EP2SGX60EF1152I4N - 60,440-LCell FPGA, 717 MHz | Intel
MPN: EP2SGX60EF1152I4N β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
EP2SGX60EF1152I4N Overview
An FPGA, or field-programmable gate array, is an integrated circuit containing programmable logic elements, routing resources, and configurable I/O. Its architecture can be reprogrammed after manufacturing, unlike an application-specific integrated circuit. FPGAs occupy the programmable-logic branch of digital semiconductors and are commonly used for parallel processing, protocol implementation, signal processing, and adaptable interface hardware.
The device is identified as a member of the Stratix II GX family. Verified data gives 60,440 logic cells, 2,544,192 bits of memory, 534 I/O, a 717 MHz internal frequency, a 1.2 V supply, and 1,152-ball FBGA packaging. These characteristics make the component suitable for systems requiring substantial programmable logic capacity and a large number of external connections. The GX family positioning also supports communications-oriented designs, although the supplied data does not enumerate individual transceiver parameters.
The FPGA architecture combines programmable logic with embedded memory and configurable I/O. The exact logic-element architecture, process technology, transceiver count, phase-locked-loop count, maximum user I/O frequency, and supported memory interface speeds are not provided in the verified web data. Engineers should therefore consult the manufacturer datasheet and associated device handbook before selecting the part for timing closure, power estimation, configuration, or signal-integrity analysis.
Typical applications include communications equipment, industrial automation, test and measurement systems, video and image processing, and custom interface controllers. The 534 I/O count is useful when many external devices, buses, sensors, or converters must be connected. The 60,440 logic cells provide capacity for parallel datapaths, protocol handling, and state-machine-rich control logic, while the 717 MHz internal-frequency figure provides a reference point for architecture planning.
A critical design consideration is PCB implementation. A 1,152-ball FBGA requires controlled impedance routing, appropriate via construction, layer-stack planning, clean power distribution, and extensive signal-integrity verification. The supplied sources do not include a verified ball map, package drawing document, timing model, power data, or configuration details, so those items must be obtained from the manufacturer documentation before schematic release.
This page consolidates distributor specifications, family identity, package information, sourcing context, and drop-in-selection constraints. Exact stock, quantity pricing, lifecycle classification, pinout, transceiver resources, and device-grade details remain subject to manufacturer documentation and current distributor confirmation.
Drop-in alternatives for EP2SGX60EF1152I4N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX60EF1152I4N (same form factor and footprint) β differing in Package, Speed Grade, Operating Temperature, Mounting Type, Process Technology.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2SGX60EF1152I4
β Drop-Inβ In Stock
$1395 / Unit
View Datasheet βEP2SGX60EF1152C5N
β Drop-Inβ In Stock
$3300 / Unit
View Datasheet βEP2SGX60EF1152C4N
β Drop-Inβ In Stock
$1350 / Unit
View Datasheet βEP2SGX60EF1152C3N
β Drop-Inβ In Stock
$2195 / Unit
View Datasheet βEP2SGX60E1152C
β Drop-Inβ In Stock
$1218 / Unit
View Datasheet βEP2SGX60EF1152I4N Maximum Ratings & Electrical Characteristics
| Device Type | FPGA |
| Product Family | Stratix II GX |
| Logic Cells | 60,440 |
| Embedded Memory | 2,544,192 bits |
| I/O Count | 534 |
| Internal Frequency | 717 MHz |
| Supply Voltage | 1.2 V |
| Package | 1,152-ball FBGA |
| Package Type | Other, 23 x 23 mm, 1 mm pitch, MS-034AAJ-1, FBGA-484 |
| Pins | 484 |
| Device Technology | 90 nm |
| Logic Blocks | 3,022 LABs |
| Mounting Type | Surface mount |
| Operating Temperature Grade | Industrial |
EP2SGX60EF1152I4N other, 23 x 23 mm, 1 mm pitch, ms-034aaj-1, fbga-484 Pin Configuration Guide
Pin configuration for EP2SGX60EF1152I4N (other, 23 x 23 mm, 1 mm pitch, ms-034aaj-1, fbga-484 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX60EF1152I4N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX60EF1152I4N is suitable for 6 applications: Communications Equipment, Industrial Automation Controllers, Video and Image Processing, Test and Measurement Systems, High-Speed Interface Bridging, Custom Digital Signal Processing.
