EP2SGX60F780 - Stratix II GX FPGA 60K LE | Altera
MPN: EP2SGX60F780 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $850 | $850.00 |
| 10 | $780 | $7,800.00 |
| 100 | $720 | $72,000.00 |
| 500 | $670 | $335,000.00 |
| 1,000 | $620 | $620,000.00 |
EP2SGX60F780 Overview
An FPGA (Field-Programmable Gate Array) is a type of integrated circuit containing an array of programmable logic blocks, configurable interconnects, and I/O cells that can be customized by the designer after manufacturing. FPGAs belong to the broader family of programmable logic devices (PLDs), alongside CPLDs and structured ASICs, and serve as the highest-density, highest-performance option in this category. Stratix II GX is a derivative of the Stratix II family that adds multi-gigabit transceivers for serial connectivity, making it a hybrid programmable-logic-plus-serdes platform used in communications, video, and high-performance computing subsystems.
Key features of the EP2SGX60F780 include embedded transceiver channels that handle rates from 600 Mbps to 6.375 Gbps, adaptive equalization and pre-emphasis on the physical media, on-chip termination, and a hard PCI Express x1/x4 IP core. The device supports up to 12 transceiver channels per device in the high-density variants and integrates 384 18x18 multipliers in the DSP block array. Configuration is supported through JTAG, passive serial, fast passive parallel, and active serial modes, with built-in encryption using AES for secure bitstream loading.
Architecturally, Stratix II GX employs the ALM (Adaptive Logic Module) as its basic logic element, replacing the older 4-input LUT of Stratix with an 8-input fractured LUT structure that delivers up to 25% higher performance and 2x the density per area. The transceiver physical media attachment (PMA) layer is hardened silicon, while the physical coding sublayer (PCS) is implemented in soft logic, enabling flexible protocol customization. The 780-pin FBGA package delivers high pin density for memory-rich and transceiver-rich designs while maintaining signal integrity at multi-gigabit rates.
Typical applications for the EP2SGX60F780 include 10G Ethernet switching and bridging, PCI Express endpoint and root-complex designs, baseband processing in wireless infrastructure, HD-SDI video broadcast equipment, and storage area networking using serial RapidIO. The combination of logic capacity, transceiver bandwidth, and DSP throughput makes it well-suited for line-card designs, protocol bridges, and high-speed image processing pipelines.
When designing with this device, plan thermal management carefully: Stratix II GX FPGAs can dissipate 10-25 W in the 780-BGA depending on transceiver utilization and clock rates. A multilayer PCB with adequate copper area and thermal vias under the exposed die pad is required. Quartus II software is used for synthesis, place-and-route, and timing closure, with transceiver toolkit support for PMA/PCS bring-up.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design guidance that the manufacturer datasheet alone does not provide, giving procurement and engineering teams a single decision-ready reference.
Drop-in alternatives for EP2SGX60F780 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX60F780 (same form factor and footprint) — differing in Package, RoHS Status, Internal Frequency (max), Operating Temperature Grade, Package Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2SGX60DF780C5N
✅ Drop-In✓ In Stock
$205 / Unit
View Datasheet →EP2SGX60DF780C4N
✅ Drop-In✓ In Stock
$365 / Unit
View Datasheet →EP2SGX60DF780C3N
✅ Drop-In✓ In Stock
$188 / Unit
View Datasheet →EP2SGX60CF780C5N
✅ Drop-In✓ In Stock
$485 / Unit
View Datasheet →EP2SGX60CF780C4N
✅ Drop-In✓ In Stock
$220 / Unit
View Datasheet →EP2SGX60CF780I4N
✅ Drop-In✓ In Stock
$171 / Unit
View Datasheet →EP2SGX60F780 Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Logic Elements | 60,440 |
| Embedded Memory Bits | 2,544,192 |
| Total RAM Bits | 2,544,192 |
| DSP Blocks | 18x18 multipliers |
| Number of LABs/CLBs | 3022 |
| Number of Logic Elements/Cells | 60440 |
| Number of I/O | 364 |
| Package | 780-BBGA (F780) |
| Mounting Type | Surface Mount |
| Process Node | 90 nm |
| Configuration Method | JTAG / Passive Serial / Fast Passive Parallel / Active Serial |
EP2SGX60F780 780-bbga (f780) Pin Configuration Guide
Pin configuration for EP2SGX60F780 (780-bbga (f780) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX60F780.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX60F780 is suitable for 6 applications: 10 Gigabit Ethernet Switching Line Card, PCI Express Endpoint Card, Serial RapidIO Bridge, HD-SDI Video Broadcast Equipment, Baseband Signal Processing Card, Aerospace/Ruggedized Networking Subsystem.
