EP2SGX60CF780I4N - 60K LEs Stratix II GX FPGA, 780-FBGA | Altera
MPN: EP2SGX60CF780I4N β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $262.2 | $2,622.00 |
| 100 | $228 | $22,800.00 |
| 500 | $199.5 | $99,750.00 |
| 1,000 | $171 | $171,000.00 |
EP2SGX60CF780I4N Overview
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device whose logic, interconnect, and I/O behavior are configured by the end user via an HDL bitstream rather than at the factory. FPGAs occupy a middle ground between fixed-function ASICs (highest performance, lowest per-unit cost at volume) and microcontrollers (highest flexibility, lowest per-unit performance): they deliver ASIC-class data-path throughput while remaining reconfigurable in the field. Stratix II GX belongs to Altera's high-end transceiver-equipped family, targeting wireline communication, broadcast video, and high-speed serial bridging.
Key features include 12 PLLs (4 fast PLLs + 8 enhanced PLLs), 12 dedicated clock transceivers supporting 622 Mbps to 6.375 Gbps operation, a 1.2 V core supply (range 1.15 V to 1.25 V), and an industrial temperature grade (-40 Β°C to +100 Β°C case). The 90 nm CMOS process provides high logic density with on-chip termination, dynamic phase alignment, and pre-emphasis equalization for backplane and chip-to-chip serial links.
The architecture combines adaptive logic modules (ALMs) with embedded TriMatrix memory blocks (MRAM), allowing designers to build wide datapaths, protocol controllers, and DSP blocks at full chip frequency. Stratix II GX supports up to 16 global clock networks, 4 dedicated clocking PLLs for high-frequency synthesis, and 8 regional PLLs with dynamic reconfiguration capability for frequency margining and link-rate switching.
Typical applications include 10 Gbps Ethernet MAC/PHY bridging, PCI Express Gen1/Gen2 endpoint and root-port designs, Serial RapidIO switch fabrics, broadcast video processing (HD-SDI, 3G-SDI), telecom backplane aggregation, and high-end test-and-measurement instrumentation where reconfigurable high-speed serial I/O is required.
When designing with this device, ensure your PCB meets the FC-FBGA-780 land-pattern requirements (1.0 mm pitch microvia stack-ups), provide independent analog supply rails for the transceiver PLLs, and select the correct speed grade for your target transceiver line rate. Bitstream configuration requires a compatible Altera/Intel Quartus II programmer.
This page synthesizes distributor pricing, Stratix II GX family drop-in alternatives, and practical design notes not consolidated in the manufacturer datasheet.
Drop-in alternatives for EP2SGX60CF780I4N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX60CF780I4N (same form factor and footprint) β differing in Package, Speed Grade, DSP Blocks, RoHS Status, Internal Frequency (max).
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2SGX60CF780C7
β Drop-Inβ In Stock
$215 / Unit
View Datasheet βEP2SGX60CF780C5N
β Drop-Inβ In Stock
$485 / Unit
View Datasheet βEP2SGX60CF780C5
β Drop-Inβ In Stock
$162 / Unit
View Datasheet βEP2SGX60CF780C4N
β Drop-Inβ In Stock
$220 / Unit
View Datasheet βEP2SGX60CF780C4
β Drop-Inβ In Stock
$171 / Unit
View Datasheet βEP2SGX60CF780C3N
β Drop-Inβ In Stock
$285 / Unit
View Datasheet βEP2SGX60CF780C3
β Drop-Inβ In Stock
$870 / Unit
View Datasheet βEP2SGX60CF780I4N Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Device Type | FPGA |
| Logic Elements | 60,440 |
| Logic Blocks / CLBs | 60,440 |
| Embedded Memory | 2,542 Kbit (TriMatrix) |
| Number of Transceivers | Up to 20 |
| Transceiver Data Rate | 622 Mbps to 6.375 Gbps |
| Core Supply Voltage | 1.2 V (range 1.15 V to 1.25 V) |
| Maximum Internal Frequency | 717 MHz |
| Process Technology | 90 nm CMOS |
| Number of PLLs | 12 (4 fast + 8 enhanced) |
| Global Clock Networks | 16 |
| Package Type | FC-FBGA-780 (BGA-780) |
| Package Size | 23 x 23 mm |
| Ball Pitch | 1.0 mm |
| Operating Temperature Grade | Industrial |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
EP2SGX60CF780I4N 23 x 23 mm Pin Configuration Guide
Pin configuration for EP2SGX60CF780I4N (23 x 23 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX60CF780I4N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX60CF780I4N is suitable for 6 applications: 10 Gigabit Ethernet Bridging, PCI Express Endpoint and Root Port, Serial RapidIO Switch Fabric, Broadcast HD-SDI / 3G-SDI Video Processing, Telecom Backplane Aggregation, High-End Test and Measurement Instrumentation.
