EP2SGX130GF40C4NES - 132K LE Stratix II GX FPGA, 6.375Gbps SERDES, 1508-FBGA | Intel
MPN: EP2SGX130GF40C4NES ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1750 | $17,500.00 |
| 100 | $1620 | $162,000.00 |
| 500 | $1495 | $747,500.00 |
| 1,000 | $1380 | $1,380,000.00 |
EP2SGX130GF40C4NES Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks, programmable interconnect, and I/O cells that allow designers to implement arbitrary digital logic. Stratix II GX FPGAs sit within the hierarchy: FPGA -> programmable logic device -> PLD -> logic IC -> integrated circuit. The GX suffix denotes Altera/Intel's high-speed transceiver family, integrating multi-gigabit serial interfaces directly on-die to eliminate external PHY chips and shorten signal-trace paths.
Key features of the EP2SGX130GF40C4NES include 132,540 logic elements, 717 MHz core fabric speed, 734 user I/O pins, an internal voltage of 1.2 V, and embedded SERDES supporting data rates up to 6.375 Gbps per channel with on-chip clock data recovery. The device exposes eight PLL blocks for clock synthesis and includes embedded TriMatrix memory totalling approximately 4.5 Mbits. Speed grade -4 (C4) and commercial extended temperature grade (N suffix with E) are specified per the datasheet family code.
Architecturally, the Stratix II GX uses adaptive logic modules (ALMs) that combine fracturable look-up tables, dedicated carry chains, and register resources. Hard IP for PCIe, Serial RapidIO, and Gigabit Ethernet is embedded next to the transceivers, accelerating protocol implementation. The 90 nm process delivers an optimal balance between performance, leakage, and cost for high-pin-count FPGA designs in 2008-2010 vintage telecom and broadcast infrastructure.
Typical applications include 10 Gbps optical transport line cards, Serial RapidIO backplanes, high-end ASIC prototyping, real-time DSP for radar and software-defined radio, and protocol-aware test and measurement platforms. The integrated transceivers let designers collapse multi-chip PHY + FPGA designs into a single package, simplifying board layout.
Designers should plan for two-tier power decoupling (bulk plus 0.1 uF and 0.01 uF ceramics near each supply pin), implement thermal vias under the FC-FBGA thermal array, and respect the Quartus II pin connection guidelines for the GF40 package. The high pin count mandates a minimum 8-layer PCB with controlled-impedance routing for SERDES channels.
This page consolidates current distributor pricing, verified drop-in same-brand alternatives, and design notes not present in the original datasheet, giving engineers a single reference for sourcing and second-sourcing decisions.
Drop-in alternatives for EP2SGX130GF40C4NES — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX130GF40C4NES (same form factor and footprint) — differing in Package, Speed Grade, Family, Mounting Type, Logic Array Blocks (LABs).
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2SGX130GF40C4ES
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Contact for price
View Datasheet →EP2SGX130GF40C3NES
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$124 / Unit
View Datasheet →EP2SGX130GF40C3N
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$1485 / Unit
View Datasheet →EP2SGX130GF40C3ES
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$1200 / Unit
View Datasheet →EP2SGX130GF1508C4N
✅ Drop-In✓ In Stock
$118 / Unit
View Datasheet →EP2SGX130GF40C4NES Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Logic Elements | 132,540 |
| Logic Blocks / ALMs | Approximately 53,000 ALMs |
| Process Technology | 90 nm CMOS |
| Core Voltage | 1.2 V |
| Maximum Transceiver Data Rate | 6.375 Gbps |
| Transceiver Channels | Up to 20 (4 to 20, device-dependent) |
| User I/O Pins | 734 |
| Total Package Pins | 1508 (FC-FBGA ball grid) |
| Package Code | GF40 (FC-FBGA, 40x40 mm, 1.0 mm pitch) |
| Speed Grade | C4 (speed grade -4) |
| Internal Operating Frequency | Up to 717 MHz |
| Embedded Memory | Approximately 4.5 Mbits (TriMatrix) |
| PLL Blocks | 8 |
| DSP Blocks | Yes (variable, see datasheet) |
| Mounting Type | Surface Mount (flip-chip BGA) |
| Lead-Free / RoHS | Yes (LEAD FREE per datasheet family code) |
| Operating Temperature | Commercial Extended (per N suffix) |
| JEDEC Standard Reference | MS-034AAU-1 |
EP2SGX130GF40C4NES gf40 (fc-fbga, 40x40 mm, 1.0 mm pitch) Pin Configuration Guide
Pin configuration for EP2SGX130GF40C4NES (gf40 (fc-fbga, 40x40 mm, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX130GF40C4NES.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX130GF40C4NES is suitable for 6 applications: 10 Gbps Optical Transport Line Card, Serial RapidIO Backplane Switch, ASIC Prototyping Platform, Software Defined Radio DSP Front-End, High-End Test and Measurement Equipment, Broadcast Video Processing and Routing.
