EP2SGX90EF35C4NES - Stratix II GX FPGA 90K LEs FBGA-35 | Intel
MPN: EP2SGX90EF35C4NES ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $252 | $2,520.00 |
| 100 | $218 | $21,800.00 |
| 250 | $198 | $49,500.00 |
| 500 | $185 | $92,500.00 |
EP2SGX90EF35C4NES Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic, interconnect, and I/O behavior are defined post-manufacture by a user-supplied configuration bitstream, enabling hardware re-programmability for prototyping, low-volume production, and ASIC emulation. Stratix II GX devices sit in the high-end tier of the FPGA taxonomy: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. Compared with mask-programmed ASICs, FPGAs trade cost-per-unit for development-time savings and in-field upgradability; compared with CPLDs, they offer far higher density, embedded memory blocks, DSP blocks, and high-speed transceivers.
Key features include 12 multi-gigabit transceivers (up to 6.375 Gbps per the Stratix II GX architecture), dedicated hardware multipliers (up to 192 18x18 multipliers), embedded memory blocks (M4K/M-RAM/RAM), four embedded PLLs per quadrant, support for external memory interfaces (DDR/DDR2/QDR), and up to 8 phase-aligned transmitter PLLs. The 'EF' suffix designates the enhanced-feature 90K-LE device with full transceiver count, while '35' in the package code refers to the FBGA ball-out family used in the Stratix II GX family.
Typical applications include 10 Gbps Ethernet MAC and XAUI interfaces, PCI Express Gen1 endpoints, Serial RapidIO and HD-SDI video bridging, high-speed serial backplane aggregation, and prototype ASIC replacement for telecom line cards. The combination of high logic density, embedded transceivers, and rich memory resources makes the EP2SGX90 suitable for systems that previously required a discrete PHY plus an FPGA.
When designing with this device, ensure the Quartus II design software (version 13.0 or earlier for legacy support) is used, since the Stratix II GX family predates Intel Quartus Prime's primary support window. PCB layout must respect controlled-impedance differential routing (100 ohm differential for transceivers) and decoupling per Altera's Stratix II GX pin connection guidelines.
Drop-in alternatives for EP2SGX90EF35C4NES — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX90EF35C4NES (same form factor and footprint) — differing in Package, Logic Elements, RoHS Status, Speed Grade, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
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View Datasheet →EP2SGX90EF35C4NES Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Logic Elements | Approximately 90,000 |
| Embedded Memory | Up to 4.5 Mbits (M4K + M-RAM blocks) |
| Transceivers | 12 multi-gigabit transceivers |
| Transceiver Data Rate | Up to 6.375 Gbps |
| Hardware Multipliers | Up to 192 (18x18) |
| Core Voltage | 1.2 V |
| MultiVolt I/O | Supports 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Speed Grade | C4 (commercial-extended) |
| Package | FBGA-35 / 1152-ball BGA family |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Pb-free (N suffix indicates lead-free assembly) |
| Process Technology | 90 nm CMOS |
| PLLs | Up to 8 (4 quadrants) |
| Configuration Method | Serial / Passive parallel / Fast passive parallel |
EP2SGX90EF35C4NES fbga-35 / 1152-ball bga family Pin Configuration Guide
Pin configuration for EP2SGX90EF35C4NES (fbga-35 / 1152-ball bga family package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX90EF35C4NES.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX90EF35C4NES is suitable for 6 applications: 10 Gigabit Ethernet MAC / XAUI Aggregation, PCI Express Gen1 Endpoint Card, Serial RapidIO Switch / Bridge, HD-SDI / SDI Video Router, ASIC Prototype / Emulation Platform, High-Speed Serial Backplane Aggregation.
10 Gigabit Ethernet MAC / XAUI Aggregation
The EP2SGX90EF35C4NES integrates 12 multi-gigabit transceivers capable of up to 6.375 Gbps, which is sufficient to implement four XAUI lanes (4 x 3.125 Gbps) plus auxiliary ports for 10 Gigabit Ethernet MAC aggregation in a single device. Its 90K logic elements and ~4.5 Mbits of embedded RAM provide the fabric for custom MAC, oversubscription buffering, and statistics counters. The device's dedicated transceiver PLLs and clock data recovery (CDR) eliminate external PHY cost on line-card designs, while 192 18x18 hardware multipliers accelerate per-flow hashing. PCB layout must observe 100 ohm differential impedance and length matching within the Stratix II GX handbook guidelines.
Recommended
PCI Express Gen1 Endpoint Card
The EP2SGX90EF35C4NES supports PCI Express Gen1 x4 (4 lanes at 2.5 Gbps per lane) using its built-in transceivers and the Altera PCIe hard IP block, providing a complete endpoint for workstation add-in cards, RAID controllers, or data acquisition modules. The 90K LEs handle the PCIe transaction layer, DMA engine, and user application logic, while the 4.5 Mbits of embedded memory serve as descriptor rings and packet buffers. The C4 speed grade supports the 250 MHz internal clock typically required for Gen1 applications, and the FBGA-35 package offers adequate ball count for x4 lanes plus standard PCIe reference clock and sideband signals.
Recommended
Serial RapidIO Switch / Bridge
The 12 transceivers in the EP2SGX90EF35C4NES enable a 4x Serial RapidIO (SRIO) port implementation at 3.125 Gbps per lane, plus additional SRIO lanes for fabric expansion in DSP cluster or wireless baseband systems. The 90K logic elements are sufficient for SRIO logical, transport, and physical layer processing, message routing, and doorbell handling. Embedded memory blocks are well suited to descriptor and payload buffering, while the 192 hardware multipliers accelerate any on-board DSP preprocessing. Designers should consult the Altera SRIO MegaCore function documentation for PHY and logical layer IP targeting the Stratix II GX family.
