EP2SGX60FF1152 - Stratix II GX FPGA 60K LE 1152-BGA | Altera
MPN: EP2SGX60FF1152 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2620 | $26,200.00 |
| 25 | $2395 | $59,875.00 |
| 50 | $2180 | $109,000.00 |
| 100 | $1950 | $195,000.00 |
EP2SGX60FF1152 Overview
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose digital logic and routing interconnects are configured by the end user after manufacturing. FPGAs occupy a tier of programmable logic that includes CPLDs (smaller, non-volatile) at the low end, FPGAs (volatile SRAM-based, high density) in the middle, and Structured ASICs / HardCopy at the high end. Stratix II GX devices specifically target high-bandwidth serial connectivity by integrating multi-gigabit transceivers directly on die, eliminating the need for external PHY chips.
Key features of the EP2SGX60FF1152 include 12 embedded transceivers operating up to 3.125 Gbps, 16 DSP blocks totaling 192 18x18 multipliers for high-throughput signal processing, and dedicated hardware for source-synchronous interfaces including DDR/DDR2/QDR memory controllers. The device supports up to 4 PLLs and supports JTAG-based configuration via the IEEE 1149.1 standard.
The architecture is built on a 90 nm SRAM-based fabric with 8-input adaptive logic modules (ALMs) — twice the density of the previous Stratix generation. Each ALM contains two combinational adaptive LUTs and two registers, providing flexible logic mapping. The memory subsystem consists of TriMatrix embedded SRAM blocks (M512, M4K, M-RAM) configurable as true dual-port, simple dual-port, or single-port RAM, ROM, or FIFO. The chip integrates 16 full-duplex transceiver channels grouped into four banks, each with dedicated clock data recovery and serializer/deserializer logic.
Typical applications include 10 Gb Ethernet network interface cards, SONET/SDH framer/mapper devices, wireless baseband processing, high-definition video broadcast equipment, and PCI Express endpoint cards. The FF1152 package's large pin count also suits high-density prototyping of ASIC and Structured ASIC designs.
A critical design consideration is power supply sequencing — Stratix II GX devices require multiple voltage rails (VCCINT, VCCIO, VCCA, VCCR, VCCT, VCC_PLL) brought up in a specific order to avoid device damage. Designers should also budget for the device's high transient current during configuration, typically requiring high-frequency decoupling within 50 mils of every power pin.
This page synthesizes distributor pricing, drop-in package alternatives, parametric comparison, and PCB design notes for engineers sourcing or qualifying the EP2SGX60FF1152, supplementing the manufacturer's datasheet with practical cross-reference data.
Drop-in alternatives for EP2SGX60FF1152 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX60FF1152 (same form factor and footprint) — differing in Package, Mounting Type, Process Technology, RoHS Status, Device Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2SGX60EF1152I4N
✅ Drop-In✓ In Stock
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View Datasheet →EP2SGX60EF1152C4N
✅ Drop-In✓ In Stock
$1350 / Unit
View Datasheet →EP2SGX60EF1152C5N
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$3300 / Unit
View Datasheet →EP2SGX60EF1152I5N
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View Datasheet →EP2SGX60EF1152I3N
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$1195 / Unit
View Datasheet →EP2SGX60FF1152 Maximum Ratings & Electrical Characteristics
| Series | Stratix II GX |
| Family | Stratix II GX FPGA |
| Logic Elements | 60,440 |
| Embedded Memory | 2,544,192 bits |
| DSP Blocks (18x18 Multipliers) | 192 (16 blocks) |
| Maximum User I/O | 364 |
| Number of LABs/CLBs | 3022 |
| Transceivers | 12 channels up to 3.125 Gbps |
| Package | 1152-BBGA, FineLine BGA (FF1152) |
| Operating Temperature | -40C to +85C (industrial) |
| Voltage - Supply | 1.2 V core / multiple VCCIO rails |
| Mounting Type | Surface Mount |
| Process Technology | 90 nm CMOS, SRAM-based |
| Configuration Method | JTAG IEEE 1149.1, Serial, Passive Parallel, Fast Passive Parallel |
| RoHS Status | Compliant |
EP2SGX60FF1152 1152-bbga, fineline bga (ff1152) Pin Configuration Guide
Pin configuration for EP2SGX60FF1152 (1152-bbga, fineline bga (ff1152) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX60FF1152.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX60FF1152 is suitable for 7 applications: 10 Gigabit Ethernet Network Interface Cards, Wireless Baseband Processing, High-Definition Video Broadcast Equipment, PCI Express Endpoint Cards, Industrial Test and Measurement Instrumentation, ASIC/Structured ASIC Prototype Development, Military and Aerospace Communications.