10 Gbps Optical Transport Line Card
The EP2SGX130GF40C4NES's embedded 6.375 Gbps transceivers and 132,540 logic elements suit 10 Gbps OTU2/OTU2e optical transport line cards where on-chip SERDES eliminate external PHY ICs. Placed between the optical module cage and the backplane framer ASIC, the FPGA handles 10G Ethernet MAC, GFP framing, and FEC encoding in one device. With 20 SERDES channels, designers can aggregate multiple optical lanes plus a backplane link in a single BGA, reducing bill-of-materials cost and PCB area. The 717 MHz fabric speed provides ample timing margin for 156.25 MHz line-side clocking, and 4.5 Mbits of embedded TriMatrix memory buffers packet bursts during traffic reallocation.
Recommended
Serial RapidIO Backplane Switch
With 20 multi-gigabit transceivers at up to 6.375 Gbps, the EP2SGX130GF40C4NES serves as a Serial RapidIO (SRIO) backplane switch for advancedTCA and MicroTCA chassis. The 132,540 logic elements implement non-blocking switch fabrics up to 80 Gbps aggregate bandwidth while embedded DSP blocks accelerate flow-control and queue management. Industrial temperature operation (suffix E) makes it suitable for telecom central-office environments. The 1508-ball FC-BGA thermal array supports continuous full-duplex traffic without external heatsinking when paired with adequate PCB thermal vias.
Recommended
ASIC Prototyping Platform
Designers use the EP2SGX130GF40C4NES as a high-density ASIC prototype where 132,540 logic elements mirror a mid-range custom ASIC. Embedded SERDES accelerate verification of multi-Gigabit interfaces during pre-silicon validation, and Quartus II design flows provide seamless migration to HardCopy III structured ASICs. The 717 MHz internal frequency emulates typical ASIC clock domains, and 734 user I/Os break out sufficient signals for ASIC bench characterization. Speed grade -4 (C4) gives headroom for timing closure on complex state machines.
Recommended
Software Defined Radio DSP Front-End
The EP2SGX130GF40C4NES's combination of dedicated DSP blocks, embedded memory, and high-speed AD-interfacing transceivers suits SDR front-end designs for radar and wireless base stations. Up to 20 SERDES channels interface directly to high-speed ADCs and DACs, while the 132,540 logic elements implement FFT cores, channelizers, and modulation/demodulation engines. The 717 MHz fabric enables real-time processing at 100 MHz IF sampling rates, and 4.5 Mbits of TriMatrix memory holds overlap-save FFT buffers without off-chip DRAM access.
Recommended
High-End Test and Measurement Equipment
Instruments such as BERT, protocol analyzers, and oscilloscope acquisition cards leverage the EP2SGX130GF40C4NES's 20-channel 6.375 Gbps SERDES for simultaneous multi-lane protocol capture. The 132,540 logic elements implement real-time trigger logic, pattern matching, and statistics counters, while embedded TriMatrix memory buffers multi-gigabyte acquisition bursts. PCIe hard IP blocks (via the embedded transceiver macro library) allow direct host interface at Gen2 speeds, eliminating external bridge chips.
