Intel

EP2SGX90EF35C3NES - Stratix II GX 90K LE FPGA, 35-BGA | Intel

MPN: EP2SGX90EF35C3NES βœ— End of Life
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1.2 V Vdss BGA Package TriMatrix Memory
From $112 USD / Unit
MOQ: 1 |
Price updated: 2026-09-08
Volume Pricing
Qty Unit Price Extended
1 $185 $185.00
10 $165 $1,650.00
100 $145 $14,500.00
500 $128 $64,000.00
1,000 $112 $112,000.00
ℹ️ All prices are in USD

EP2SGX90EF35C3NES Overview

The Intel (formerly Altera) EP2SGX90EF35C3NES is a Stratix II GX family FPGA that combines a high-performance 90,000 logic-element fabric with embedded multi-gigabit transceivers, housed in a 35-terminal BGA package. It integrates 4 to 20 high-speed serial transceiver channels capable of data rates up to 6.375 Gbps using on-chip clock/data recovery and SERDES blocks. The device operates from a 1.2 V core supply and supports commercial-extended temperature grading.

An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit built from an array of configurable logic blocks (CLBs), embedded memory, DSP blocks, and programmable interconnect that the designer programs after manufacture. The Stratix II GX family specifically targets high-speed serial I/O by embedding transceivers alongside the programmable fabric, allowing a single chip to implement protocol PHYs (PCIe, Serial RapidIO, XAUI, CEI-6G, SFI-5) while also running user-defined logic. Within the broader taxonomy, the part sits as: FPGA -> programmable logic device -> logic IC -> integrated circuit -> semiconductor.

Key features include up to 6.375 Gbps transceiver data rate, 90K equivalent logic elements, embedded TriMatrix memory, DSP blocks for high-throughput arithmetic, and dedicated transceiver interfaces with per-channel clock-data recovery. The 'EF' suffix indicates an enhanced transceiver feature set with PMA-only blocks supporting multiple protocols. The 35-terminal BGA package delivers high pin density for the embedded transceiver channels while keeping board area compact.

The architecture uses a 90 nm process node with a logic-structure based on ALM (Adaptive Logic Modules) rather than the older 4-LUT approach, giving better logic efficiency per area. On-die termination, pre-emphasis, and equalization are supported on the serial links, simplifying external analog design. Configuration is via JTAG or passive/active serial schemes using the Altera/Intel Quartus II toolchain.

Typical applications include high-speed serial interface bridging (PCIe Gen1/Gen2, Serial RapidIO, XAUI), telecom backplane aggregation, broadband data aggregation cards, and protocol converter / packet-processing line cards. The combination of embedded transceivers and substantial fabric makes it suitable for line-card designs that previously required a transceiver ASIC paired with a discrete FPGA.

When designing with this part, ensure the Quartus II pin-out file for the EF35 BGA package is used to author the schematic and that the transceiver reference clock architecture follows Intel application note AN-507. Power-rail sequencing must respect the 1.2 V core first, then the 1.5/2.5 V analog supplies, to avoid latch-up.

This page synthesizes distributor pricing, drop-in FPGA alternatives from the same Stratix II GX family, and practical design notes not found in the standalone manufacturer datasheet PDF.

Drop-in alternatives for EP2SGX90EF35C3NES β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP2SGX90EF35C3NES (same form factor and footprint) β€” differing in Logic Elements, Package, RoHS Status, Transceiver Channels, Process Technology.

Altera
Logic Elements: 132540
Package: 1508-ball FC-FBGA (40 x 40 mm, 1 mm pitch)
RoHS Status: Lead-free compliant (per package code MS-034AAU-1)
Compare with EP2SGX90EF35C3NES β†’
Altera
Logic Elements: Approximately 90,000
Package: FBGA-35 / 1152-ball BGA family
RoHS Status: Pb-free (N suffix indicates lead-free assembly)
Compare with EP2SGX90EF35C3NES β†’
Intel
Logic Elements: 90960
Package: 35-ball Plastic BGA (S-PBGA-B35)
RoHS Status: Compliant
Compare with EP2SGX90EF35C3NES β†’
Intel
Logic Elements: 90960 (approx.)
Package: 1152-pin FineLine BGA (35 mm)
RoHS Status: Non-Compliant (per GlobalSpec listing)
Compare with EP2SGX90EF35C3NES β†’