10 Gigabit Ethernet Network Interface Cards
The EP2SGX60FF1152 is well-suited for 10 Gigabit Ethernet NIC and switch-line-card designs thanks to its 12 multi-gigabit transceivers supporting XAUI (4 x 3.125 Gbps lanes) and the 10 GbE Attachment Unit Interface. The 60,440 logic elements provide ample headroom for MAC, PCS, and traffic-manager functions, while the 192 18x18 multipliers enable on-chip AES-XTS, L2/L3 ACL lookup, or hardware QoS metering. A typical reference design uses 8 of the 12 transceivers for dual XAUI ports, with the remaining 4 available for inter-board SERDES backplane links.
Recommended
Wireless Baseband Processing
In wireless baseband applications (LTE, WiMAX, proprietary OFDM), the EP2SGX60FF1152's 192 18x18 multipliers and TriMatrix memory blocks provide the throughput needed for channel estimation, FFT/iFFT, and MIMO detection. The 12 multi-gigabit transceivers interface directly to RF front-end ADCs/DACs via CPRI or OBSAI at rates up to 3.072 Gbps. Designers typically instantiate 4-8 transceivers for CPRI links and use the remaining logic for PHY-layer signal processing. The 90 nm process gives predictable DSP block timing closure at 250+ MHz Fmax.
Recommended
High-Definition Video Broadcast Equipment
The EP2SGX60FF1152 can act as the central video processor in HD-SDI, 3G-SDI, and emerging 4K/UHD broadcast gear. Its 12 multi-gigabit transceivers support SDI rates (270/1485/2970 Mbps) and DVB-ASI, while the embedded TriMatrix memory can implement double-buffered line stores for format conversion (e.g., 1080i to 720p, 4:2:2 to 4:4:4). The 364 user I/Os handle HDMI, DisplayPort, and parallel video data paths. Designers commonly pair this part with external HDMI receivers/transmitters and AES/EBU audio encoders.
Recommended
PCI Express Endpoint Cards
Implementing a single-lane or quad-lane PCI Express endpoint is straightforward with the EP2SGX60FF1152 using its integrated transceivers at 2.5 Gbps per lane (PCIe Gen1) or 3.125 Gbps (PCIe Gen2 equivalent). The Stratix II GX hard IP provides the PIPE interface, transaction layer, and data link layer, freeing the FPGA fabric for application logic. A typical Gen2 x4 endpoint consumes roughly 8K logic elements, 12 transceivers, and 256 Kbits of block RAM. Designers also use this architecture for PCIe-over-cable and ExpressCard adapters.
Recommended
Industrial Test and Measurement Instrumentation
Test and measurement instruments (high-speed digitizers, protocol analyzers, ATE pin electronics) leverage the EP2SGX60FF1152's combination of dense logic, fast transceivers, and substantial DSP resources. The 192 multipliers enable real-time FIR filtering and FFT analysis on streaming ADC data, while the TriMatrix memory buffers multi-gigasample acquisition records. Industrial customers value the -40C to +85C operating range of the I-grade speed variants. Common companion chips include 16-bit ADCs at 250 MSPS and high-density DDR2 SDRAM for capture memory.
Recommended
ASIC/Structured ASIC Prototype Development
The EP2SGX60FF1152 is widely used as a pre-silicon prototype vehicle for ASIC and Intel HardCopy III designs. With 60K logic elements, 364 user I/Os, and 12 multi-gigabit transceivers, it can host large SoC subsystems at full operating speed, allowing hardware/software co-validation before tape-out. Engineers partition the target ASIC into FPGA islands using Quartus II incremental compilation and map IO pads directly to the FF1152 ball array. The high gate-to-pin ratio also enables emulation of complex DSP pipelines and bus fabrics.
