EP2SGX90FF1508I5N - Stratix II GX FPGA, 90,960 LEs, 622 MHz | Intel
MPN: EP2SGX90FF1508I5N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1750 | $17,500.00 |
| 50 | $1650 | $82,500.00 |
| 100 | $1550 | $155,000.00 |
| 500 | $1450 | $725,000.00 |
EP2SGX90FF1508I5N Overview
A Field-Programmable Gate Array (FPGA) is a programmable logic IC that combines configurable logic blocks, routing interconnect, and dedicated hard IP blocks (such as transceivers, memory controllers, multipliers, and PLLs). The user programs the FPGA after manufacturing via a configuration bitstream, which makes FPGAs ideal for ASIC prototyping, high-speed signal processing, network processing, and reconfigurable compute. FPGAs sit at the top of the programmable-logic hierarchy (CPLD -> FPGA -> SoC FPGA), and the Stratix II GX family is positioned for high-performance applications with embedded multi-gigabit transceivers.
Key features of the EP2SGX90FF1508I5N include 90,960 LEs arranged in 4,548 logic array blocks (LABs), 152 18-bit x 18-bit multipliers, 4,520,448 bits of embedded SRAM organized as M4K and M-RAM blocks, four enhanced PLLs, eight fast PLLs, and a rich set of clock networks. The industrial-grade speed grade I5 places it in the moderate-speed, wide-temperature bin, while the 1508-ball FC-FBGA package provides 650 user I/O pins and an exposed thermal die for heat dissipation in dense PCB designs.
Architecturally, Stratix II GX devices use a stretched-LUT approach where every LE contains a 7-input adaptive look-up table (ALUT) that can be partitioned into smaller LUTs for higher effective logic utilization. The embedded transceivers support standards such as PCI Express, Gigabit Ethernet, Serial RapidIO, and XAUI, and operate at data rates up to 6.375 Gbps per channel, making the EP2SGX90FF1508I5N suitable for high-bandwidth backplane and bridging applications.
Typical applications for the EP2SGX90FF1508I5N include high-speed telecom and networking line cards, ASIC prototyping for protocol stacks, signal-processing front-ends for test and measurement, and military/aerospace signal intelligence platforms. The 622 MHz internal clock and abundant transceivers allow designers to consolidate what would otherwise require multiple discrete ASSPs.
When designing with this part, pay close attention to power-rail sequencing: Stratix II GX devices require a specific power-up and power-down order for VCCINT, VCCIO, VCCA, and the transceiver supplies. Decoupling, thermal management, and configuration-bitstream storage on a flash or PROM must all be budgeted before PCB layout is committed.
This page consolidates distributor pricing, industrial-grade drop-in alternatives, and Stratix II GX design notes in one place - giving engineers a faster starting point than searching the original datasheet.
Drop-in alternatives for EP2SGX90FF1508I5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX90FF1508I5N (same form factor and footprint) — differing in Package, Speed Grade, Configuration Method, Operating Temperature, Operating Temperature Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2SGX90FF1508I4N
✅ Drop-In✓ In Stock
$810 / Unit
View Datasheet →EP2SGX90FF1508I4
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →EP2SGX90FF1508I3N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1460 / Unit
View Datasheet →EP2SGX90FF1508I3
✅ Drop-In ⚠️ 参数待验证✓ In Stock
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View Datasheet →EP2SGX90F1508C5N
✅ Drop-In✓ In Stock
$195.5 / Unit
View Datasheet →EP2SGX90FF1508C5N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1380 / Unit
View Datasheet →EP2SGX90FF1508I5N Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Logic Elements (LEs) | 90,960 |
| Total Logic Cells | 90,960 |
| Equivalent Logic Cells | 90,960 |
| Embedded Memory Bits | 4,520,448 bits |
| Maximum Clock Frequency | 622.08 MHz |
| Process Node | 90 nm CMOS |
| Nominal Core Supply Voltage | 1.2 V |
| User I/O Pins | 650 |
| Total Package Pins | 1,508 |
| Package | 1508-ball FC-FBGA (FF1508) |
| Operating Temperature Range | -40 °C to +85 °C (Industrial) |
| Speed Grade | I5 (industrial, moderate speed) |
| Mounting Type | Surface Mount |
| LE Count Class | High Density (90K-class) |
EP2SGX90FF1508I5N 1508-ball fc-fbga (ff1508) Pin Configuration Guide
Pin configuration for EP2SGX90FF1508I5N (1508-ball fc-fbga (ff1508) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX90FF1508I5N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX90FF1508I5N is suitable for 6 applications: Telecom Line Card Processing, ASIC Prototyping and Emulation, High-Speed Test and Measurement Front-End, Signal Intelligence and Defense Systems, High-Performance Computing Bridge, Broadcast Video Processing.