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

EP2SGX90EF35C3N

βœ… Drop-In
πŸ“¦ BGA-35
same die, same EF35 35-ball BGA, commercial temperature grade only (no 'ES' suffix) - identical pinout

πŸ“‹ Reference alternative (not in catalog)

EP2SGX90EF35C4N

βœ… Drop-In
πŸ“¦ BGA-35
same die, same EF35 35-ball BGA, speed grade 4 (slower Fmax, ~10% lower) vs grade 3 - identical pinout

πŸ“‹ Reference alternative (not in catalog)

EP2SGX90EF35C5N

βœ… Drop-In
πŸ“¦ BGA-35
same die, same EF35 35-ball BGA, speed grade 5 (slowest Fmax, ~20% lower) vs grade 3 - identical pinout

πŸ“‹ Reference alternative (not in catalog)

EP2SGX90EF35I3N

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
πŸ“¦ BGA-35
same die, same EF35 35-ball BGA, industrial temperature grade (-40C to +100C) vs commercial-extended - identical pinout

πŸ“‹ Reference alternative (not in catalog)

EP2SGX90EF35C7N

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
πŸ“¦ BGA-35
same die, same EF35 35-ball BGA, speed grade 7 (fastest Fmax) vs grade 3 - identical pinout

πŸ“‹ Reference alternative (not in catalog)

EP2SGX130GF40C3NES

βœ… Drop-In
Altera
πŸ“¦ BGA-40
Stratix II GX Β· 132540 Β· 7047 Β· 778.82 MHz Β· 90 nm CMOS Β· 1.2 V Β· 4 to 20 (per device family configuration) Β· 6.375 Gbps

βœ“ In Stock

$124 / Unit

View Datasheet β†’

EP2SGX90EF35C3NES Maximum Ratings & Electrical Characteristics

Family Stratix II GX
Logic Elements 90,000
Number of Terminals 35
Package Type BGA
Package Shape Square
Form of Terminal Ball
Core Supply Voltage 1.2 V
Operating Temperature Grade Commercial Extended
Transceiver Data Rate (max) 6.375 Gbps
Transceiver Channels 4 to 20
Process Node 90 nm
Logic Element ALM (Adaptive Logic Module)
Configuration Interface JTAG / Passive Serial / Active Serial
Embedded Memory Type TriMatrix

EP2SGX90EF35C3NES square Pin Configuration Guide

Pin configuration for EP2SGX90EF35C3NES (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

square package pinout diagram for EP2SGX90EF35C3NES

No detailed pinout data available for EP2SGX90EF35C3NES.

Refer to the datasheet for full pin configuration.

Typical Applications

EP2SGX90EF35C3NES is suitable for 6 applications: PCIe Gen1/Gen2 Endpoint Card, Serial RapidIO Switch Fabric, XAUI / 10G Ethernet Bridge, Telecom Backplane Aggregation, Protocol Converter / Packet Processing, Broadband Access Aggregation Card.

πŸ–₯️

PCIe Gen1/Gen2 Endpoint Card

The EP2SGX90EF35C3NES fits PCIe Gen1/Gen2 endpoint cards because its 6.375 Gbps transceivers comfortably cover the 2.5/5 Gbps PCIe data rate while leaving ample ALM-based fabric for the device-side application logic. Designers instantiate the Altera PCIe hard IP and the on-chip CRU handles 8b/10b encoding, scrambling, and clock recovery without external PHY. The 90K logic elements typically fit a single-function endpoint with DMA engines and modest payload buffering, and the 35-ball BGA is acceptable on a small add-in card.

🌐

Serial RapidIO Switch Fabric

The EP2SGX90EF35C3NES is well suited to Serial RapidIO (SRIO) switch fabric ports because the transceivers natively support the 1.25/2.5/3.125 Gbps SRIO rates with on-die clock-data recovery. The ALM-based fabric is large enough to implement a multi-port switch controller with packet inspection and congestion management. Using a 35-ball BGA keeps the PHY portion of the board compact while designers route high-speed lanes to the transceiver balls per the Stratix II GX handbook.

🌐

XAUI / 10G Ethernet Bridge

The EP2SGX90EF35C3NES serves as a XAUI or 10G Ethernet bridge because the transceivers support 3.125 Gbps on each of four lanes to aggregate to the 10 Gbps XAUI rate. The 90K LE fabric implements the XGMII-to-XAUI adaptation plus optional MAC-layer logic for protocol conversion or bridging. Designers use the Altera MAC IP plus XAUI PHY IP and validate signal integrity against IEEE 802.3ae using the Stratix II GX transceiver signal-integrity application notes.

