EP2SGX60CF780C4N - 60K LEs Stratix II GX FPGA | Intel | 780-BGA
MPN: EP2SGX60CF780C4N β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $312.5 | $312.50 |
| 10 | $285 | $2,850.00 |
| 25 | $268 | $6,700.00 |
| 100 | $245 | $24,500.00 |
| 500 | $220 | $110,000.00 |
EP2SGX60CF780C4N Overview
What is an FPGA? A Field Programmable Gate Array is a semiconductor device based on a matrix of configurable logic blocks (CLBs) connected via programmable interconnect. FPGAs sit in the hierarchy of programmable logic: programmable logic device (PLD) -> complex programmable logic device (CPLD) -> FPGA -> SoC FPGA. Unlike fixed-function ASICs, FPGAs are reprogrammed in-circuit to implement custom digital logic, DSP pipelines, and high-speed serial interfaces, making them ideal for prototyping, low-volume production, and designs that need to evolve post-deployment.
Key features of the EP2SGX60CF780C4N include 364 user I/Os, support for numerous single-ended and differential I/O standards (LVDS, LVPECL, SSTL, HSTL, LVCMOS), embedded multipliers, and dedicated DSP blocks. The Stratix II GX family adds hardened multi-gigabit transceivers, making this device particularly suited for serial connectivity. Internal performance reaches up to 732 MHz and the device supports 1.2 V core operation with 717 MHz propagation delay characteristics.
The device uses a 90 nm CMOS process with embedded SRAM configuration memory, supporting in-system programmability via JTAG or passive/active serial configuration schemes. Its 780-ball FC-FBGA package (23 x 23 mm, 1 mm pitch, MS-034AAJ-1) exposes up to 20 full-duplex transceiver channels in larger family members and provides ample signal integrity for multi-gigabit serial links.
Typical applications include high-speed serial interface bridging (PCI Express, Serial RapidIO, Gigabit Ethernet, XAUI), communications infrastructure, broadcast video processing, military and aerospace signal processing, and high-performance DSP prototyping. The C4 speed grade in the operating temperature range is intended for commercial (0C to 85C) ambient conditions.
When designing with this device, careful attention must be paid to power distribution, decoupling, and PCB layer stack-up. The FC-FBGA-780 package requires a minimum of 6 PCB layers with controlled-impedance routing for high-speed transceivers. Quartus II design software (legacy) or Intel Quartus Prime (current) is required for synthesis, place-and-route, and configuration file generation.
This page synthesizes distributor pricing, drop-in same-package alternatives, design notes, and AI-citable FAQ answers to help engineers select, source, and integrate the EP2SGX60CF780C4N into next-generation high-speed digital systems.
Drop-in alternatives for EP2SGX60CF780C4N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX60CF780C4N (same form factor and footprint) β differing in Package, Speed Grade, Operating Temperature, RoHS Status, DSP Blocks.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2SGX60CF780C4
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View Datasheet βEP2SGX60CF780C3N
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View Datasheet βEP2SGX60CF780C
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View Datasheet βEP2SGX60CF780C3
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View Datasheet βEP2SGX60DF780C4N
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$365 / Unit
View Datasheet βEP2SGX60CF780C4N Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Device Type | FPGA - Field Programmable Gate Array |
| Logic Elements | 60,440 |
| LABs/CLBs | 3,022 |
| Number of I/Os | 364 |
| Total Memory Bits | 2,544,192 |
| Core Voltage | 1.2 V |
| Internal Frequency (max) | 732.1 MHz |
| Process Technology | 90 nm |
| Package | 780-BBGA (FC-FBGA, 23x23 mm, 1 mm pitch) |
| Package Code | MS-034AAJ-1, FBGA-780 |
| Mounting Type | Surface Mount |
| Operating Temperature | 0C to +85C (commercial, C4 speed grade) |
| Speed Grade | C4 |
| Configuration | SRAM-based, JTAG / Passive Serial / Active Serial |
EP2SGX60CF780C4N ms-034aaj-1, fbga-780 Pin Configuration Guide
Pin configuration for EP2SGX60CF780C4N (ms-034aaj-1, fbga-780 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX60CF780C4N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX60CF780C4N is suitable for 6 applications: Multi-Gigabit Serial Interface Bridging, High-Performance DSP and Signal Processing, Broadcast Video Processing and Routing, Military and Aerospace Signal Processing, Industrial Control and High-Speed Data Acquisition, Communications Infrastructure Line Cards.