Communications Equipment
EP2SGX60EF1152I4N is suitable for communications equipment that needs configurable digital processing and many external connections. The device provides 60,440 logic cells for parallel datapaths, protocol handling, packet transformation, and control logic, while 2,544,192 embedded-memory bits can support buffering and state storage. Its 534 I/O pins allow the FPGA to interface with converters, memories, backplanes, and supervisory components. The Stratix II GX family positioning is relevant to communications-oriented designs, but the supplied data does not specify transceiver count or line rate, so those requirements must be verified separately. Use the FPGA when flexibility and integration outweigh the need for a fixed function. Confirm clocking, power, thermal behavior, and configuration requirements from the official documentation before release.
Recommended
Industrial Automation Controllers
EP2SGX60EF1152I4N can serve as a programmable controller or interface hub in industrial automation systems. The 60,440 logic cells provide capacity for state machines, motion sequencing, protocol conversion, and parallel control algorithms. The 534 I/O pins are particularly useful when the design must connect to sensors, actuators, encoders, analog-to-digital converters, and field-service interfaces. Embedded memory of 2,544,192 bits can hold temporary process data and buffering structures. The supplied data identifies an industrial temperature grade, but detailed environmental ratings are not included, so qualification must be confirmed. A 1,152-ball FBGA requires controlled impedance and careful power-distribution layout. Validate signal integrity, isolation boundaries, clock distribution, and thermal margins against the end equipment requirements.
Recommended
Video and Image Processing
EP2SGX60EF1152I4N is a reasonable candidate for video and image-processing subsystems that benefit from parallel programmable datapaths. Its 60,440 logic cells can implement pixel transformations, frame synchronization, color-space conversion, filtering, and custom control functions. The 2,544,192 embedded-memory bits provide a resource for line buffers, FIFOs, and intermediate storage, while 534 I/O pins support cameras, displays, memory devices, and parallel image interfaces. The internal-frequency listing of 717 MHz provides a reference for architecture and timing planning, but it is not a guaranteed application clock. The supplied data does not identify supported video IP, external-memory interfaces, or exact power requirements. Engineers should confirm bandwidth, latency, clock-domain, image-resolution, and thermal requirements before selecting the FPGA.
Recommended
Test and Measurement Systems
EP2SGX60EF1152I4N can support configurable acquisition, timing, stimulus, and analysis functions in test and measurement equipment. The FPGAβs 60,440 logic cells allow multiple instrument functions to be implemented in parallel, while 2,544,192 embedded-memory bits can support sample buffering and temporary analysis data. Its 534 I/O pins provide flexibility for connecting analog converters, sensors, displays, control interfaces, and synchronization signals. The 717 MHz internal-frequency figure can help establish an architecture envelope, but the supplied data does not specify measured bandwidth, jitter, conversion-interface support, or deterministic latency. Use the device when programmability is needed to support several measurement modes or evolving protocols. Confirm analog-front-end timing, I/O electrical standards, clock quality, and calibration requirements with the official device documentation.
Recommended
High-Speed Interface Bridging
EP2SGX60EF1152I4N can be used as a configurable bridge between processors, converters, memories, and custom peripherals. The 534 I/O pins are valuable for applications that aggregate several buses or translate protocol timing without a fixed-function ASIC. The 60,440 logic cells can implement protocol framing, error detection, flow control, and data formatting, while 2,544,192 embedded-memory bits can provide FIFOs and elasticity buffers. The GX family name supports a communications-oriented use case, but no verified transceiver count or maximum serial data rate is supplied. Before using the device for high-speed interfaces, confirm the available I/O standards, transceiver resources if required, reference-clock architecture, signal-integrity budget, and termination scheme. A 1,152-ball FBGA implementation should be planned with controlled impedance and verified through post-layout simulation.