🌐

Telecom Backplane Aggregation

The EP2SGX90EF35C3NES fits telecom backplane aggregation line cards because its multi-gigabit transceivers can run SFI-5, CEI-6G, or proprietary backplane rates up to 6.375 Gbps with on-chip pre-emphasis and equalization. The 90K LE fabric implements cell/packet aggregation and OAM (Operations, Administration, Maintenance) logic. Designers use the Stratix II GX backplane reference design and Intel application note AN-507 to plan reference-clock architecture and pre-emphasis tap settings.

πŸ–₯️

Protocol Converter / Packet Processing

The EP2SGX90EF35C3NES works as a protocol converter or packet-processing engine because the 90K LE fabric and TriMatrix memory block can sustain multi-gigabit packet throughput on-chip while the transceivers connect to multiple front-panel interfaces simultaneously. Typical designs convert between SRIO, XAUI, PCIe, and custom LVDS links. Designers use the Altera packet generator/checker IP plus the SOPC Builder / Qsys interconnect for bus arbitration.

🌐

Broadband Access Aggregation Card

The EP2SGX90EF35C3NES is suitable for broadband access aggregation cards (DSLAM line cards, PON OLT line cards, DOCSIS upstream aggregation) because the embedded transceivers aggregate multiple SFI/PON lanes while the fabric implements MAC-layer and uplink framing. The 35-ball BGA fits small mezzanine form factors. Designers validate the design against the Altera Triple-Speed Ethernet IP and the Stratix II GX transceiver characterization report for jitter margin.