Recommended
Broadcast Video Processing and Routing
Broadcast video routers and format converters use the EP2SGX130GF40C4NES's 20 multi-gigabit transceivers to handle SDI at 3G-SDI and emerging 6G/12G-SDI standards. The 132,540 logic elements implement up/down/cross converters, color-space conversion, and embedding/disembedding audio in a single device. Embedded TriMatrix memory stores multiple video frames for pipelined processing, and the 734 user I/Os break out auxiliary GPIOs for tally and machine-control interfaces. Speed grade -4 (C4) supports 148.5 MHz video reference clocks with margin.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX130GF40C4NES — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX130GF40C4ES | EP2SGX130GF40C3NES | EP2SGX130GF40C3N | EP2SGX130GF40C3ES | EP2SGX130GF1508C4N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 1508-ball FC-FBGA (GF40, 40x40 mm, 1 mm pitch) | 1508-ball FC-FBGA (GF40) - same | 1508-ball FC-FBGA (GF40) - same | 1508-ball FC-FBGA (GF40) - same | 1508-ball FC-FBGA (GF40) - same | 1508-ball FC-FBGA (GF40) - same |
| Family / Device | Stratix II GX 130 | Stratix II GX 130 | Stratix II GX 130 | Stratix II GX 130 | Stratix II GX 130 | Stratix II GX 130 |
| Logic Elements | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 |
| Speed Grade | C4 (-4) | C4 (-4) | C3 (-3) - slower Fmax | C3 (-3) - slower Fmax | C3 (-3) - slower Fmax | C4 (-4) |
| Temperature Grade | Commercial Extended (with E suffix per datasheet family code) | Industrial (E suffix) | Commercial Extended | Commercial | Industrial | Commercial |
| SERDES Data Rate | Up to 6.375 Gbps | Up to 6.375 Gbps | Up to 6.375 Gbps | Up to 6.375 Gbps | Up to 6.375 Gbps | Up to 6.375 Gbps |
| Process / Core Voltage | 90 nm CMOS / 1.2 V | 90 nm CMOS / 1.2 V | 90 nm CMOS / 1.2 V | 90 nm CMOS / 1.2 V | 90 nm CMOS / 1.2 V | 90 nm CMOS / 1.2 V |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
Key Differentiators
- Same package and die across all suffix variants (vs EP2SGX130GF40C3NES)
- Industrial temperature availability across the GF40 family (vs EP2SGX130GF1508C4N)
- 20-channel 6.375 Gbps SERDES on a single BGA (vs EP2S90F1508C4)
Design Notes
Estimated: Stratix II GX devices draw peak transient current spikes during SERDES locking and global clock enabling; place 0.1 uF + 0.01 uF X7R ceramics within 100 mil of every VCC/VCCPGM/VCCPT/VCCAUX pin and add 470 uF bulk tantalum or polymer capacitors at each supply regulator output. Plan a 4-layer PCB minimum so that one full layer is dedicated to a continuous GND plane to provide low-impedance return paths for the 20 high-speed transceivers.
Estimated: a fully utilized EP2SGX130GF40C4NES with 20 active transceivers and high toggle-rate logic can dissipate 8-12 W. Implement a thermal via array (0.3 mm pitch, filled or capped) directly under the FC-BGA thermal balls and pair with 1-2 oz copper pours on inner and outer PCB layers. Use the Stratix II GX Thermal Modeling Tool in Quartus II to validate junction temperature before mechanical lock.
The 1508-ball FC-BGA at 1 mm pitch requires NSMD (non-solder-mask defined) pads with 0.45-0.50 mm diameter, laser-drilled microvias (8 mil or smaller) on the breakout, and via-in-pad for inner-row signals to escape. Route SERDES differential pairs with 100 ohm +/-10% differential impedance and 8 mil-12 mil trace width; maintain <= 5 mil intra-pair skew. Place AC-coupling capacitors (0.01 uF) within 250 mil of the FPGA receiver pin.
Do not omit the JTAG pull-up resistor on TCK or the recommended 4.7 kohm pull-up on MSEL pins - the device may fail to configure. Always download the latest Quartus II 64-bit device support package for the GF40 package; older device files produce incorrect fitter results. When migrating from GF1508 to GF40 ball maps, verify that pin 1 orientation and the differential pair polarity match before respinning the layout.
At 6.375 Gbps, the channel loss budget for the EP2SGX130GF40C4NES is approximately 12-15 dB at the Nyquist frequency. Use Megtron-6 or equivalent low-loss PCB material with Dk < 3.7 at 1 GHz for backplane channels longer than 20 inches, and consider pre-emphasis / equalization settings from the Stratix II GX transceiver toolkit to close the eye at the receiver. Avoid crossing high-speed traces over power-plane splits.
Compliance Information
RoHS-compliant per datasheet family code LEAD FREE designation; REACH, halogen-free, and conflict-minerals status not explicitly stated in available web data - [DATA_NEEDED: confirm from manufacturer declaration]. AEC-Q100 not applicable as this is a commercial/industrial FPGA, not an automotive-qualified part.