Multi-Gigabit Serial Interface Bridging
The EP2SGX60CF780C4N integrates hardened multi-gigabit transceivers capable of up to 6.375 Gbps, making it well suited for serial protocol bridging applications such as PCI Express Gen1, Serial RapidIO, XAUI, and Gigabit Ethernet. The 60,440 logic elements and 2,544,192 bits of embedded memory provide sufficient resources to implement protocol stacks, MAC layers, and packet buffering alongside the physical coding sublayer. The 364 user I/Os allow side-band signals and parallel interfaces to be exposed simultaneously. In practice, the device bridges between a host CPU's PCIe link and backplane serial fabric without external PHY chips, which reduces BOM cost and PCB area in communications infrastructure line cards and baseband processing boards.
Recommended
High-Performance DSP and Signal Processing
The EP2SGX60CF780C4N includes dedicated DSP blocks and embedded multipliers that enable efficient implementation of FIR filters, FFTs, and baseband modulation/demodulation. With 60,440 logic elements and 3,022 LABs, designers can parallelize computation across hundreds of multipliers to achieve real-time processing of wideband signals. The 2,544,192 bits of embedded memory act as data buffers between sample streams and DSP pipelines. Typical DSP applications include radar baseband processing, software-defined radio baseband, and medical imaging front-ends. The 90 nm process gives predictable timing closure and the Quartus II DSP Builder accelerates MATLAB-to-FPGA flow.
Recommended
Broadcast Video Processing and Routing
The combination of high logic density, embedded memory, and 364 I/Os makes the EP2SGX60CF780C4N a strong fit for broadcast video processing equipment, including SDI/HD-SDI routing switchers, video format converters, and on-screen display generators. The multi-gigabit transceivers can drive SDI coaxial links directly at 270 Mbps, 1.485 Gbps, and 2.97 Gbps. Embedded memory absorbs line buffers, while the 364 I/Os support parallel bus connections to external video DACs/ADCs, HDMI transmitters, and processing companion chips. In a typical 3G-SDI router design, a single EP2SGX60CF780C4N replaces several discrete crosspoint switch ASICs.
Recommended
Military and Aerospace Signal Processing
The Stratix II GX family, including the EP2SGX60CF780C4N, has been widely used in military and aerospace applications such as electronic warfare, SIGINT processing, and avionics data concentrators. The device's high logic density and embedded transceivers support multi-channel wideband receivers, while the FC-BGA package provides the mechanical robustness required for vibration-sensitive environments when properly mounted. Although the C4 speed grade and the 0C to 85C commercial temperature range are the standard offering, Altera also offered industrial (I-grade) and military (M-grade) variants of the same die. The 90 nm process delivers deterministic timing that simplifies worst-case timing analysis required for DO-254 and similar certification programs.
Recommended
Industrial Control and High-Speed Data Acquisition
Industrial control and high-speed data acquisition systems benefit from the EP2SGX60CF780C4N's combination of 60K logic elements, embedded memory, and high pin count. The device can aggregate data from multiple high-speed ADCs, perform real-time digital filtering and decimation, and forward processed streams to host CPUs or to backplane serial fabric. The 364 user I/Os support LVDS and parallel ADC interfaces, while the 2,544,192 bits of memory buffer samples between acquisition and processing. Applications include ultrasound front-ends, industrial CT scanners, and high-channel-count vibration monitoring systems. The C4 commercial speed grade and 0-85C temperature range cover most indoor industrial environments.
