EP2SGX90FF1508I4N - Stratix II GX FPGA, 90K LE, FBGA-1508 | Intel
MPN: EP2SGX90FF1508I4N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1200 | $1,200.00 |
| 10 | $1080 | $10,800.00 |
| 100 | $950 | $95,000.00 |
| 500 | $870 | $435,000.00 |
| 1,000 | $810 | $810,000.00 |
EP2SGX90FF1508I4N Overview
A Field Programmable Gate Array is a reconfigurable digital integrated circuit whose logic fabric, interconnect, and I/O can be programmed after manufacture to implement arbitrary digital functions. FPGAs sit at the top of the programmable-logic hierarchy, above CPLDs and below full ASICs in cost-versus-flexibility trade-off, and are widely used in prototyping, low-volume production, and applications requiring hardware-level parallelism that microcontrollers cannot deliver. The Stratix II family specifically added adaptive logic modules (ALMs) and on-chip DSP blocks, making the part attractive for signal-processing pipelines.
Key features of the EP2SGX90FF1508I4N include 12 high-speed transceivers supporting multi-gigabit serial protocols, on-chip TriMatrix memory with mixed-width blocks for distributed and buffering storage, dedicated DSP blocks for fixed- and floating-point arithmetic, and support for external memory interfaces such as DDR2 SDRAM. The device also includes Phase-Locked Loops (PLLs) for clock management, a configuration controller that supports multiple boot modes including JTAG and passive serial, and built-in CRC checking for configuration bitstream integrity.
Architecturally, the Stratix II GX uses the ALM (Adaptive Logic Module) as its basic logic unit, replacing the older 4-input LUT of Stratix I. Each ALM contains an 8-input fracturable lookup table combined with dedicated adder and carry chains, which improves effective logic utilization to roughly 1.4x compared to the previous generation. The transceiver blocks include dedicated physical coding sublayer (PCS) and physical media attachment (PMA) logic, allowing direct connection to SERDES-based backplanes without external glue logic.
Typical applications include high-speed serial backplane aggregation routers, baseband processing for wireless infrastructure, video broadcast and editing equipment, military signal-processing systems, and PCI Express endpoint implementations. The combination of high logic density, embedded transceivers, and large on-chip memory makes it well-suited to data-path-intensive workloads that must be reconfigured per deployment.
When designing with this device, ensure the PCB footprint accommodates the 40 x 40 mm FCBGA with controlled-impedance routing for the MGT lanes. Power budgeting must account for transceiver power, which scales linearly with line rate, and signal-integrity simulation is recommended above 3.125 Gbps. The part is part of a mature family with abundant reference designs but is generally considered legacy, so verify long-term availability against new design requirements.
This page synthesizes distributor pricing, drop-in same-package alternatives drawn from the Stratix II GX family, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP2SGX90FF1508I4N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX90FF1508I4N (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature, Mounting Type, Configuration Method.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP2SGX90FF1508C5N
✅ Drop-In✓ In Stock
$1380 / Unit
View Datasheet →EP2SGX90FF1508C4N
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$1500 / Unit
View Datasheet →EP2SGX90FF1508I3N
✅ Drop-In✓ In Stock
$1460 / Unit
View Datasheet →EP2SGX90FF1508I4K
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$1620 / Unit
View Datasheet →EP2SGX90FF1508C4
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$1390 / Unit
View Datasheet →EP2SGX90FF1508C3
✅ Drop-In✓ In Stock
$1380 / Unit
View Datasheet →EP2SGX90FF1508I4N Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Logic Elements (LE) | 90960 |
| Logic Array Blocks (LABs) | 4548 |
| Total Embedded Memory | 4520448 bits |
| Maximum User I/O | 650 |
| Package | 1508-BBGA, FCBGA |
| Package Body Size | 40 mm x 40 mm |
| Ball Pitch | 1.0 mm |
| Operating Temperature Grade | Industrial |
| Process Technology | 90 nm CMOS |
| Configuration Method | JTAG, Passive Serial |
| RoHS Status | Lead-Free (compliant per datasheet) |
| Mounting Type | Surface Mount (BGA) |
EP2SGX90FF1508I4N 40 mm x 40 mm Pin Configuration Guide
Pin configuration for EP2SGX90FF1508I4N (40 mm x 40 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX90FF1508I4N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX90FF1508I4N is suitable for 7 applications: High-Speed Serial Backplane Aggregation, Wireless Baseband Signal Processing, Video Broadcast and Editing Equipment, PCI Express Endpoint Implementation, Military and Aerospace Signal Processing, Industrial Automation and Motor Control, Test and Measurement Instrumentation.