10 Gigabit Ethernet Bridging
The EP2SGX60CF780I4N fits 10 Gigabit Ethernet bridging because its 20 transceivers support 6.375 Gbps line rates needed for XAUI and 10GBASE-CX4 aggregation. Its 60,440 logic elements provide sufficient datapath width for MAC-layer protocol handling and frame buffering, while the 2,542 Kbit TriMatrix memory supplies sufficient packet storage for cut-through forwarding. Placed as the central protocol bridge between switch ASICs and SFP+ or backplane interfaces, the FPGA adds CRC validation and statistics counters; unlike a fixed-function ASSP, it can be reconfigured when new Ethernet MAC extensions appear, though it dissipates more power than a hard-macro ASIC at equivalent throughput.
Recommended
PCI Express Endpoint and Root Port
The EP2SGX60CF780I4N suits PCI Express Gen1 (2.5 Gbps) and Gen2 (5.0 Gbps) endpoint and root-port designs because its transceivers natively support the PCIe PHY electrical layer. Its 60,440 logic elements and 12 PLLs are sufficient for x8 or x4 lane PCIe hard IP plus application logic in parallel, while the 780-ball FC-FBGA provides necessary pin count for full lane-width interfaces. Designers use it in industrial PCs and telecom cards where flexible PCIe integration is required; compared to a discrete PCIe switch, it integrates transaction-layer and data-link-layer logic on-chip, but requires careful signal-integrity design on the 100-ohm differential pairs.
Recommended
Serial RapidIO Switch Fabric
The EP2SGX60CF780I4N enables Serial RapidIO switch fabric implementations because its 20 multi-gigabit transceivers support 1.25 Gbps, 2.5 Gbps, and 3.125 Gbps SRIO lane rates required for backplane DSP clusters. Its 60,440 logic elements can hold a 4-port or 8-port SRIO switch with congestion management and routing tables, while the embedded TriMatrix memory holds packet buffers. Placed in telecom base-station baseband cards, it serves as the fabric interconnect between multiple DSPs; unlike a fixed SRIO switch ASSP, it can be reconfigured for custom congestion algorithms, though the 90 nm process results in higher dynamic power than newer 28 nm SRIO switches.
Recommended
Broadcast HD-SDI / 3G-SDI Video Processing
The EP2SGX60CF780I4N matches broadcast HD-SDI (1.485 Gbps) and 3G-SDI (2.97 Gbps) video processing applications because its transceivers handle SDI data rates natively and the 60,440 logic elements accommodate real-time up/down/cross-conversion, color-space conversion, and frame-rate conversion logic. The 2,542 Kbit TriMatrix memory supplies sufficient line-buffer storage for multi-tap video filtering, while the 16 global clock networks enable independent video timing domains. Placed between camera inputs and production switchers, it functions as a software-defined video processor; unlike fixed-function video ASSPs, it adapts to new broadcast formats without board redesign, though video-grade power filtering is required to meet SMPTE jitter masks.
Recommended
Telecom Backplane Aggregation
The EP2SGX60CF780I4N fits telecom backplane aggregation because its 20 transceivers support multiple standard backplane protocols (CEI-6G, SRIO, PCIe, XAUI) from a single device, and its 60,440 logic elements handle protocol multiplexing and payload extraction. Its industrial temperature grade (-40 C to +100 C case) is required for telecom-outdoor deployments, and the 1.2 V core with dedicated PLL analog rails simplifies multi-card chassis power design. Placed on ATCA or proprietary backplane line cards, it aggregates traffic from multiple framer/MAC ASICs; compared to a discrete SERDES bank, it integrates dynamic reconfiguration to switch between protocols without FPGA re-bitstream, though careful SI simulation is required for 6.375 Gbps backplane channels.