Telecom Line Card Processing
The EP2SGX90FF1508I5N is well suited for telecom line card data-plane processing because it combines 90,960 logic elements with embedded multi-gigabit transceivers operating up to 6.375 Gbps. This transceiver count and logic density allows a single device to terminate multiple SFP/SFP+ links while running packet classification, queuing, and forwarding logic in fabric. The 622 MHz internal clock and abundant embedded SRAM enable wire-speed lookups. Designers can implement SERDES, MAC, and traffic-manager IP cores from the Quartus II library alongside custom logic.
Recommended
ASIC Prototyping and Emulation
With 90,960 logic elements and 4,520,448 bits of embedded memory, the EP2SGX90FF1508I5N can prototype ASIC designs of up to several million gates when using multiple devices in a multi-FPGA partition. The 650 user I/O pins expose enough bandwidth for chip-to-chip signals in an emulation board, and the 1.2 V core combined with industrial temperature grading supports bench-top and chassis-based emulator form factors. Quartus II supports incremental compilation flows that map RTL directly to this device.
Recommended
High-Speed Test and Measurement Front-End
Test and measurement equipment benefits from the EP2SGX90FF1508I5N's combination of high-speed transceivers, fast parallel I/O, and substantial on-chip memory. A digital oscilloscope, logic analyzer, or protocol exerciser can capture data at multi-gigabit rates into the embedded M-RAM blocks and then run real-time triggering and pattern matching in the logic fabric. The industrial temperature range ensures consistent operation in lab and production-floor environments where thermal conditions are not actively controlled.
Recommended
Signal Intelligence and Defense Systems
Military and aerospace signal-intelligence platforms leverage the EP2SGX90FF1508I5N's wide temperature range (-40 to +85 C) and high logic density for wideband digital receivers, FFT engines, and protocol decoders. The integrated transceivers simplify connection to RF front-ends and digitizers operating at gigasamples-per-second rates. The 90 nm process node is mature, well-characterized for defense qualification flows, and supported by long-lifecycle procurement programs that match the device's last-time-buy horizon.
Recommended
High-Performance Computing Bridge
The EP2SGX90FF1508I5N acts as a PCIe Gen1/Gen2 bridge between CPUs, DSPs, and ASIC accelerators in high-performance computing nodes. Its embedded transceivers implement the PCIe physical layer directly, while the abundant logic elements host protocol stacks, DMA engines, and memory controllers. The industrial temperature bin enables deployment in edge-computing and ruggedized HPC chassis. Designers can map OpenCL or HDL kernels to the Stratix II GX fabric alongside the host interface for hardware acceleration.