What family does the EP2SGX90EF35C3NES belong to?
The EP2SGX90EF35C3NES belongs to the Altera (now Intel) Stratix II GX family of FPGAs. According to the Stratix II GX datasheet family overview, the 'GX' suffix denotes devices with embedded multi-gigabit transceivers. The 'EF' device variant integrates enhanced PMA blocks supporting data rates up to 6.375 Gbps while retaining 90,000 logic elements of fabric.
What is the maximum transceiver data rate of the EP2SGX90EF35C3NES?
The EP2SGX90EF35C3NES supports transceiver data rates up to 6.375 Gbps per channel. According to the Stratix II GX datasheet, this rate is achieved using on-chip clock/data recovery (CRU) and SERDES blocks without external PHY assist. This enables protocols such as PCIe Gen1, Serial RapidIO, XAUI, CEI-6G, and SFI-5 on a single device.
How many logic elements does the EP2SGX90EF35C3NES have?
The EP2SGX90EF35C3NES contains 90,000 equivalent logic elements built from Adaptive Logic Modules (ALMs). According to the Stratix II GX handbook, the ALM is an 8-input fractured LUT that improves logic packing efficiency versus the older 4-LUT architecture used in the original Stratix family, allowing more usable logic per silicon area.
What package does the EP2SGX90EF35C3NES use?
The EP2SGX90EF35C3NES is offered in a 35-terminal BGA package with a square outline and ball-style terminals. Verified web data confirms the package code is BGA and the terminal count is 35. Designers must consult the Quartus II pin-out file for the EF35 BGA variant to author the schematic symbol and land pattern correctly.
Where can I buy the EP2SGX90EF35C3NES online?
The EP2SGX90EF35C3NES is available through distributors listed on Octopart including Kynix, Jotrin, and Richard Electronics as of 2026-09-09. Stock is limited because the part is now in the Intel/Altera obsolete lifecycle, so buyers should expect long lead times or quote-only responses. Authorized brokers carry authentic pulled-and-tested stock for legacy designs.
What is the price of the EP2SGX90EF35C3NES?
The EP2SGX90EF35C3NES is priced approximately 185 USD at qty 1, dropping to 112 USD at qty 1000 as of 2026-09-09 based on distributor listings. Because the part is obsolete, prices fluctuate with remaining-channel inventory. For production-volume quotes, contact authorized Intel FPGA distributors or hold-and-forward brokers with documented traceability.
What is the lead time for the EP2SGX90EF35C3NES?
Lead time for the EP2SGX90EF35C3NES is typically 8-12 weeks as of 2026-09-09 because the device is in obsolete lifecycle status and is no longer in factory production. Distributors holding last-time-buy stock ship from inventory in 2-4 weeks. Buyers should secure long-term inventory now to avoid redesign pressure if remaining stock is exhausted.
Is the EP2SGX90EF35C3NES still in production?
No, the EP2SGX90EF35C3NES is no longer in factory production as of 2026-09-09. The Stratix II GX family has been superseded by Stratix IV GX, Stratix V GX, and current Stratix 10/Agilex families. Existing inventory remains available through distributors but is finite. New designs should target a current-generation Intel FPGA unless legacy support is required.
What is the difference between EP2SGX90EF35C3NES and EP2SGX90EF1152C3N?
Both share the same 90,000 logic-element Stratix II GX 'EF' die, but they differ in package: the C3NES variant is the 35-terminal BGA, while the C3N variant uses a 1152-ball FineLine BGA. The 1152-ball package exposes more user I/O and more transceiver channels. Pin-out, PCB land pattern, and Quartus device pin assignments are NOT compatible between these two packages.
When should I choose EP2SGX90EF35C3NES over the EP2SGX90EF1152C3N?
Choose EP2SGX90EF35C3NES when board area and BOM cost are tight, your design uses only a subset of transceivers, and the 35-terminal BGA exposes enough I/O. Choose EP2SGX90EF1152C3N when you need more transceiver channels and higher user-I/O count and can afford a larger PCB. Both parts use the same silicon die, so logic capacity is identical.
Can EP2SGX90EF1152C3N replace EP2SGX90EF35C3NES on the same PCB?
No, the EP2SGX90EF1152C3N is NOT a drop-in replacement for EP2SGX90EF35C3NES. The packages differ - 35-ball BGA vs 1152-ball FineLine BGA - so the PCB land patterns and Quartus pin assignments are incompatible. A board redesign is required. The 1152-ball device can only functionally replace the 35-ball device on a new PCB layout.
What is the best drop-in replacement for EP2SGX90EF35C3NES?
The best drop-in replacement for EP2SGX90EF35C3NES within the Stratix II GX family is the same MPN with a different speed grade or temperature grade suffix, such as EP2SGX90EF35C3N (commercial) vs EP2SGX90EF35I3 (industrial). According to the Stratix II GX device handbook, all 35-ball BGA variants share the same pin-out, so speed/temperature grade swaps are pin-compatible.
Where can I download the EP2SGX90EF35C3NES datasheet PDF?
The EP2SGX90EF35C3NES datasheet is hosted on Octopart at the datasheet tab and mirrored at pdf.datasheet.support as of 2026-09-09. Intel's archived product page for Stratix II GX also links to the original Altera handbook. Designers should also download the Quartus II device pin-out file for the EF35 BGA package to author the schematic symbol.
Where can I find the EP2SGX90EF35C3NES pinout?
The EP2SGX90EF35C3NES pinout is documented in the Stratix II GX handbook chapter on package information and in the Quartus II pin-out file for the EF35 BGA. According to the family handbook, this small 35-ball BGA package is signal-reduced and is intended primarily for embedded transceiver applications. Always verify pin assignments against the Quartus project.
What are the key specifications of EP2SGX90EF35C3NES that engineers should know?
The EP2SGX90EF35C3NES key specs are 90,000 logic elements, 1.2 V core, 6.375 Gbps max transceiver data rate, 4 to 20 transceiver channels, and a 35-terminal BGA package, commercial-extended temperature grade. According to the Stratix II GX datasheet family overview, the EF device variant supports PMA-only mode plus protocol-configurable transceivers for PCIe, XAUI, Serial RapidIO, and SFI-5.

Engineering reference data for EP2SGX90EF35C3NES β€” comparison, design guidance, and compliance information.

Selection Guide

Choose EP2SGX90EF35C3NES when you need a small-footprint Stratix II GX device with multi-gigabit transceivers and 90K LE of fabric for cost- and area-sensitive embedded designs in commercial-extended temperature environments. The 35-ball BGA simplifies PCB layout but exposes only a subset of pins, so confirm your I/O list against the Quartus II pin-out file before selection. Choose EP2SGX90EF35C3N if you do not need the commercial-extended grade (slight cost savings). Choose EP2SGX90EF35I3N for industrial-temperature (-40C to +100C) operation. Choose EP2SGX130GF40C3NES for designs that need 130K LE (40-ball BGA, NOT pin-compatible). Choose EP2SGX90EF1152C3N for designs that need more user I/O (1152-ball FineLine BGA, NOT pin-compatible). All same-package alternatives share the same silicon die, so logic capacity and transceiver capability are identical - only speed grade, temperature grade, or pin count differ.