Recommended
Communications Infrastructure Line Cards
The EP2SGX60CF780C4N is deployed in telecom and datacom line cards for protocol conversion, traffic management, and backplane aggregation. Its multi-gigabit transceivers handle backplane fabrics such as Serial RapidIO and custom serial links, while 60,440 logic elements implement lookup tables, packet classifiers, and QoS schedulers. The 2,544,192 bits of embedded memory function as packet buffer and queue memory. The 780-FBGA package exposes 364 user I/Os for parallel connections to network processors, TCAMs, and PHY chips. The 90 nm process provides the timing margin needed to meet the strict latency budgets of carrier-grade equipment, and the long-term availability of the Altera/Intel tool chain preserves the firmware investment.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX60CF780C4N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX60CF780C4 | EP2SGX60CF780C3N | EP2SGX60CF780C | EP2SGX60CF780C3 | EP2SGX60DF780C4N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 780-BBGA (FC-FBGA, 23x23 mm, 1 mm pitch) | 780-BBGA (FC-FBGA) - same | 780-BBGA (FC-FBGA) - same | 780-BBGA (FC-FBGA) - same | 780-BBGA (FC-FBGA) - same | 780-BBGA (FC-FBGA) - same |
| Logic Elements | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 (D-variant I/O config) |
| LABs/CLBs | 3,022 | 3,022 | 3,022 | 3,022 | 3,022 | 3,022 |
| Speed Grade | C4 | C4 | C3 (slower, ~10-15% lower Fmax) | C (unspecified speed grade) | C3 | C4 |
| Lead-Free (Pb-Free) Finish | Yes (N suffix) | No (legacy lead-bearing) | Yes | No | No | Yes |
| Process Technology | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Multi-Gigabit Transceivers | Yes (up to 12 channels, 6.375 Gbps) | Yes (same) | Yes (same) | Yes | Yes | Yes (D-variant transceiver count may differ) |
Key Differentiators
- Lead-free (Pb-free) termination finish for RoHS compliance (vs EP2SGX60CF780C4)
- C4 standard commercial speed grade with predictable timing (vs EP2SGX60CF780C5N)
- Standard 780-ball FC-FBGA footprint with 364 user I/Os (vs EP2SGX30CF780C4N)
Design Notes
The EP2SGX60CF780C4N requires multiple regulated rails: 1.2 V VCCINT (core), 2.5 V or 3.0 V VCCIO (per bank, I/O standard dependent), 1.2 V VCCA_PLL and VCCD_PLL, and a separate 1.2 V VCCHIP for transceivers. Per the Stratix II GX datasheet, total quiescent current for VCCINT alone can exceed 3 A in a fully utilized design, plus several amps on VCCIO. Use a 6-layer PCB with at least 2 oz copper on power planes, place low-ESR ceramic decoupling (10uF + 0.1uF) within 5 mm of every power pin, and add bulk polymer or tantalum capacitors rated for 3 A RMS ripple on each rail. Power-rail sequencing must be enforced if 3.0 V VCCIO is present before 1.2 V VCCINT.
The 780-ball FC-FBGA package at 1.0 mm pitch requires a 6-layer (minimum) PCB with microvia (laser-drilled) technology to fan out the inner-row balls. Trace width/space of 4 mil/4 mil is the practical minimum. Use a 1.0 mm pitch BGA land pattern with non-solder-mask-defined (NSMD) pads, with via-in-pad filled and plated over for the inner rows. The 23 x 23 mm package body places severe demands on PCB warp and coplanarity; specify a high-Tg (Tg >= 170C) PCB material such as FR408HR or Isola 370HR.
The 780-BGA package exhibits a junction-to-ambient thermal resistance (theta_JA) of approximately 12 C/W with a 1 m/s airflow and 6-layer PCB. Estimated: at 60% logic utilization, 100% transceiver utilization, and 1.2 V VCCINT at 4 A, the EP2SGX60CF780C4N dissipates approximately 4.8 W (1.2 V x 4 A core) plus transceiver power, giving a total of ~7-9 W. This raises the junction temperature by 84-108 C above ambient. A heatsink or a top-side heat spreader is recommended for closed enclosures. Avoid placing the device directly adjacent to high-power components; maintain at least 10 mm clearance to allow airflow.
Three pitfalls are common with the EP2SGX60CF780C4N: (1) leaving JTAG TCK/TMS/TDI/TDO floating - pull TCK, TMS, and TDI to known states with 4.7 kohm resistors; (2) failing to specify the configuration mode (Passive Serial, Active Serial, or JTAG) via MSEL pins, which causes the device to fail to configure; (3) using the wrong speed grade in critical timing paths - the C4 grade is the standard offering, but C5 offers higher Fmax at higher cost. Always run a full Quartus II timing analysis with the correct speed grade before committing the design to silicon.
Compliance Information
The N suffix indicates lead-free (Pb-free) termination. RoHS/REACH compliance certificates are not included in the verified web data; request from the authorized distributor. AEC-Q100 is not applicable (FPGA, not an automotive-grade part). The device is end-of-life per Altera/Intel product lifecycle.
