EP2SGX60EF1152C5 - Stratix II GX FPGA, 60K LE, 1152-FBGA | Intel
MPN: EP2SGX60EF1152C5 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1720 | $17,200.00 |
| 100 | $1560 | $156,000.00 |
| 250 | $1450 | $362,500.00 |
| 500 | $1380 | $690,000.00 |
EP2SGX60EF1152C5 Overview
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that sits in the IC hierarchy between CPLDs and structured ASICs. It uses a matrix of configurable logic blocks (LABs/CLBs) embedded in a programmable interconnect fabric, augmented with hardened blocks such as transceivers, DSP slices, and block RAM. Stratix II GX family members are designed for high-speed serial I/O and embedded-transceiver-rich applications where general-purpose FPGAs lack the bandwidth.
Key specifications include 60,440 logic elements, 3,022 LABs/CLBs, 2,544,192 bits of embedded RAM (approximately 311 kbyte), 484 pins in a 1152-ball BGA, and a core supply of 1.15 V to 1.25 V. The device also integrates up to 20 transceivers and supports high-performance parallel I/O standards including LVDS, LVPECL, HSTL, and SSTL for memory and backplane interfaces.
Architecturally, the Stratix II GX uses an adaptive logic module (ALM) fabric paired with TriMatrix embedded memory that supports true dual-port, simple dual-port, and single-port modes with parity and ECC options. A network of dedicated high-speed serial transceivers handles multi-gigabit links, while the surrounding periphery offers programmable I/O banks supporting single-ended and differential signaling. This combination allows designers to consolidate what would otherwise be a discrete ASSP plus glue logic onto a single programmable device.
Typical applications include high-speed serial backplane bridging, wireless baseband prototyping, video broadcast infrastructure, ASIC prototyping/emulation, and high-performance DSP co-processing. The combination of high logic density and transceiver-rich I/O is well suited to telecom line cards, test and measurement equipment front-ends, and defense signal-processing platforms.
When designing with this device, plan the PCB for a high-layer-count stack-up to fan out the 1,152-ball BGA, and ensure that the 1.15 V to 1.25 V core rail is decoupled with low-impedance ceramic capacitors close to the package. This page synthesizes distributor pricing, drop-in Stratix II GX alternatives, and design notes not found in the manufacturer datasheet.
Drop-in alternatives for EP2SGX60EF1152C5 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX60EF1152C5 (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, Mounting Type, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2SGX60EF1152C4
✅ Drop-In✓ In Stock
$1067.86 / Unit
View Datasheet →EP2SGX60EF1152C3
✅ Drop-In✓ In Stock
$2210 / Unit
View Datasheet →EP2SGX60EF1152C4N
✅ Drop-In✓ In Stock
$1350 / Unit
View Datasheet →EP2SGX60EF1152C3N
✅ Drop-In✓ In Stock
$2195 / Unit
View Datasheet →EP2SGX60EF1152C4K
✅ Drop-In✓ In Stock
$1250 / Unit
View Datasheet →EP2SGX60EF1152C5 Maximum Ratings & Electrical Characteristics
| Device Family | Stratix II GX |
| Logic Elements | 60,440 |
| LABs / CLBs | 3,022 |
| Total RAM Bits | 2,544,192 |
| Number of I/Os | 534 |
| Package Type | 1152-FBGA |
| Package Dimensions | 35 x 35 mm |
| Core Supply Voltage | 1.15 V to 1.25 V |
| Internal Operating Frequency | Up to 717 MHz |
| Mounting Type | Surface Mount |
| Operating Temperature Grade | Commercial (0C to +85C) |
EP2SGX60EF1152C5 35 x 35 mm Pin Configuration Guide
Pin configuration for EP2SGX60EF1152C5 (35 x 35 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX60EF1152C5.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX60EF1152C5 is suitable for 6 applications: High-Speed Serial Backplane Bridging, Wireless Baseband Prototyping, Video Broadcast Infrastructure, ASIC Prototyping and Emulation, Test and Measurement Front-End, Defense Signal-Processing Platforms.
High-Speed Serial Backplane Bridging
The EP2SGX60EF1152C5's integrated multi-gigabit transceivers and 60,440 logic elements make it ideal for high-speed serial backplane bridging in telecom line cards and chassis interconnect. Placed on the line-card side of an Advanced TCA or proprietary backplane, the FPGA converts between SRIO, XAUI, PCIe, and custom serial protocols at line rates up to 6.375 Gbps per channel. The 2,544,192-bit TriMatrix memory (about 311 kbyte) absorbs short bursts and assists packet re-ordering, while the 534 user I/Os drive parallel data planes to ASSPs or ASICs. Compared with a discrete ASSP plus glue logic, the EP2SGX60EF1152C5 collapses BOM cost and shortens time-to-market.
Recommended
Wireless Baseband Prototyping
With 60,440 logic elements and 717 MHz internal fabric speed, the EP2SGX60EF1152C5 is well suited to wireless baseband prototyping for LTE, WiMAX, and proprietary PHY layers. Designers instantiate FFTs, channelizers, and LDPC encoders in the ALM fabric while reserving block RAM for soft-decision buffers. The 534 user I/Os bridge to RF front-end DAC/ADC sample buses at rates exceeding 200 MHz LVDS, and the integrated transceivers carry CPRI/OBSAI links to the baseband board. Use the C5 speed grade for the highest timing closure at 717 MHz; the C4 grade offers ~10-15% slower timing at lower cost for early prototyping.