Recommended
High-End Test and Measurement Instrumentation
The EP2SGX60CF780I4N suits high-end test-and-measurement instrumentation such as logic analyzers, protocol exercisers, and BERT testers because its 20 transceivers can simultaneously drive and capture multiple high-speed serial lanes at 6.375 Gbps. The 60,440 logic elements hold pattern-matching state machines, error counters, and protocol-aware triggers, while the 2,542 Kbit TriMatrix memory buffers captured trace data. Placed as the central acquisition engine in a bench-top protocol analyzer, it captures live traffic at full line rate; unlike fixed-function protocol testers, engineers can add new protocol decoders via reconfiguration, but the 90 nm 1.2 V core draws more power than newer 28 nm test ASICs in equivalent continuous-capture modes.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX60CF780I4N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX60CF780C7 | EP2SGX60CF780C5N | EP2SGX60CF780C5 | EP2SGX60CF780C4N | EP2SGX60CF780C3N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | FC-FBGA-780 (23x23 mm, 1.0 mm pitch) | FC-FBGA-780 - same | FC-FBGA-780 - same | FC-FBGA-780 - same | FC-FBGA-780 - same | FC-FBGA-780 - same |
| Logic Elements | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 |
| Temperature Grade | Industrial (-40 C to +100 C) | Commercial | Commercial | Commercial | Commercial | Commercial |
| Speed Grade | I4 (industrial) | C7 (fastest) | C5 | C5 | C4 | C3 (slowest) |
| Number of Transceivers | Up to 20 | Up to 20 | Up to 20 | Up to 20 | Up to 20 | Up to 20 |
| Max Transceiver Data Rate | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps | 6.375 Gbps |
| Core Voltage | 1.2 V (1.15 V to 1.25 V) | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| RoHS Status | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Key Differentiators
- Industrial temperature grade variant of the Stratix II GX family (vs EP2SGX60CF780C5N)
- Higher speed-grade than the slowest Stratix II GX variants (vs EP2SGX60CF780C3N)
- 20 integrated multi-gigabit transceivers up to 6.375 Gbps (vs Non-GX Stratix II variants (EP2S60F780C5N))
Design Notes
The 780-ball FC-FBGA package at 1.0 mm pitch requires a microvia PCB stack-up with at least 4-6 routing layers under the device. Decoupling: place 0.1 uF X7R capacitors as close as possible to every VCCIO/VCCINT ball group, with bulk 22 uF tantalum or polymer capacitors at each supply plane. Transceiver analog supplies (VCCR, VCCT, VCCH) require isolated power planes with ferrite-bead isolation from digital supplies to meet 6.375 Gbps jitter masks. Estimated: with all 20 transceivers active at 6.375 Gbps, core power dissipation can reach 15-20 W, so a thermal via array under the BGA substrate is required.
Transceiver differential pairs (RX and TX) must be routed as 100-ohm controlled-impedance differential with intra-pair skew under 1 ps. Maintain length matching within 5 mils across the entire channel and use AC-coupled coupling capacitors (typically 100 nF X7R) at the TX serial outputs. For backplane applications, de-emphasis and pre-emphasis settings in the ALTGX megafunction must be tuned against measured channel S-parameters to meet the eye-mask at the receiver side.
Do not apply power to the device before MSEL pins are strapped and configuration mode is selected, or the FPGA may latch into an undefined state. The ALTGX transceiver reset sequence requires specific PLL lock delays before data is valid, otherwise transceivers output random data. Quiescent current is approximately 500 mA per transceiver at 6.375 Gbps; power-rail sequencing must ramp 1.2 V core before 2.5 V/3.3 V transceiver analog supplies to prevent latch-up. Do not exceed the Stratix II GX absolute maximum junction temperature of 125 C; provide thermal monitoring via the on-die temperature-sensing diode.
Compliance Information
RoHS compliance per Altera product page. AEC-Q100 is not applicable because this is an FPGA, not an automotive-grade discrete IC. Reach and halogen-free status not explicitly listed in the verified data.
