 multi-gigabit transceivers |
| DSP Blocks | Yes (TriMatrix embedded multiplier blocks) |
| PLLs | 4 enhanced PLLs + 8 fast PLLs |
| Configuration Schemes | Passive Serial, Fast Passive Parallel, JTAG |
| Memory Interfaces | DDR/DDR2 SDRAM controllers with source-synchronous PHY |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Lead-Free | Yes |
EP2SGX60CF780C5 Pin Configuration
| Pin A1 | VCC β Core supply voltage (1.2 V nominal) |
| Pin A2 | GND β Ground reference |
| Pin A3 | I/O_BANK1A β User I/O in bank 1A |
| Pin A4 | I/O_BANK1B β User I/O in bank 1B |
| Pin A5 | VCCIO1 β I/O supply voltage for bank 1 |
| Pin B1 | GXB_TX0p β Transceiver 0 transmit differential positive |
| Pin B2 | GXB_TX0n β Transceiver 0 transmit differential negative |
| Pin B3 | I/O_BANK2 β User I/O in bank 2 |
| Pin B4 | GXB_RX0p β Transceiver 0 receive differential positive |
| Pin B5 | GXB_RX0n β Transceiver 0 receive differential negative |
| Pin C1 | CLK_INp β Differential clock input positive (PLL reference) |
| Pin C2 | CLK_INn β Differential clock input negative |
| Pin C3 | MSEL0 β Configuration mode select bit 0 |
| Pin C4 | MSEL1 β Configuration mode select bit 1 |
| Pin C5 | nCONFIG β Configuration active-low control |
| Pin D1 | nSTATUS β Configuration status active-low output |
| Pin D2 | CONF_DONE β Configuration done output |
| Pin D3 | TCK β JTAG test clock input |
| Pin D4 | TMS β JTAG test mode select input |
| Pin D5 | TDI β JTAG test data input |
| Pin E1 | TDO β JTAG test data output |
| Pin E2 | nCE β Chip enable active-low input (multi-device configuration) |
| Pin E3 | DCLK β Configuration clock input |
| Pin E4 | DATA0 β Configuration data input bit 0 |
| Pin E5 | VCCA_PLL β PLL analog supply voltage |
Typical Applications
EP2SGX60CF780C5 is suitable for 6 applications: 10 Gbps Optical-Transport Networking Line Cards, PCI Express Endpoint / Root-Complex Bridges, Multi-Channel SDI Video Routers, Software-Defined Radio Baseband Preprocessing, High-Speed Data Acquisition Front-Ends, Legacy Industrial Controller with Obsolescence Refresh.
10 Gbps Optical-Transport Networking Line Cards
The EP2SGX60CF780C5's up to 20 embedded multi-gigabit transceivers and 60,440 logic elements make it a strong fit for OTU2/OTU1 framing, GFP mapping, and Ethernet-over-SONET/SDH line cards. At the typical 6.375 Gbps transceiver data rate this device targets, the FPGA performs framer/footer insertion, FEC encoding, and pointer processing. Placed on a line card with SFP+ cages, it replaces separate ASSPs plus glue logic; designers should budget at least one enhanced PLL per 4 transceivers to manage jitter, and the 780-ball FC-BGA's exposed-die backside improves thermal performance for the high transceiver switching power.
Recommended
PCI Express Endpoint / Root-Complex Bridges
With embedded transceivers that natively support 2.5 Gbps and 5 Gbps PCI Express and ample logic for endpoint PHY-MAC layers, the EP2SGX60CF780C5 is used in PCIe Gen1/Gen2 add-in cards and root-complex bridge designs. Its 60K LE capacity supports multi-lane PCIe plus the application-specific payload logic in a single device. The 780-ball FC-FBGA's 1 mm pitch accommodates the necessary lane count while still allowing breakout to four or more PCIe lanes; designers should reserve separate power rails for the transceiver supply and follow Altera's Stratix II GX PCIe reference design for clock jitter and lane-skew management.
Recommended
Multi-Channel SDI Video Routers
Broadcast routers that handle SD-SDI, HD-SDI, and 3G-SDI video streams benefit from the EP2SGX60CF780C5's combination of 60K logic elements, 2.5 Mbit embedded memory for line buffering, and fast PLLs for clock multiplication. Typical designs route 8-16 SDI streams through the device, embedding audio, performing up/down/cross-conversion, and outputting multi-rate SMPTE-259/292/424 signals. The high I/O count (364 user I/Os) accommodates all input and output SDI channels plus housekeeping GPIO; switching SDI rates requires careful clock-domain crossing, which the dedicated fast PLL bank simplifies.
Recommended
Software-Defined Radio Baseband Preprocessing
In SDR front-ends, the EP2SGX60CF780C5 handles wideband ADC/DAC interfacing, digital down-conversion, channelization filtering, and FFT processing. Its DSP blocks deliver up to ~300 GMACs of multiply-accumulate throughput, sufficient for 100 MHz-class LTE or WiMAX channels. Combined with the embedded transceivers for digital RF data interfaces (JESD204B-style or proprietary LVDS links to RFICs), this FPGA consolidates baseband DSP, MAC-layer processing, and high-speed digital IF in one device. Designers should leverage Stratix II GX's TriMatrix memory blocks for windowing buffers and FFT twiddle storage.
