EP2SGX90EF1152C5 - Stratix II GX FPGA 90K LEs 1152-FBGA | Intel
MPN: EP2SGX90EF1152C5 β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $320 | $320.00 |
| 10 | $295 | $2,950.00 |
| 100 | $268 | $26,800.00 |
| 500 | $245 | $122,500.00 |
| 1,000 | $225 | $225,000.00 |
EP2SGX90EF1152C5 Overview
A Field Programmable Gate Array (FPGA) is a programmable logic device built from configurable logic blocks, programmable interconnects, and dedicated hard IP such as transceivers, block RAM, and DSP blocks. FPGAs sit in the wider taxonomy of programmable logic devices, alongside CPLDs, and are widely used as application-specific accelerators in place of fixed-function ASICs. The Stratix II GX family, specifically, adds embedded transceivers that distinguish it from general-purpose Stratix II devices for serial connectivity.
Key differentiating specifications include 4,520,448 total RAM bits, 558 dedicated 18x18 multipliers for DSP workloads, integrated multi-gigabit transceivers, and a core voltage range of 1.15 V to 1.25 V. The 1152-ball FCBGA package supports the high I/O count required by parallel memory buses and multi-channel serial links simultaneously. Combined with 90 nm process technology, the device balances logic density with low-jitter transceiver performance.
Architecturally, the Stratix II GX uses an ALM-based logic fabric with adaptive look-up tables, dedicated on-chip memory blocks, and embedded transceivers capable of rates commonly used in 2005-2010 generation telecom and storage backplanes. The 558 embedded multipliers enable high-throughput DSP pipelines without consuming general logic, while 4.5 Mbits of RAM are distributed across TriMatrix memory blocks for flexible buffering.
Typical applications include high-speed serial backplane aggregation, telecom line cards, broadcast video processing, military secure communications, and ASIC prototyping. The combination of logic density and integrated transceivers also makes it suitable for software-defined radio front-ends and test equipment requiring parallel DSP.
When designing with this FPGA, allocate sufficient decoupling across VCCINT, VCCA, and transceiver supply rails, and follow Intel/Altera's pinout guidelines for the 1152-ball FCBGA. Designers should also confirm Quartus II support versions match the device before board bring-up.
This page synthesizes distributor stock, drop-in Stratix II GX alternatives, and design guidance that the manufacturer datasheet alone does not provide in a single view.
Drop-in alternatives for EP2SGX90EF1152C5 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX90EF1152C5 (same form factor and footprint) β differing in Package, Operating Temperature, Speed Grade, Transceivers, RoHS Status.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2SGX90EF1152C5N
β Drop-Inβ In Stock
$1380 / Unit
View Datasheet βEP2SGX90EF1152C4
β Drop-Inβ In Stock
$890 / Unit
View Datasheet βEP2SGX90EF1152C3
β Drop-Inβ In Stock
$1180 / Unit
View Datasheet βEP2SGX90EF1152C4N
β Drop-Inβ In Stock
$695 / Unit
View Datasheet βEP2SGX90EF1152C4ES
β Drop-Inβ In Stock
$305 / Unit
View Datasheet βEP2SGX90EF1152C3N
β Drop-Inβ In Stock
$1280 / Unit
View Datasheet βEP2SGX130GF40C5
β Drop-Inβ In Stock
$1380 / Unit
View Datasheet βEP2SGX130GF40C5NES
β Drop-Inβ In Stock
$1530 / Unit
View Datasheet βEP2SGX90EF1152C5 Maximum Ratings & Electrical Characteristics
| Series | Stratix II GX |
| Family | Stratix II GX |
| Core Voltage | 1.15 V to 1.25 V |
| Logic Elements | 90,960 |
| Total RAM Bits | 4,520,448 |
| Embedded Multipliers | 558 (18x18) |
| Package | 1152-BBGA, FCBGA |
| Package Size | 35 mm x 35 mm |
| Mounting Type | Surface Mount |
| Process Technology | 90 nm |
| Transceivers | Multi-gigabit embedded transceivers |
| RoHS Status | Compliant (per distributor listings) |
| Operating Temperature | Commercial grade (C5) |
| Supplier Device Package | 1152-FBGA (35x35) |
EP2SGX90EF1152C5 1152-fbga (35x35) Pin Configuration Guide
Pin configuration for EP2SGX90EF1152C5 (1152-fbga (35x35) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX90EF1152C5.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX90EF1152C5 is suitable for 7 applications: High-Speed Serial Backplane Aggregation, Telecom Line Cards and Switch Fabrics, Broadcast Video Processing and Conversion, Military Secure Communications Systems, ASIC Prototyping and Emulation, Software-Defined Radio Front-Ends, Test and Measurement Instrumentation.