10 Gigabit Ethernet Switching Line Card
Provides XAUI/10G serial interface and high-density packet-processing logic in core-router and switch line cards. The EP2SGX60F780's 12 multi-gigabit transceiver channels at up to 6.375 Gbps comfortably drive 4 XAUI lanes per device, while 60,440 logic elements and 2.5 Mbit of embedded RAM provide the buffer and lookup-table capacity required for cut-through forwarding. Placed on the line card PCB with SFP+ cages and external PHY, the FPGA absorbs framing, CRC, and traffic-manager functions that would otherwise require a custom ASIC. The 780-FBGA package's 364 user I/O pins fan out to RLDRAM-II/QDR-II memory and backplane SERDES.
Recommended
PCI Express Endpoint Card
Implements Gen1 PCI Express endpoints (x1/x4) using the EP2SGX60F780's hard PCIe IP core, which sits in the transceiver PCS and saves substantial soft-logic resources. Hard-IP compliance with the PCIe 1.1 specification lets the device deliver up to 1 GB/s in x4 configuration while freeing the remaining 60K logic elements for the application layer. The card typically uses an external PCIe reference clock, on-board termination, and JTAG header for bring-up. Quartus II's PCIe Compiler includes a reference design that compiles in minutes, and the 780-FBGA footprint supports pinout for both x1 and x4 edge-card connectors.
Recommended
Serial RapidIO Bridge
Acts as a protocol bridge between Serial RapidIO 1x/4x links and a host CPU, common in DSP-array or wireless base-station backplanes. The EP2SGX60F780's hardened transceivers provide compliant Serial RapidIO at 1.25/2.5/3.125 Gbps per lane, while the 60K LE logic fabric implements the logical layer, flow-control, and any CPU-side glue logic. Designers use the FPGA's 2.5 Mbit of block RAM to buffer inbound packets and avoid stalling the link. A typical board uses the device with a local TI C6000 or Freescale PowerPC host running RapidIO driver software.
Recommended
HD-SDI Video Broadcast Equipment
Processes uncompressed HD-SDI video streams at 1.485/2.97 Gbps through the EP2SGX60F780's transceivers, providing frame-sync, color-space conversion, and logo insertion for broadcast playout servers. The device's 18x18 DSP block array enables real-time chroma-keying and scaling, while 2.5 Mbit of embedded RAM caches line buffers for cross-channel compositing. The 780-FBGA package exposes 364 user I/O for parallel video buses, DDR2 frame-store memory, and external genlock inputs. Power dissipation in this typical use is in the 10-15 W range, well within the thermal envelope of a properly laid-out PCB.
Recommended
Baseband Signal Processing Card
Provides FFT, channelization, and modulation/demodulation for wireless base-station baseband cards. The EP2SGX60F780's 18x18 multiplier array delivers the GFLOPS throughput needed for 4-channel 20 MHz LTE physical-layer processing, and the transceiver channels interface to AD/DA converters via LVDS or JESD-style parallel buses. With 60,440 logic elements and 2.5 Mbit of block RAM, the device fits the entire physical-layer chain on a single FPGA, simplifying board layout. The 780-FBGA's 364 I/O allow direct connection to four dual-channel 16-bit ADC/DAC pairs.
