EP2SGX60DF780C3N - 60K LEs Stratix II GX FPGA | Intel
MPN: EP2SGX60DF780C3N β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $262 | $2,620.00 |
| 100 | $235 | $23,500.00 |
| 500 | $210 | $105,000.00 |
| 1,000 | $188 | $188,000.00 |
EP2SGX60DF780C3N Overview
An FPGA is a semiconductor device built around an array of configurable logic blocks (CLBs / LABs), programmable interconnect, and I/O cells that engineers can re-program after manufacture. Stratix II GX sits within the FPGA hypernym hierarchy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit. The GX suffix denotes integrated multi-gigabit transceivers, making Stratix II GX devices a sub-family of the broader Stratix II family that targets wired communications, broadcast video, and high-performance computing backplanes.
Key features include 60,440 logic elements, 2,544,192 bits of embedded memory, 364 user I/Os, 717 MHz internal operating frequency, and up to 816.9 MHz performance. The part supports 4 PLLs, dedicated high-speed serial transceiver channels, and JTAG-based in-system programming. The DF780 package is a 23 x 23 mm FC-FBGA with 1 mm pitch, designed for high-density PCB layouts where signal integrity and thermal performance are critical.
From an architectural standpoint, the Stratix II GX fabric uses Adaptive Logic Modules (ALMs) rather than the older 4-LUT structure, delivering improved logic utilization and timing closure. The 90 nm process node strikes a balance between performance and power, while the integrated transceivers support protocols such as PCI Express, Serial RapidIO, and Gigabit Ethernet without external PHY devices.
Typical applications include high-speed serial interface bridging (PCIe, Serial RapidIO, GBE), software-defined radio front-ends, broadcast video processing, and ASIC prototyping platforms. The combination of high logic density and embedded transceivers makes it a strong fit for telecom line cards and data-acquisition systems.
When designing with this part, ensure the PCB provides a continuous ground plane under the BGA and matched-length routing for the high-speed serial channels. Power decoupling must follow Intel's Stratix II GX PowerPlay recommendations, with bulk capacitance scaled to transceiver utilization. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP2SGX60DF780C3N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX60DF780C3N (same form factor and footprint) β differing in Package, Speed Grade, RoHS Status, Operating Temperature, Package Type.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2SGX60DF780C4N
β Drop-Inβ In Stock
$365 / Unit
View Datasheet βEP2SGX60DF780C5N
β Drop-Inβ In Stock
$205 / Unit
View Datasheet βEP2SGX60CF780C3N
β Drop-Inβ In Stock
$285 / Unit
View Datasheet βEP2SGX30DF780C3N
β Drop-Inβ In Stock
$95.5 / Unit
View Datasheet βEP2SGX60DF780C3N Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Device Type | FPGA |
| Logic Elements | 60,440 |
| LABs/CLBs | 3,022 |
| Total Memory Bits | 2,544,192 |
| User I/Os | 364 |
| Package Type | 780-pin FC-FBGA (DF780) |
| Package Dimensions | 23 x 23 mm |
| Pitch | 1 mm |
| Core Voltage | 1.2 V |
| Process Technology | 90 nm |
| Internal Frequency | 717 MHz |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant (per distributor listing) |
EP2SGX60DF780C3N 23 x 23 mm Pin Configuration Guide
Pin configuration for EP2SGX60DF780C3N (23 x 23 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX60DF780C3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX60DF780C3N is suitable for 6 applications: PCI Express Bridge Card, Software Defined Radio Front-End, Broadcast Video Processing, ASIC Prototyping Platform, Telecom Line Card Processing, High-Speed Data Acquisition Backplane.
PCI Express Bridge Card
The EP2SGX60DF780C3N is well suited to PCI Express Gen1 bridge designs where its embedded multi-gigabit transceivers implement the PCIe PHY layer without external chips. The 60,440 logic elements host the data-link and transaction layers, the 2.5 Mbit of block memory serves as a packet buffer, and the 364 user I/Os handle endpoint fan-out. The DF780 FC-FBGA's 1 mm pitch supports the matched-length, 100-ohm differential routing PCIe lanes demand, and Intel's hard PCIe IP cores in Quartus II shorten the path to a compliant endpoint. Power and thermal headroom must be reserved for the transceivers, which draw a separate VTT supply.
Recommended
Software Defined Radio Front-End
Stratix II GX devices including EP2SGX60DF780C3N are common in SDR platforms that mix high-speed ADC interfacing with baseband DSP. The 60K logic elements run FFTs, channelizers, and modulation logic; the integrated transceivers shift IF samples to baseband at gigabit rates; and 2,544,192 bits of memory store coefficients and overlap-save buffers. With 364 user I/Os the device can connect to multiple parallel ADCs and DACs typical of wideband receivers. Quartus II DSP Builder accelerates fixed-point DSP implementation on this fabric.
Recommended
Broadcast Video Processing
Broadcast video routers and format converters benefit from the EP2SGX60DF780C3N's combination of high logic density, embedded transceivers for SDI/HD-SDI/3G-SDI serial digital interface, and abundant user I/Os for parallel video buses. The 717 MHz internal frequency handles real-time de-interlacing, scaling, and color-space conversion on multiple streams. FC-BGA packaging supports the controlled-impedance routing required for SDI eye-mask compliance. Designers typically instantiate SDI PHY megafunctions in the transceiver tiles and pair them with soft logic for ancillary data extraction.