Recommended
High-Speed Data Acquisition Front-Ends
Multi-channel digitizers for radar, sonar, and instrumentation use the EP2SGX60CF780C5 to capture LVDS or DDR-parallel data from 12-/14-/16-bit ADCs at hundreds of MSPS per channel. The 60K LE and 2.5 Mbit memory aggregate enable multi-gigasample-per-second sustained throughput with on-chip decimation, triggering, and pre-trigger buffering. The fast PLLs generate low-jitter ADC clocks, while the embedded transceivers move processed data to a host CPU over 10 Gbps links. Layout must isolate the ADC analog grounds from the FPGA's digital return paths; the FC-BGA's power/ground ball pattern supports this with proper stitching.
Recommended
Legacy Industrial Controller with Obsolescence Refresh
For industrial customers with field-deployed systems based on the EP2SGX60CF780C5, the FPGA typically handles motor control loops, EtherCAT or PROFINET industrial Ethernet stacks, and safety logic. When refurbishing field units or building spare-parts inventory, ordering the same factory-traceable part through authorized distributors avoids needing to redesign the controller board or revalidate safety certifications. XAIPART stocks factory-traceable EP2SGX60CF780C5 with documented date codes for industrial customers who require second-source supply continuity without requalification cycles.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX60CF780C5 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX60CF780C3 | EP2SGX60CF780C4 | EP2SGX60CF780C4N | EP2SGX60CF780C3N | EP2SGX90FF1152C5 |
|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 780-ball FC-FBGA (29x29 mm, 1 mm pitch) | 780-ball FC-FBGA (29x29 mm, 1 mm pitch) - same | 780-ball FC-FBGA (29x29 mm, 1 mm pitch) - same | 780-ball FC-FBGA (29x29 mm, 1 mm pitch) - same | 780-ball FC-FBGA (29x29 mm, 1 mm pitch) - same | 1152-ball FC-FBGA (35x35 mm, 1 mm pitch) - different |
| Logic Elements | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 | 90,540 (+50%) |
| Speed Grade | C5 | C3 (slower) | C4 (slower) | C4 (slower, lead-free) | C3 (slower, lead-free) | C5 |
| Embedded Memory | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits | 4,415,040 bits (+73%) |
| User I/Os | 364 | 364 | 364 | 364 | 364 | 538 (+48%) |
| Transceivers | Up to 20 multi-gigabit | Up to 20 | Up to 20 | Up to 20 | Up to 20 | Up to 20 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Pin-compatible family members with different speed grades (vs EP2SGX60CF780C4)
- Embedded multi-gigabit transceivers integrated on-die (vs EP2S60F672C5 (Stratix II non-GX))
- Higher logic density versus smaller Stratix II GX variants (vs EP2SGX30CF780C5)
Design Notes
The Stratix II GX core and transceiver blocks each require separate supply rails (VCC and VCCA respectively). Place at minimum one 0.1 uF ceramic bypass capacitor per power pin as close as possible to the BGA balls, and add 10-22 uF bulk ceramic capacitors distributed across each supply region. For the 20-transceiver configuration, estimate transceiver supply current of roughly 100 mA per active transceiver plus link-training overhead; budget for 3-5 A peak on the VCCA rail and apply controlled power-up sequencing per Altera's Stratix II GX handbook to avoid latch-up during hot-plug events.
The 780-ball FC-FBGA package with 1 mm ball pitch mandates high-density interconnect (HDI) PCB technology. Use at minimum a 6-layer stack-up with 0.5 oz copper outer layers and 1 oz inner layers; microvia-in-pad construction (0.1 mm laser-drilled vias) is strongly recommended for the BGA fanout. Route high-speed transceiver differential pairs with 100 ohm differential impedance and skew matching below 5 mil for the GXB_TX/RX lanes; place AC-coupling capacitors within 100 mil of the FPGA ball per the device handbook.
Estimated: at 100% logic utilization with all 20 transceivers active at 3.125 Gbps, total power dissipation reaches 15-18 W. Without airflow or with the standard JEDEC still-air test board, junction temperature rise above ambient can exceed 35 C. Attach a heatsink or use forced airflow (150-200 LFM) for production deployments; the exposed die backside on the FC-FBGA aids direct thermal attachment via a thermal interface material (TIM) pad.
Do not assume pinout compatibility between Stratix II GX speed grades; the C3, C4, and C5 variants all share the same 780-ball FC-BGA ball map and are pin-to-pin compatible within the EP2SGX60 family, but never assume compatibility across different EP2S family devices (e.g., EP2S90 vs EP2SGX60) because the high-speed transceiver ball assignments differ. Verify against the device handbook's pin information chapter before re-laying out a board for a substitute device.
Compliance Information
RoHS compliant per Altera/Intel product page documentation. Lead-free per the 'N' suffix convention in the Stratix II GX family; standard EP2SGX60CF780C5 (without N suffix) is lead-free as well per Altera's transition. Halogen-free status not explicitly stated in the verified web data. AEC-Q100 not applicable for this commercial-temperature FPGA.