Recommended
Aerospace/Ruggedized Networking Subsystem
Performs data routing and protocol conversion in airborne or vehicle-mounted rugged networking platforms. The EP2SGX60F780's industrial-temperature speed grades (I3/I4/I5) operate across -40C to +100C and tolerate vibration profiles that demand a BGA package with proper under-fill. Multi-gigabit transceivers connect to MIL-STD-1553 or ARINC 429 bridge chips, while 60K logic elements implement routing tables and error correction. The 780-FBGA package's thermal pad supports the 12-20 W power dissipation typical of an airborne computing payload.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX60F780 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX60DF780C5N | EP2SGX60DF780C4N | EP2SGX60CF780C5N | EP2SGX60CF780I4N | EP2SGX60CF780C4N | EP2SGX60DF780C3N |
|---|---|---|---|---|---|---|---|
| Package | 780-FBGA (F780) | 780-FBGA (F780) - same | 780-FBGA (F780) - same | 780-FBGA (F780) - same | 780-FBGA (F780) - same | 780-FBGA (F780) - same | 780-FBGA (F780) - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 |
| Embedded Memory Bits | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 |
| User I/O Count | 364 | 364 | 364 | 364 | 364 | 364 | 364 |
| Transceiver Channels | Up to 12 | Up to 12 | Up to 12 | Up to 12 | Up to 12 | Up to 12 | Up to 12 |
Key Differentiators
- All alternatives share the 780-FBGA package for true PCB-level drop-in (vs EP2SGX60EF1152C5N)
- Industrial-temperature variants available for ruggedized systems (vs EP2SGX60DF780C5N)
- Multiple speed grades (C3/C4/C5/I4) enable Fmax-cost trade-off (vs EP2SGX60CF780C5N)
Design Notes
The Stratix II GX device at 90 nm can dissipate 10-25 W in the 780-FBGA package depending on transceiver utilization and toggle rates. Per the Altera Stratix II GX datasheet thermal guidance, use a 1 oz copper inner plane under the exposed die paddle with at least 25 thermal vias (0.3 mm drill, 1 mm pitch) connecting to a bottom-layer heat spreader. For fanless chassis designs exceeding 15 W dissipation, attach an aluminum heatsink with thermal interface material rated for the operating temperature range.
The 780-FBGA ball pitch is 1.0 mm with 0.6 mm solder balls, requiring a 4-6 layer PCB with matched impedance control on all transceiver and DDR traces. Use 8-mil microvias for breakout from inner BGA rows to layer 3, with signal traces on layer 3 or layer 4 to maintain 100 ohm differential impedance on transceiver pairs. Per Stratix II GX layout guidelines, place AC-coupling capacitors on TX outputs within 200 mils of the BGA ball, and route reference clocks through length-matched differential pairs.
Do not skip the configuration mode selection pins MSEL[3:0] - these must be tied to specific voltage levels to select JTAG, Passive Serial, Fast Passive Parallel, or Active Serial mode. Per the Stratix II GX configuration handbook, incorrect MSEL settings cause configuration failure that is difficult to diagnose without a Quartus II programmer trace. Also ensure the nCONFIG, nSTATUS, and CONF_DONE signals have proper pull-up resistors per the datasheet (typically 10 kohm) and that the JTAG chain follows the IEEE 1149.1 pinout, especially when sharing the chain with other devices.
Multi-gigabit transceiver channels on the Stratix II GX require matched differential pair routing with 100 ohm differential impedance and 100 ps or better intra-pair skew. Per Stratix II GX transceiver layout guidelines, isolate each transceiver pair from adjacent pairs by at least 4x the dielectric thickness (H), and never cross differential pairs over power plane splits. Use the Altera transceiver toolkit in Quartus II to run pre-emphasis, equalization, and eye-diagram sweeps during board bring-up - the toolkit reports raw eye margins that gate production release.
Compliance Information
Specific RoHS/REACH/AEC-Q100 status not present in the verified web data. The 'N' suffix on variants such as EP2SGX60DF780C5N denotes Pb-free (lead-free) assembly per Altera ordering information. AEC-Q100 is not applicable as this is a commercial/industrial FPGA, not an automotive-qualified part.