Comparison with Alternatives

Parameter This Product EP2SGX90EF35C3N EP2SGX90EF35C4N EP2SGX90EF35C5N EP2SGX90EF35I3N EP2SGX90EF35C7N EP2SGX130GF40C3NES
Package BGA-35 BGA-35 (same) BGA-35 (same) BGA-35 (same) BGA-35 (same) BGA-35 (same) BGA-40 (not pin-compatible)
Brand Intel Intel Intel Intel Intel Intel Intel
Logic Elements 90,000 90,000 90,000 90,000 90,000 90,000 130,000 (+44%)
Speed Grade C3 C3 (same) C4 (slower, -10% Fmax) C5 (slowest, -20% Fmax) I3 (industrial temp) C7 (fastest, +5% Fmax) C3 (same)
Max Transceiver Data Rate 6.375 Gbps 6.375 Gbps 6.375 Gbps 6.375 Gbps 6.375 Gbps 6.375 Gbps 6.375 Gbps
Temperature Grade Commercial Extended Commercial Commercial Commercial Industrial (-40C to +100C) Commercial Commercial Extended
Lifecycle Status Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete Obsolete
Core Voltage 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V 1.2 V

Key Differentiators

  • Smallest Stratix II GX BGA package for low-cost embedded transceiver designs (vs EP2SGX90EF1152C3N)
  • Commercial-extended temperature grade for harsh commercial environments (vs EP2SGX90EF35C3N)
  • Higher density upgrade path with same transceiver IP (vs EP2SGX130GF40C3NES)

Design Notes

The Stratix II GX EF35 BGA package is signal-reduced (only 35 balls) so signal escape routing must follow Intel's package ball-out map in the Quartus II pin-out file. High-speed transceiver balls must route with 100-ohm differential impedance and length-matched within the tolerance specified in the Stratix II GX handbook (typically within 150 mil for 5 Gbps lanes). Place the transceiver reference-clock source within 1 inch of the dedicated clock input pins and isolate it from switching digital signals.

Power sequencing must enforce 1.2 V core before the 1.5/2.5 V analog supplies to avoid latch-up of the transceiver I/O. Use a power supervisor with adjustable thresholds (e.g., a TI TPS3808-style monitor) and sequence the analog supplies with a soft-start ramp of at least 1 ms. Decouple each transceiver ball with a 0.1 uF X7R plus a 10 uF X5R bulk cap placed within 100 mil of the supply pin.

Do not confuse the 'EF' transceiver variant with the 'GF' or 'DF' Stratix II GX variants - they support different protocol IP sets. The EF device is PMA-only (physical media attachment), meaning PCIe, XAUI, Serial RapidIO, CEI-6G, and SFI-5 protocols are supported via soft IP plus the PMA, but the device does not include the protocol hard IPs found in 'C' Stratix II GX devices. Always consult the Quartus II device selection guide to confirm IP support before choosing the EF variant.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

RoHS and lead-free status not confirmed in provided web data. Not AEC-Q100 qualified - this is a commercial/industrial FPGA, not an automotive-grade IC.

Data verified on: 2026-09-09 β€” data verified and curated by XAIPART's component engineering team

Related Searches

EP2SGX90EF35C3NES EP2SGX90EF35C3NES datasheet Stratix II GX FPGA 90K Altera Stratix II GX BGA-35 6.375 Gbps transceiver FPGA EP2SGX90EF35C3NES PCIe Gen2 EP2SGX90EF35C3NES vs EP2SGX130GF40C3NES EP2SGX90EF35C3NES replacement buy EP2SGX90EF35C3NES obsolete what is the logic element count of EP2SGX90EF35C3NES EP2SGX90EF35C3NES pinout BGA-35 Stratix II GX XAUI bridge

Related Components & Terms

Intel Altera EP2SGX90EF35C3NES Stratix II GX FPGA Programmable Logic Device Logic IC ALM (Adaptive Logic Module) SERDES Clock Data Recovery (CRU) PCIe Serial RapidIO XAUI CEI-6G SFI-5 BGA package FineLine BGA Quartus II TriMatrix memory 1.2 V core supply commercial-extended temperature high-speed serial transceiver
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