Recommended
Video Broadcast Infrastructure
The EP2SGX60EF1152C5 fits video broadcast infrastructure for SD/HD/3G-SDI routers, MPEG/JPEG 2000 codec platforms, and frame synchronizers. Its 534 I/Os accept 10/12-bit parallel video buses at 148.5 MHz (3G-SDI) and beyond, while 2,544,192 bits of block RAM provide line buffers and motion-estimation scratch space. The Stratix II GX ALM fabric runs multi-stream transcoding pipelines in real time, and integrated transceivers drive SDI optical links or DVB-ASI transport streams. The 35x35 mm 1152-FBGA package concentrates high I/O density for blade-style broadcast chassis.
Recommended
ASIC Prototyping and Emulation
The 60,440-logic-element density of the EP2SGX60EF1152C5 makes it a viable ASIC prototyping and emulation vehicle for medium-complexity SoCs. Multi-FPGA partitioning tools map gate-level netlists into the ALM fabric; the 717 MHz internal frequency supports gate-array emulation at useful speeds. With 2,544,192 embedded-memory bits, the device emulates SRAM/ROM macros without external memory. The 1,152-ball FBGA exposes 534 user I/Os for chip-I/O model verification at LVDS/HSTL/SSTL rates. Compared with custom ASIC bring-up, the EP2SGX60EF1152C5 reduces time-to-first-silicon by weeks.
Recommended
Test and Measurement Front-End
The EP2SGX60EF1152C5 sits at the front end of test and measurement equipment such as logic analyzers, protocol exercisers, and bit-error-rate testers. Its 534 user I/Os accept high-speed probe data, while 2,544,192 bits of embedded RAM store pattern-capture buffers. The integrated multi-gigabit transceivers drive serial-protocol stimulus lanes such as PCIe Gen1/2, SATA, and XAUI. Internal fabric at 717 MHz enables inline state-machine pattern matching in real time, critical for BERT and protocol-compliance test sets.
Recommended
Defense Signal-Processing Platforms
The EP2SGX60EF1152C5 supports defense signal-processing platforms such as radar front-end pre-processing, electronic-countermeasure (ECM) waveform generators, and software-defined-radio (SDR) modems. The ALM fabric implements FFTs, pulse-compression filters, and adaptive-beamforming weights, while the integrated transceivers carry gigabit-Ethernet or Aurora links to backplane payloads. The 2,544,192-bit block RAM serves as fast coefficient or sample storage, and the 534 user I/Os accept LVDS ADC data from RF digitizers. The 35x35 mm 1152-FBGA package enables compact ruggedized board layouts with adequate thermal dissipation.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX60EF1152C5 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX60EF1152C4 | EP2SGX60EF1152C3 | EP2SGX60EF1152C4N | EP2SGX60EF1152C3N | EP2SGX60EF1152C4K |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-FBGA (35x35 mm) | 1152-FBGA (35x35 mm) - same | 1152-FBGA (35x35 mm) - same | 1152-FBGA (35x35 mm) - same | 1152-FBGA (35x35 mm) - same | 1152-FBGA (35x35 mm) - same |
| Speed Grade | C5 (fastest) | C4 | C3 | C4 | C3 | C4 |
| Logic Elements | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 |
| Total RAM Bits | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 |
| User I/Os | 534 | 534 | 534 | 534 | 534 | 534 |
| Core Voltage | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V |
Key Differentiators
- C5 speed grade offers the fastest timing closure in the Stratix II GX family (vs EP2SGX60EF1152C4)
- Same 1,152-ball FBGA footprint as the entire EP2SGX60EF1152 family (vs Cross-brand Xilinx Virtex-5 FPGAs)
- Integrated multi-gigabit transceivers on the same die (vs EP2S60F484I5 (non-GX Stratix II variant))
Design Notes
Estimated: The 1,152-ball FBGA at 1 mm ball pitch requires at least an 8-layer PCB stack-up with microvia (laser-drilled) escape routing for the inner-row balls. Allow a 4-6 mil trace width and 4-6 mil dielectric spacing in the breakout region. Per the Stratix II GX device handbook, provide continuous ground and power planes under the package to control impedance for LVDS/HSTL signals, and place 0.1 uF plus 10 uF decoupling capacitors within 200 mil of every supply pin.
Estimated: With 60,440 logic elements running at 717 MHz, the EP2SGX60EF1152C5 can dissipate 5-8 W depending on toggle rate. Use thermal vias under the package center pad and provide a topside copper pour for heatsinking. Refer to Altera's PowerPlay Early Power Estimator (EPE) for accurate dissipation modeling before committing to a thermal solution.
Do not mix I/O standards within the same I/O bank without consulting the Stratix II GX handbook - certain standards share reference voltages and cannot coexist. Configuration mode (AS, PS, JTAG) must be selected via MSEL pins before power-up; changing modes during operation corrupts configuration. Always include a 100 ohm differential termination at the high-speed transceiver RX inputs unless the protocol-specific block disables it internally.
Compliance Information
RoHS/REACH/lead-free status not explicitly stated in the Verified Web Data for the EP2SGX60EF1152C5 base MPN. Variants with N suffix (e.g. EP2SGX60EF1152C4N) are lead-free per Altera ordering information. AEC-Q100 not applicable - this is an FPGA, not an automotive-qualified ASIC.