High-Speed Serial Backplane Aggregation
The EP2SGX90FF1508I4N's 12 integrated Multi-Gigabit Transceivers (MGTs) make it well suited to aggregating multiple serial lanes from line cards into a switch fabric backplane. Each MGT supports serializer/deserializer (SERDES) operation at multi-gigabit rates with on-chip PCS and PMA logic, allowing direct connection to SFP+, XAUI, or Serial RapidIO links without external PHY devices. The 90,960 logic elements and 4.5 Mbit of TriMatrix memory provide ample buffering for packet processing, while the 650 user I/O pins interface to parallel management busses and external memory. Designers should plan for controlled-impedance routing and verify signal integrity at the target line rate before tapeout.
Recommended
Wireless Baseband Signal Processing
Wireless baseband processing requires intensive DSP arithmetic, large data buffers, and high-bandwidth I/O, all of which the EP2SGX90FF1508I4N delivers. Its dedicated DSP blocks implement fixed- and floating-point multiply-accumulate operations at hundreds of MHz, supporting channelization, FFT, and FEC decoding for LTE and WiMAX systems. The 4.5 Mbit of TriMatrix memory holds time-domain samples between processing stages without external DRAM latency. Transceivers feed digitized RF data directly into the FPGA from ADC/DAC front-ends, reducing analog trace length and improving EMI performance. The industrial temperature grade supports outdoor base-station deployment.
Recommended
Video Broadcast and Editing Equipment
Professional video broadcast equipment (HD-SDI routers, frame synchronizers, format converters) demands high logic density and dedicated SERDES for uncompressed video streams. The EP2SGX90FF1508I4N's 12 MGTs handle multiple HD-SDI or 3G-SDI inputs simultaneously, while its on-chip memory buffers line-store and frame-store data without external SRAM. The 90K logic elements implement real-time scaling, de-interlacing, and color-space conversion. Designers should consider the FBGA-1508 thermal envelope at full transceiver utilization - active cooling or a substantial heatsink is typically required for sustained broadcast workloads.
Recommended
PCI Express Endpoint Implementation
The EP2SGX90FF1508I4N implements PCI Express Gen1 (2.5 Gbps) and Gen2 (5 Gbps) endpoints using its integrated MGT channels and Intel's hard PCIe IP core. This avoids the need for an external PCIe PHY and reduces BOM cost and PCB area. The 650 user I/O pins connect to application logic, DMA engines, and local memory buses. For Gen3 designs, designers should migrate to newer Intel families; for maintaining existing PCIe Gen1/Gen2 systems, this part remains fully supported by the Quartus II design toolchain. The industrial temperature grade supports server-room and edge-compute deployment.
Recommended
Military and Aerospace Signal Processing
Defense and aerospace programs frequently adopt the EP2SGX90FF1508I4N for radar, electronic warfare, and SIGINT subsystems where long lifecycle support and high logic density outweigh power-efficiency concerns. The industrial temperature grade (-40 C to +100 C case) supports most military operating environments. The integrated transceivers digitize RF outputs from phased-array antennas directly, while on-chip DSP blocks implement pulse compression and beam-forming algorithms. Program freeze across program lifetimes is critical here, which is why NRN'D-but-available parts like this Stratix II GX remain in active defense designs.
Recommended
Industrial Automation and Motor Control
Industrial automation platforms use the EP2SGX90FF1508I4N for high-channel-count motion control, where the logic density accommodates multiple PID loops, encoder interfaces, and EtherCAT or SERCOS III MAC implementations in a single device. The transceivers connect to fieldbus networks at 100 Mbps full-duplex, while the parallel I/O drives PWM signals to power stages. Industrial temperature grade supports factory-floor deployment without additional thermal conditioning. Designers typically pair this FPGA with external DRAM for trajectory buffering and external flash for configuration storage across long maintenance intervals.