High-Speed Serial Backplane Aggregation
The EP2SGX90EF1152C5 fits high-speed serial backplane aggregation because its embedded multi-gigabit transceivers support the lane rates required for legacy telecom and storage backplanes, while 90,960 logic elements provide the protocol-processing headroom for frame parsing and queue management. With 4,520,448 RAM bits distributed across TriMatrix blocks, the device can buffer multiple lanes without external memory pressure. Placed on a line card with the transceiver lanes routed to backplane connectors, the FPGA terminates multi-gigabit serial links and consolidates traffic for downstream ASICs. The 558 embedded 18x18 multipliers enable on-chip FEC and CRC acceleration, reducing latency versus software-based approaches. Designers should allocate sufficient decoupling on the transceiver supply rails and follow Intel's reference design for channel loss compensation.
Recommended
Telecom Line Cards and Switch Fabrics
In telecom line cards and switch fabrics, the EP2SGX90EF1152C5's combination of high logic density, embedded transceivers, and abundant block RAM matches the workload of packet classification, header processing, and traffic shaping. The 90,960 LEs support parallel lookup engines for IPv4/IPv6 forwarding tables, while the 4.5 Mbits of RAM hold TCAM shadow and statistics counters close to the data path. Embedded 18x18 multipliers accelerate hashing and checksum operations critical to wire-speed processing. Compared with microprocessors, the FPGA deterministically meets latency SLAs even at full line rate. Designers typically pair the device with external DDR2 memory controllers implemented in the same fabric. Pin-compatible drop-ins like EP2SGX90EF1152C4N support lead-free reflow profiles for modern assembly lines.
Recommended
Broadcast Video Processing and Conversion
Broadcast video processing workloads such as SD/HD/3G-SDI multiplexing, format conversion, and color-space transformation map naturally to the EP2SGX90EF1152C5. The 558 embedded 18x18 multipliers handle real-time FIR filtering, scaling, and chroma resampling, while the 90,960 logic elements implement genlocking, ANC processing, and audio embedding. The 4.5 Mbits of on-chip RAM support multi-frame buffering for cross-conversion, eliminating external line buffers in many designs. Embedded transceivers drive SMPTE 424M/425M SDI links directly, removing the need for standalone serializer/deserializer parts. Compared with ASSP video processors, the FPGA offers full reprogrammability for evolving codec and metadata standards. Quartus II IP libraries include reference SDI cores that reduce time-to-prototype. Designers must observe SDI jitter specifications and use Intel's recommended reference clock network.
Recommended
Military Secure Communications Systems
Military secure communications systems benefit from the EP2SGX90EF1152C5's logic density for Type-1 encryption pipelines and its transceivers for tactical link interfaces. The 90,960 logic elements implement bulk encryption, key scheduling, and protocol encapsulation without consuming general-purpose CPU cycles, while the 4.5 Mbits of on-chip RAM hold working keys and protocol state securely close to the processing elements. The 558 multipliers accelerate cryptographic primitives and waveform processing. Extended-temperature or screened variants in the same package support ruggedized deployments. Compared with ASICs, the FPGA enables in-field reprogramming for evolving crypto standards and threat libraries. Long-life programs benefit from the Stratix II GX family's mature design tooling and documented support infrastructure.
Recommended
ASIC Prototyping and Emulation
ASIC prototyping and emulation is a classic use case for the EP2SGX90EF1152C5. With 90,960 logic elements and 4,520,448 RAM bits, the device can host a substantial slice of an ASIC RTL for early software bring-up, performance regression testing, and architectural validation. Embedded transceivers allow direct attachment of high-speed PHYs that the ASIC targets, while the 558 multipliers accelerate DSP workloads that mirror ASIC blocks. Multiple FPGAs can be tiled via the I/O banks for higher ASIC capacity, with the 1152-FBGA package providing enough general-purpose I/O for chip-to-chip hand-off. Quartus II's incremental compile flow supports multi-FPGA partitioning. The 'EF' suffix on the part number denotes the enhanced transceiver feature set, which is critical for accurate SERDES behavior.
Recommended
Software-Defined Radio Front-Ends
Software-defined radio (SDR) front-ends demand parallel DSP, ample block RAM for sample buffering, and high-speed transceivers for ADC/DAC interface - a profile that matches the EP2SGX90EF1152C5. The 558 dedicated 18x18 multipliers implement wideband channelization, digital down-conversion, and pulse-shaping FIRs at sample rates typical of modern SDR platforms. The 4.5 Mbits of on-chip RAM hold FFT working sets and channelization buffers without round-tripping to external memory. Embedded transceivers accept LVDS or serialized ADC data streams directly, simplifying analog integration. The 90,960 logic elements accommodate waveform-specific protocol stacks above the physical layer. Compared with DSP-only processors, the FPGA can handle more channels at lower power per channel.