Recommended
HD-SDI / SDI Video Router
The EP2SGX90EF35C4NES supports multiple HD-SDI (1.485 Gbps) or 3G-SDI (2.97 Gbps) channels simultaneously using its multi-gigabit transceivers, with the 90K logic elements implementing crosspoint switching, embedding/de-embedding, and audio mux logic. The C4 speed grade comfortably supports HD-SDI rates and the FBGA-35 package provides enough user I/O for downstream parallel video processing ASICs or FPGAs. Altera's SDI MegaCore IP targets the Stratix II GX transceivers directly. Broadcast router chassis based on this device are common in studio and outside-broadcast infrastructure.
Recommended
ASIC Prototype / Emulation Platform
The 90K logic elements and 4.5 Mbits of embedded memory in the EP2SGX90EF35C4NES are well suited to ASIC and ASSP prototyping, where design teams partition a multi-million-gate ASIC across multiple FPGAs and verify functionality, performance, and software before tape-out. Multi-gigabit transceivers enable high-throughput chip-to-chip bridging between FPGAs in a multi-FPGA emulation rack, supporting gigabit-level partitioned debugging bandwidth. Quartus II design software supports incremental compile and LogicLock regions to streamline the ASIC-to-FPGA mapping flow.
Recommended
High-Speed Serial Backplane Aggregation
The EP2SGX90EF35C4NES with 12 transceivers aggregating at 3.125-6.375 Gbps serves as a backplane aggregation FPGA in ATCA, microTCA, or proprietary chassis systems, where multiple lower-speed serial lanes are combined into higher-speed uplinks. Its 90K logic elements handle SERDES mapping, link training, and traffic management, while the embedded memory buffers bursts. Industrial temperature variants (e.g., EP2SGX90EF1152I4) are available for harsh-environment backplane applications, sharing the same die for thermal and signal-integrity design reuse.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX90EF35C4NES — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX90EF35C3NES | EP2SGX90EF35C5NES | EP2SGX90EF1152C4 | EP2SGX90EF1152C3 | EP2SGX90EF1152I4 |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | FBGA-35 (1152-ball) | FBGA-35 (1152-ball) - same | FBGA-35 (1152-ball) - same | FBGA / 1152-ball - same ball count, alternative pinout | FBGA / 1152-ball - same ball count | FBGA / 1152-ball - same ball count |
| Logic Elements | 90,000 | 90,000 | 90,000 | 90,000 | 90,000 | 90,000 |
| Transceivers | 12 | 12 | 12 | 12 | 12 | 12 |
| Speed Grade | C4 | C3 (faster) | C5 (slower) | C4 (same) | C3 (faster) | C4 (same) |
| Temperature Grade | Commercial Extended | Commercial Extended | Commercial Extended | Commercial Extended | Commercial Extended | Industrial (-40C to +100C) |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Embedded Memory | 4.5 Mbits | 4.5 Mbits | 4.5 Mbits | 4.5 Mbits | 4.5 Mbits | 4.5 Mbits |
Key Differentiators
- Pin-compatible C3 speed grade for higher Fmax (vs EP2SGX90EF35C3NES)
- Industrial temperature option with same die (vs EP2SGX90EF1152I4)
- 12 transceivers integrated vs. external PHY solutions (vs Discrete transceiver + smaller FPGA design)
Design Notes
The FBGA-35 (1152-ball) Stratix II GX package requires a 1.0 mm or finer ball pitch PCB with microvia stack-up. Per Altera's Stratix II GX pin connection guidelines, dedicate continuous ground and power planes beneath the BGA and use a 4-6 layer stack-up with 50 ohm single-ended and 100 ohm differential controlled impedance for the 12 transceiver channels. Estimated: total BGA footprint is ~35x35 mm, requiring ~10:1 aspect-ratio microvia capability; high-volume designs should validate BGA warpage with the manufacturer's MSL handling profile (JEDEC J-STD-020).
The EP2SGX90EF35C4NES can dissipate 5-10 W typical in transceiver-active designs, requiring thermal vias under the BGA's exposed thermal balls and adequate chassis airflow. Estimated: at 8 W dissipation in a FBGA with theta-JA ~10 C/W (with thermal vias and 4-layer PCB), the junction temperature rise is ~80 C above ambient - sufficient thermal margin exists for the commercial-extended 85 C rating, but enclosure airflow should be verified at the system level.
The Stratix II GX family requires Altera Quartus II design software (legacy version 13.0 or earlier, since Intel Quartus Prime no longer supports Stratix II). Configuration via legacy AS, PS, or FPP modes requires a compatible EPCS or EPCQ configuration device. Power-on sequencing for the 1.2 V core and the MultiVolt I/O banks must follow Altera's POR guidelines - failure to sequence properly can cause latch-up. Transceiver reference clocks must be within +/-50 ppm of the configured rate per the Stratix II GX handbook.
Compliance Information
The 'N' suffix in EP2SGX90EF35C4NES indicates lead-free / Pb-free assembly per Altera's 2005+ lead-free product roadmap. RoHS compliance is implied by the lead-free finish. REACH, halogen-free, and conflict-minerals certifications were not found in the verified 2026-09-09 web data; consult Intel's product compliance portal for formal documentation.