Recommended
Test and Measurement Instrumentation
High-end oscilloscopes, logic analyzers, and protocol testers leverage the EP2SGX90FF1508I4N to capture and analyze multi-gigabit signals in real time. The 12 MGTs provide parallel acquisition channels for serial protocol decoding, while 4.5 Mbit of memory holds pre-trigger samples at full sample rate. The 90K logic elements implement triggering state machines and on-chip protocol decoding engines. Industrial temperature operation supports lab and field-deployed instruments. Designers should plan for high-bandwidth memory subsystems; on-chip memory alone cannot sustain long-duration captures at GHz sample rates.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX90FF1508I4N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX90FF1508C5N | EP2SGX90FF1508C4N | EP2SGX90FF1508I3N | EP2SGX90FF1508I4K |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 1508-BBGA, FCBGA | 1508-BBGA, FCBGA - same | 1508-BBGA, FCBGA - same | 1508-BBGA, FCBGA - same | 1508-BBGA, FCBGA - same |
| Logic Elements | 90960 | 90960 (same) | 90960 (same) | 90960 (same) | 90960 (same) |
| Operating Temperature Grade | Industrial (-40 to +100 C) | Commercial (0 to +85 C) | Commercial (0 to +85 C) | Industrial (-40 to +100 C) | Industrial (-40 to +100 C) |
| Speed Grade | -4 | -5 (faster) | -4 (same) | -3 (slower) | -4 (same) |
| RoHS / Lead-Free | Lead-Free | Lead-Free | Lead-Free | Lead-Free | Lead-Free (K suffix) |
| Transceivers | 12 MGT channels | 12 MGT channels | 12 MGT channels | 12 MGT channels | 12 MGT channels |
| Embedded Memory | 4520448 bits | 4520448 bits (same) | 4520448 bits (same) | 4520448 bits (same) | 4520448 bits (same) |
| User I/O | 650 | 650 (same) | 650 (same) | 650 (same) | 650 (same) |
Key Differentiators
- Pin-to-pin drop-in compatibility across full Stratix II GX family (vs EP2S90F1508C4N (non-GX variant))
- Industrial temperature grade availability (vs EP2SGX90FF1508C5N (commercial grade))
- High logic density with on-chip DSP blocks (vs EP2SGX60FF1152 (lower-density variant))
Design Notes
Estimated: the 40 x 40 mm FCBGA package has limited heat dissipation through the BGA balls alone. At full transceiver utilization (12 lanes at 3.125 Gbps) plus 70% logic utilization, expect 8-12 W total power dissipation. Use a heatsink with thermal interface material, or implement thermal vias under the package center BGA thermal balls, to keep junction temperature below 100 C in industrial environments. Without active cooling, sustained operation at maximum utilization may exceed thermal limits.
The 1508-ball FCBGA at 1.0 mm pitch requires at least 12 PCB layers with HDI (High-Density Interconnect) construction including micro-vias and buried vias for signal fanout. Controlled-impedance routing (typically 50 ohm single-ended, 100 ohm differential) is mandatory for the MGT lanes, with trace length matching within 5 mil for differential pairs. Reference the Altera Stratix II GX Board Design Guidelines and AN 376 transceiver layout application note before committing to stackup.
Each MGT lane requires dedicated AC-coupling capacitors on the transmit and receive paths, placed within 1 inch of the FPGA ball. Use 0402-size 100 nF X7R capacitors with the center pad connected to a clean ground via. For multi-gigabit operation above 3.125 Gbps, perform 3D EM simulation on the channel to verify insertion loss and return loss; reference Altera's transceiver Signal Integrity Toolkits. Pre-emphasis and equalization settings in the ALT2GXB megafunction must be tuned per channel length and material loss.
Estimated: the EP2SGX90FF1508I4N requires multiple power rails - core VCC (typically 1.2 V), PLL analog VCC (1.2 V filtered), MGT analog supplies (1.5 V and 1.2 V), and I/O banks (1.5 V, 1.8 V, 2.5 V, 3.3 V depending on bank configuration). Use a power supply sequencer such as the LTC2923 or equivalent to enforce the required power-up sequence (core before I/O). Bulk decoupling (220 uF polymer) and high-frequency decoupling (10 uF + 100 nF per rail) must be placed within 0.5 inch of the BGA balls. Power plane islands under the package are mandatory; split planes for different voltage domains must avoid crossing sensitive MGT ground returns.
Do not assume the part is pin-compatible with the non-GX Stratix II variants (EP2S90F1508...). Although the package pin count is identical, ball assignments for MGT power and ground differ. Verifying pinout against the Stratix II GX Device Handbook (Chapter 9) before PCB layout prevents costly respins. Also note that configuration bitstreams are NOT interchangeable between temperature grades or speed grades - recompile in Quartus II for each variant even when the source RTL is identical.
Compliance Information
RoHS compliance per Altera/Intel datasheet (Pb-Free marking on package). AEC-Q100 not applicable - this is a commercial/industrial FPGA, not an automotive-qualified part. Halogen-free status not explicitly stated in the verified web data; verify with manufacturer if required.