Recommended
Custom Digital Signal Processing
EP2SGX60EF1152I4N is suitable for custom digital signal processing where parallel computation and configurable data movement are required. The 60,440 logic cells can implement filters, transforms, encoders, decoders, and adaptive control structures, while 2,544,192 embedded-memory bits can hold coefficients, samples, and intermediate results. Its 534 I/O pins support multiple synchronous or asynchronous interfaces, making the device useful in systems that combine processing with external control. The 717 MHz internal-frequency listing is an architecture reference, not a guaranteed DSP clock, because the achievable performance depends on implementation, routing, memory, and thermal conditions. The supplied data does not provide DSP block count, multiplier specifications, or power figures. Confirm those items and run synthesis, place-and-route, and timing closure on the intended device version.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX60EF1152I4N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX60EF1152I4 | EP2SGX60EF1152C5N | EP2SGX60EF1152C4N | EP2SGX60EF1152C3N | EP2SGX60E1152C |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1,152-ball FBGA | 1,152-ball FBGA | 1,152-ball FBGA | 1,152-ball FBGA | 1,152-ball FBGA | 1,152-ball FBGA |
| Ordering-Grade Evidence | Industrial I4N ordering code | I4 ordering variant | C5N ordering variant | C4N ordering variant | C3N ordering variant | C ordering variant |
Key Differentiators
- High verified logic capacity for programmable processing (vs EP2SGX30DF780I4N)
- Large embedded-memory resource (vs EP2SGX60EF1152C5N)
- High external-interface capacity (vs EP2SGX90EF1152C5N)
- Communications-family positioning with configurable logic (vs EP2S60F484I4N)
Design Notes
Use the manufacturer power-estimation flow for the exact configuration rather than applying a generic FPGA power value. Start with the listed 1.2 V core supply, then determine the actual rail set, tolerances, sequencing, transient current, and decoupling from the official documentation. Estimate current from the designβs utilized logic, memory, clocks, I/O switching, and configuration mode. A 1,152-ball FBGA requires a low-impedance power distribution network; place decoupling close to the associated balls, provide adequate bulk capacitance, and verify voltage droop during simultaneous I/O activity. Do not treat the 717 MHz internal-frequency listing as a power-clock specification.
Plan the PCB stack-up and escape routing before schematic freeze. The verified results identify a 1,152-ball FBGA, so the actual ball map and package drawing are essential for correct escape, via placement, and fanout. Use controlled-impedance routing for high-speed clocks and differential interfaces, minimize via transitions, and maintain reference-plane continuity under critical signals. Confirm ball numbering, power and ground groups, differential-pair assignments, and unused-ball treatment from the manufacturer package documentation. The alternate FBGA-484 description is unresolved and must not be used to create a footprint until the exact ordering-code package is confirmed.
Validate every high-speed interface with the actual I/O standard, termination scheme, clock topology, and receiver or transmitter requirements. The supplied data confirms 534 I/O pins but does not provide per-pin standards, maximum toggle rates, transceiver count, or jitter limits. Keep clock and high-speed traces short, avoid layer transitions where possible, maintain continuous reference planes, and perform post-layout simulation using the selected device and speed grade. Separate noisy switching regions from sensitive clocks and analog support circuitry, and verify power-rail impedance at the relevant frequencies. These steps are particularly important when using the FPGA as a communications or measurement interface.
Thermal analysis must use the actual utilization, switching activity, I/O load, and configuration of the compiled design. The supplied data identifies a 1,152-ball FBGA and 1.2 V supply but provides no thermal resistance, maximum junction temperature, or power-consumption figure. Use the manufacturer thermal model to estimate junction temperature from the computed power and selected PCB environment, including copper area, airflow, adjacent components, and enclosure conditions. Keep thermal vias under the permitted package regions, follow the package land pattern, and check the assembled board with thermocouples or equivalent validation. A 717 MHz internal-frequency reference is not sufficient for a thermal estimate.
Do not infer pin compatibility from a family name, a distributor comparison page, or a search-result similarity score. The supplied cross-reference material mentions several Intel MPNs but does not verify a complete ball map, identical I/O assignments, equivalent timing, or identical configuration behavior. Before substituting a part, obtain the official cross-reference, confirm the exact package and ordering code, compare all rails and supported I/O standards, regenerate the device constraints, and rerun synthesis, timing, power, and board-level simulations. Also distinguish the verified 1,152-ball FBGA description from the conflicting FBGA-484 result; package ambiguity is a board-design stop condition, not a cosmetic detail.
Compliance Information
The supplied verified web data does not provide RoHS, REACH, lead-free, halogen-free, conflict-minerals, or AEC-Q100 evidence. The industrial temperature-grade description is not treated as AEC-Q100 qualification.