Recommended
ASIC Prototyping Platform
Engineers building ASIC prototypes choose the EP2SGX60DF780C3N because 60,440 logic elements can map large blocks of an ASIC design partition-by-partition, while the integrated transceivers stand in for the ASIC's SERDES channels. The 780-pin FC-BGA exposes enough user I/Os to break out prototype signals to logic analyzers. Quartus II's incremental compilation allows multiple engineers to develop in parallel against the same silicon, and the JTAG-based in-system programming speeds bring-up cycles on prototype boards.
Recommended
Telecom Line Card Processing
Telecom line cards handling multi-protocol aggregation use the EP2SGX60DF780C3N for packet classification, queue management, and traffic shaping. The 60K logic elements absorb complex QoS pipelines, the embedded transceivers carry 10GbE or OC-192 uplinks, and the 364 user I/Os connect to network processors and PHY devices. The DF780 FC-BGA's thermal performance sustains continuous full-duplex traffic under typical telecom environmental envelopes. Quartus II SOPC Builder integrates Nios II soft processors for control-plane tasks alongside datapath logic.
Recommended
High-Speed Data Acquisition Backplane
Data-acquisition systems streaming multiple Gsps ADC outputs to a host CPU or DSP cluster leverage the EP2SGX60DF780C3N's 60K logic elements to implement cross-bar switching, decimation, and triggering. The transceivers carry serialized ADC data over backplane links at multi-gigabit rates, the 2.5 Mbit of block memory buffers bursts, and the 364 user I/Os interface to front-panel connectors and timing distribution. The 90 nm process and 1.2 V core keep per-channel power in check for densely populated acquisition cards.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX60DF780C3N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX60DF780C4N | EP2SGX60DF780C5N | EP2SGX60CF780C3N | EP2SGX30DF780C3N |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | 780-pin FC-FBGA (DF780) | 780-pin FC-FBGA (DF780) | 780-pin FC-FBGA (DF780) | 780-pin FC-FBGA (F780) | 780-pin FC-FBGA (DF780) |
| Logic Elements | 60,440 | 60,440 | 60,440 | 60,440 | 33,000 |
| LABs/CLBs | 3,022 | 3,022 | 3,022 | 3,022 | 1,627 |
| Total Memory Bits | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 | 1,369,728 |
| User I/Os | 364 | 364 | 364 | 364 | 364 |
| Integrated Transceivers | Yes (Stratix II GX) | Yes | Yes | No (Stratix II non-GX) | Yes (Stratix II GX) |
| Speed Grade | -3 (fastest) | -4 | -5 | -3 | -3 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Key Differentiators
- Highest logic density in the Stratix II GX DF780 family (vs EP2SGX30DF780C3N)
- Fastest speed grade available in the family (vs EP2SGX60DF780C4N)
- Integrated multi-gigabit transceivers in the GX family (vs EP2SGX60CF780C3N)
Design Notes
The 780-ball FC-BGA with 1 mm pitch demands a multi-layer PCB (typically 8+ layers) with laser-drilled microvias or staggered via structures. A continuous ground plane directly under the BGA and matched-length 100-ohm differential routing for all transceiver lanes are mandatory. Route high-speed serial traces on the top layers adjacent to a solid GND plane to maintain the 100-ohm +/- 10% impedance required by the Stratix II GX transceivers. Reference Intel AN 522: High-Speed Board Design for Stratix II GX Devices.
Estimated: with four transceivers active at 3.125 Gbps and the 60K logic fabric at 50% utilization, total board-level power consumption falls in the 8-12 W range. Core supply (VCCINT) at 1.2 V must deliver up to ~5 A, while VCCPD (3.3 V) for I/O pre-drivers needs careful sequencing. Use the Stratix II GX PowerPlay Early Power Estimator before layout, then verify with PowerPlay Power Analyzer after fitting. Decoupling follows Intel's Stratix II GX Board Design Guidelines: at least 24 low-ESR 0.1 uF capacitors under the package plus bulk 22 uF/100 uF ceramics on each rail.
The DF780 FC-BGA has a theta-JA around 8 C/W with a properly designed thermal via array under the package, but without thermal vias junction-to-ambient resistance can climb above 20 C/W. At 10 W dissipation and 25 C ambient, expect a junction temperature rise of ~50 C with full via-array cooling versus ~200 C without it - the latter exceeds the 125 C maximum. Required: stitch the BGA ground balls to inner ground planes with 0.3 mm thermal vias on a 1.2 mm grid under the die shadow.
Do not reuse a Stratix II (non-GX) pinout file for a Stratix II GX board: the transceiver pins and reference-clock pins differ even when the F780/DF780 ball map looks similar. Always regenerate pin assignments with the Quartus II Pin Planner against the target device. Configuration mode (AS, AP, PS, FPP) and JTAG chain order also vary, so verify against the dedicated Stratix II GX Configuration Handbook rather than the generic Stratix II documentation.
Transmitter pre-emphasis and receiver equalization settings in the Stratix II GX transceiver Toolkit must be tuned per channel with a real-time oscilloscope; default settings rarely meet the SDI/PCIe/SerialRapidIO eye-mask on first power-up. Use AC-coupled interconnects (standard for Stratix II GX transceivers) and provide reference-clock inputs that meet the 100 ppm jitter budget. If the design uses multiple transceivers, fan-out the reference clock from a low-jitter PLL rather than routing it long distances.
Compliance Information
RoHS and lead-free status inferred from the trailing N in the MPN and from distributor listings; halogen-free and conflict-minerals declarations are not available in the verified web data.