Recommended
Test and Measurement Instrumentation
Test and measurement instruments such as logic analyzers, protocol exercisers, and bit-error-rate testers leverage the EP2SGX90EF1152C5's logic density and high-speed transceivers. The 90,960 logic elements implement protocol-aware triggering, deep pattern matching, and counting, while the embedded transceivers handle multi-gigabit stimulus/response at lane rates typical of PCIe Gen1/Gen2, SATA, and XAUI. The 4.5 Mbits of RAM buffer captured events and statistical counters close to the trigger logic. Designers use the 558 multipliers for built-in self-test (BIST) signal processing and eye-diagram analysis. The 1152-FBGA package supports the probe pin count needed for parallel logic-analyzer pods. Quartus II's SignalTap embedded logic analyzer simplifies bring-up and validation flows.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX90EF1152C5 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX90EF1152C5N | EP2SGX90EF1152C4 | EP2SGX90EF1152C3 | EP2SGX130GF40C5 | EP2SGX90EF1152C4ES |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1152-FBGA (35x35) | 1152-FBGA (35x35) - same | 1152-FBGA (35x35) - same | 1152-FBGA (35x35) - same | 1152-FBGA - same family | 1152-FBGA (35x35) - same |
| Logic Elements | 90,960 | 90,960 (same) | 90,960 (same) | 90,960 (same) | 132,540 (~45% more) | 90,960 (same) |
| Total RAM Bits | 4,520,448 | 4,520,448 (same) | 4,520,448 (same) | 4,520,448 (same) | 6,747,840 (~49% more) | 4,520,448 (same) |
| Embedded Multipliers (18x18) | 558 | 558 (same) | 558 (same) | 558 (same) | 770 (~38% more) | 558 (same) |
| Speed Grade | C5 (commercial, slowest) | C5 (same) | C4 (faster) | C3 (fastest) | C5 (different family) | C4 + extended screening |
| Lead-Free (RoHS) | Yes (standard C5) | Yes (N suffix) | Yes (standard) | Yes (standard) | Yes (standard) | Yes (extended screening) |
| Process / Family | 90 nm Stratix II GX | 90 nm Stratix II GX (same) | 90 nm Stratix II GX (same) | 90 nm Stratix II GX (same) | 90 nm Stratix II GX (same) | 90 nm Stratix II GX (same) |
Key Differentiators
- True drop-in variant with lead-free assembly profile (vs EP2SGX90EF1152C5N)
- Higher density in same package for growth headroom (vs EP2SGX130GF40C5)
- Faster speed grades available without silicon change (vs EP2SGX90EF1152C3)
Design Notes
The EP2SGX90EF1152C5 requires multiple supply rails: VCCINT (1.15-1.25 V core), VCCA (analog PLL/transceiver), and VCCIO (per bank I/O voltage). Decouple each rail with a 0.1 uF ceramic placed within 100 mils of the relevant supply pins, plus bulk capacitors sized for transient load steps. The 1.15-1.25 V core rail typically demands 20-40 A of current at full utilization, requiring a multiphase VRM. Plan sequencing: VCCINT must rise before or simultaneously with VCCIO. Failing to observe rail sequencing can cause latch-up or long-term reliability degradation. Reference the Stratix II GX Device Handbook Power section for topology details.
The 1152-FCBGA package requires microvia or via-in-pad PCB technology for breakout routing. Use a 1 mm pitch escape routing pattern with dog-bone fan-out on inner layers for power, and direct attach on outer layers for signal access. Maintain 50 ohm single-ended and 100 ohm differential impedance for transceiver channels. Match transceiver lane lengths within 0.5 mm to preserve skew budget, and reference Intel's Stratix II GX PCB design guidelines for stackup recommendations. Plane splits under the FPGA must not cross transceiver regions to avoid return-path discontinuities.
Configuration pins (nCONFIG, nSTATUS, CONFIG_DONE) must be pulled correctly per Stratix II GX guidelines; leaving them floating can prevent the device from entering user mode. JTAG chain integrity should be verified before assuming silicon failures - many 'dead' FPGAs are simply locked out of configuration mode. The 'EF' suffix denotes Enhanced Feature (multi-gigabit transceiver) variants; do not substitute with non-EF MPNs as the transceiver channels differ. Confirm Quartus II software version supports the exact ordering code before compilation.
Estimated: at full LE utilization (~80%) with high toggle rates, the EP2SGX90EF1152C5 dissipates 5-10 W depending on clock rate and I/O activity. The 1152-FCBGA package has a theta_JA of approximately 8-10 C/W with adequate airflow and PCB copper. Operation above 85 C junction reduces device lifetime per Arrhenius; design the thermal solution to keep the case below 75 C in commercial environments. A heatsink is generally required for sustained high-utilization operation. Reference the Stratix II GX thermal management application note for airflow and heatsink recommendations.
Compliance Information
RoHS compliance inferred from distributor listings (DigiKey, Mouser). AEC-Q100 not applicable to FPGAs. Halogen-free and conflict minerals declarations not stated in distributor data - verify with Intel documentation if required for tender.