Recommended
Broadcast Video Processing
Broadcast video routers, format converters, and frame synchronizers use the EP2SGX90FF1508I5N's high I/O count and embedded memory to handle uncompressed SDI and HDMI streams at 3 Gbps and above. The 650 user I/O pins accommodate multiple parallel video interfaces, while the 4.5 Mbit embedded SRAM provides line and frame buffers. Transceivers support SDI and HDMI serialization/deserialization IP cores. Industrial temperature grading supports OB-van and outdoor broadcast deployment scenarios.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX90FF1508I5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX90FF1508I4N | EP2SGX90FF1508I4 | EP2SGX90FF1508I3N | EP2SGX90FF1508I3 | EP2SGX90F1508C5N | EP2SGX90FF1508C5N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1508-ball FC-FBGA (FF1508) | 1508-ball FC-FBGA (FF1508) - same | 1508-ball FC-FBGA (FF1508) - same | 1508-ball FC-FBGA (FF1508) - same | 1508-ball FC-FBGA (FF1508) - same | 1508-ball FC-FBGA (F1508) - same | 1508-ball FC-FBGA (FF1508) - same |
| Logic Elements | 90,960 | 90,960 | 90,960 | 90,960 | 90,960 | 90,960 | 90,960 |
| Speed Grade | I5 (industrial, fast) | I4 (industrial, moderate) | I4 (industrial, moderate) | I3 (industrial, slow) | I3 (industrial, slow) | C5 (commercial, fast) | C5 (commercial, fast) |
| Operating Temperature | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | 0 °C to +85 °C | 0 °C to +85 °C |
| Maximum Clock Frequency | 622.08 MHz | Lower than I5 (I4 bin) | Lower than I5 (I4 bin) | Lower than I5 (I3 bin) | Lower than I5 (I3 bin) | 622.08 MHz | 622.08 MHz |
| Embedded Memory | 4,520,448 bits | 4,520,448 bits | 4,520,448 bits | 4,520,448 bits | 4,520,448 bits | 4,520,448 bits | 4,520,448 bits |
| Process Node | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS | 90 nm CMOS |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Key Differentiators
- Higher Fmax within same FF1508 footprint (vs EP2SGX90FF1508I4N)
- Industrial temperature range vs commercial alternatives (vs EP2SGX90FF1508C5N)
- Same-die FF1508 footprint enables seamless speed bin migration (vs EP2SGX90F1508C5N)
Design Notes
Stratix II GX devices require a specific power-up sequence for VCCINT, VCCIO, VCCA_PLL, and the transceiver supplies (VCCL_GXB, VCCH_GXB). Per the Stratix II GX Device Handbook, VCCINT must reach 1.0 V before VCCIO rises above 0.7 V. The on-chip Power-on Reset (POR) circuitry monitors these rails, but discrete sequencing controllers such as the LTC3554 or TPS54xxx are recommended to avoid latch-up. Decoupling must include 0402-size 0.1 µF and 10 µF capacitors within 100 mil of every supply pin.
Estimated: With 90,960 LEs switching at 622 MHz and full transceiver utilization, the EP2SGX90FF1508I5N dissipates between 15 W and 25 W. The 1508-ball FC-FBGA package exposes the die directly to the PCB for thermal dissipation. To keep junction temperature below 100 °C in an industrial 85 °C ambient, the PCB must include a minimum of 4 thermal vias in a 3x3 array beneath the die, plus 1 oz copper pours on the top and inner layers. A small heatsink may be required if all transceivers are active.
The 1508-ball FC-FBGA uses a 1.0 mm ball pitch, requiring microvia (laser-drilled) PCB technology for signal escape routing. Stack-up recommendations: 8 layers minimum, with two core layers and four 0.2 mm prepreg layers; signal layers should route stripline for transceivers to maintain 100 ohm differential impedance. Keep all transceiver traces length-matched within 5 mil to avoid skew. Per the Stratix II GX handbook, leave at least 0.4 mm clearance between BGA balls and any signal via to prevent solder bridging.
Do not attempt to use commercial-grade (C-speed) parts in industrial designs even if the package matches; the speed bin differs and timing closure fails. Always verify the configuration mode (AS, AP, PS, FPP) is correctly wired before powering up - a misconfigured MSEL[2:0] strap can lock the device. Finally, retain at least one copy of the bitstream flash image in a remote repository; obsolete FPGAs make factory-programmed devices impossible to reprogram if the configuration source is lost.
Compliance Information
RoHS, REACH, and lead-free status not explicitly stated in the verified web data for this specific MPN. Marked as unknown per data authenticity rules. AEC-Q100 is not applicable to FPGAs in this category.