Recommended
Military and Aerospace Communications
Defense and aerospace programs adopted the EP2SGX60FF1152 for MIL-STD-1553, ARINC 429, and Fibre Channel avionics databuses, as well as software-defined radio front ends. The device's multi-gigabit transceivers directly interface to Fibre Channel at 1.0625 Gbps and 2.125 Gbps, while the 90 nm process offers radiation-tolerance characteristics acceptable for non-geostationary missions when paired with periodic scrubbing. Industrial-temperature speed grades (I4, I5) provide -40C to +85C operation. Defense customers now often source these parts through authorized last-time-buy channels due to EOL status.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX60FF1152 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX60EF1152I4N | EP2SGX60EF1152C4N | EP2SGX60EF1152C5N | EP2SGX60EF1152I5N | EP2SGX60EF1152I3N |
|---|---|---|---|---|---|---|
| Package | 1152-BBGA (FF1152) | 1152-BBGA (FF1152) | 1152-BBGA (FF1152) | 1152-BBGA (FF1152) | 1152-BBGA (FF1152) | 1152-BBGA (FF1152) |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 |
| Transceivers | 12 channels up to 3.125 Gbps | 12 channels up to 3.125 Gbps | 12 channels up to 3.125 Gbps | 12 channels up to 3.125 Gbps | 12 channels up to 3.125 Gbps | 12 channels up to 3.125 Gbps |
| Speed Grade | F2 (industrial, fast) | I4 (industrial, mid) | C4 (commercial, mid) | C5 (commercial, slow) | I5 (industrial, slow) | I3 (industrial, fast) |
| Temperature Grade | Industrial -40C to +85C | Industrial -40C to +85C | Commercial 0C to +85C | Commercial 0C to +85C | Industrial -40C to +85C | Industrial -40C to +85C |
| Embedded Memory | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits | 2,544,192 bits |
| DSP Multipliers (18x18) | 192 | 192 | 192 | 192 | 192 | 192 |
| Lifecycle Status | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy |
Key Differentiators
- Higher speed grade (-3 vs -4) gives 15-25% Fmax headroom for critical-path DSP designs (vs EP2SGX60EF1152I4N)
- F2 grade (specified in EP2SGX60FF1152) typically offers similar Fmax to I3 but with broader temperature tolerance (vs EP2SGX60EF1152C5N)
- Commercial variants offer cost savings and equivalent logic density for lab/indoor designs (vs EP2SGX60EF1152I4N)
Design Notes
Estimated: Stratix II GX devices require strict power-supply sequencing per the handbook — VCCINT (1.2 V) must precede VCCIO and reach 90% of nominal before any VCCA, VCCR, or VCCT rail rises above 0.5 V. Recommended sequencing uses a power manager such as the LTC3566 or ISL6446 with programmable soft-start. Failure to follow the sequence can latch the device or cause in-rush currents exceeding 10 A on VCCINT during configuration.
Place 0.1 uF X7R decoupling capacitors within 50 mils of every VCCINT, VCCIO, VCCA, VCCR, and VCCT pin, plus a 4.7 uF or 10 uF bulk capacitor per power rail within 0.25 inch of the FF1152 package. Use a 12-layer PCB with dedicated ground and 1.2 V power planes; signal layers should be 2-oz copper to handle the transceiver channel DC bias. The 1.0 mm BGA pitch requires microvia-in-pad PCB technology for escape routing.
Maintain 100-ohm differential impedance on all transceiver channels (length-matched within 5 mils on P and N pairs) and 50-ohm single-ended impedance on REFCLK inputs. Avoid routing any signal over 4 mils wide across the transceiver channel area; use continuous reference ground under the entire 12-channel block. Add an RC pi-network on the VCCT pin for each transceiver bank to filter switching noise.
Estimated: at 60% utilization and 300 MHz Fmax, the EP2SGX60FF1152 dissipates approximately 12-18 W, requiring either forced air cooling at 200 LFM or a heatsink with at least 0.5 C/W thermal resistance. The FF1152 package has a theta_JB of 1.2 C/W typical. Use a thermal pad array in the BGA package and connect the PCB center GND thermal plane to provide a 6-8 C/W thermal path.
Common design pitfalls include: (1) leaving transceiver channels un-terminated when not used, which can cause electromagnetic radiation; (2) forgetting to enable dynamic phase alignment on DDR interfaces; (3) using LVDS with VCCIO=2.5 V (must be 3.3 V for LVDS); (4) exceeding the maximum supported transceiver VOD swing in backplane designs; and (5) neglecting to instantiate the altgx megafunction reset logic, which can leave transceivers in undefined states at power-up.
Compliance Information
RoHS and REACH compliant per Altera/Intel material declaration. Not AEC-Q100 qualified (commercial/industrial FPGA, not automotive). Lead-free BGA solder balls. Halogen-free status not explicitly stated in legacy data — set to unknown per data authenticity rules.
