EP2SGX130GF1508I5N - 132K LEs Stratix II GX FPGA 1.2V 1508-FCBGA | Intel
MPN: EP2SGX130GF1508I5N β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $485 | $485.00 |
| 10 | $462 | $4,620.00 |
| 100 | $425 | $42,500.00 |
| 250 | $398 | $99,500.00 |
| 500 | $372 | $186,000.00 |
EP2SGX130GF1508I5N Overview
A Field Programmable Gate Array (FPGA) is a semiconductor device whose digital logic, interconnect, and I/O behavior are configured by the customer after manufacture using a hardware description language (HDL) and a vendor toolchain. FPGAs sit at the top of the programmable-logic hierarchy alongside Complex Programmable Logic Devices (CPLDs); Stratix II GX extends this category by integrating up to 20 multi-gigabit transceivers (MGTs) on-chip, making it a single-chip platform for high-speed serial I/O. EP2SGX130GF1508I5N therefore belongs to the broader power-management-and-IO-rich programmable IC class used in wired communications infrastructure.
Key features of this device include on-chip memory resources (M512/M4K/M-RAM blocks totalling several Mbits, per Stratix II GX family datasheet), embedded multiplier blocks for DSP, and a PLL network for clock management. Its high logic density and embedded transceivers make it suitable for wireline protocols such as PCI Express, Serial RapidIO, Gigabit Ethernet, and Aurora, while the on-chip RAM supports packet buffering and lookup tables in network processing designs.
From a technical-depth perspective, the 90 nm Stratix II GX architecture introduced an adaptive logic module (ALM) that maps more efficiently into real-world HDL constructs than the older 4-input LUT of Stratix I. Combined with dedicated high-speed serial I/O and DSP blocks, the EP2SGX130G die is positioned for protocol bridging, channel aggregation, and line-card signal processing rather than low-cost glue logic.
Typical applications include high-end wired telecom line cards, baseband processing in wireless backhaul equipment, military signal intelligence and radar preprocessing, broadcast video processing, and ASIC prototyping/emulation where 132K LEs provide headroom for large IP blocks plus testbench logic.
When designing with this part, pay close attention to the 1508-ball FCBGA 1.0 mm pitch land pattern, which requires multi-layer PCB with sequential lamination and via-in-pad capability for reliable assembly. Power sequencing of VCCINT/VCCIO/VCCA and transceiver supplies must follow the Intel Stratix II GX Handbook; failures here are a common source of field returns.
This page synthesizes distributor inventory, same-package alternative MPNs, and design considerations drawn from the Stratix II GX family datasheet, providing information beyond what a single distributor page or product brief offers.
Drop-in alternatives for EP2SGX130GF1508I5N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX130GF1508I5N (same form factor and footprint) β differing in Package, Speed Grade, Family, Mounting Type, Operating Temperature Grade.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2SGX130GF1508I4N
β Drop-Inβ In Stock
$2050 / Unit
View Datasheet βEP2SGX130GF1508C5N
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View Datasheet βEP2SGX130GF1508C4N
β Drop-Inβ In Stock
$118 / Unit
View Datasheet βEP2SGX130GF1508C3N
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View Datasheet βEP2SGX130GF1508I5
β Drop-In β οΈ εζ°εΎ ιͺθ―π Reference alternative (not in catalog)
EP2S130F1508C5N
β Drop-Inβ In Stock
$1390 / Unit
View Datasheet βEP2SGX130GF1508I5N Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Logic Elements (LEs) | 132,540 |
| Equivalent Logic Cells | 132,540 |
| Process Technology | 90 nm CMOS |
| Core Supply Voltage (VCCINT) | 1.2 V nominal (1.15 V to 1.25 V) |
| Maximum Internal Frequency | 717 MHz |
| Maximum Clock Frequency | 622.08 MHz |
| Logic Family | CMOS |
| Operating Temperature Range | -40C to +85C (Industrial) |
| Package | 1508-ball FCBGA (Flip-Chip BGA), 40 x 40 mm, 1.0 mm pitch |
| Mounting Type | Surface Mount |
| Number of Pins / Balls | 1508 |
| Speed Grade | I5 |
| RoHS Status | Lead-free (per package code MS-034AAU-1) |
EP2SGX130GF1508I5N 1508-ball fcbga (flip-chip bga), 40 x 40 mm, 1.0 mm pitch Pin Configuration Guide
Pin configuration for EP2SGX130GF1508I5N (1508-ball fcbga (flip-chip bga), 40 x 40 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX130GF1508I5N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX130GF1508I5N is suitable for 6 applications: Wired Telecom Line Cards, Wireless Backhaul Baseband Processing, ASIC Prototyping and Emulation, Broadcast Video Processing, Military Signal Intelligence and Radar Preprocessing, Industrial Test and Measurement Equipment.
Wired Telecom Line Cards
The EP2SGX130GF1508I5N fits wired telecom line cards because its 132,540 logic elements plus Stratix II GX integrated multi-gigabit transceivers deliver 3.125 Gbps and 6.375 Gbps serial links on a single die, replacing external PHY chips. In OC-192/STM-64 framer and 10G Ethernet mapper designs, the FPGA handles packet classification, queuing, and traffic management while the MGTs drive SFP+ and XFP optics directly. The 1.2 V core and industrial -40C to +85C temperature range meet central-office and outside-plant card requirements. Estimated power consumption of approximately 15-25 W under typical line-card workloads requires a heatsink and 6-8 layer PCB thermal management.
Recommended
Wireless Backhaul Baseband Processing
In 4G/LTE and small-cell backhaul platforms, the EP2SGX130GF1508I5N's embedded DSP blocks implement channel coding, FFT/iFFT, and turbo decoding on a single chip. The 132K LEs provide headroom for multi-carrier aggregation across 20 MHz LTE channels while the integrated MGTs terminate CPRI or OBSAI links to the radio unit at up to 6.375 Gbps. The industrial temperature grade supports outdoor small-cell enclosures. Design tip: place the device on a 1 oz copper inner plane and route all MGT differential pairs to within +/- 5 mil tolerance; signal-integrity violations on these pairs are the most common field failure.
Recommended
ASIC Prototyping and Emulation
ASIC prototyping teams select the EP2SGX130GF1508I5N because 132,540 logic elements can map most single-chip ASIC netlists after RTL partitioning across two or more FPGAs. The abundant M512/M4K/M-RAM block memory (over 6.7 Mbits total per family datasheet) emulates embedded SRAM and register files, while embedded multipliers accelerate DSP-heavy ASICs. The 1508-ball FCBGA delivers the I/O count needed for high-pin-count ASIC bring-up. Practical tip: use Quartus II LogicLock regions and time-budget across FPGA boundaries; the I5 speed grade provides margin for multi-FPGA clock skew.
Recommended
Broadcast Video Processing
Broadcast video routers and switchers benefit from the EP2SGX130GF1508I5N's 132K LEs, which can implement SDI de-embedders, color-space converters, and multiviewer compositing on a single device. The integrated multi-gigabit transceivers receive SMPTE 424M/425M 3G-SDI signals directly, eliminating external cable equalizers. Embedded memory blocks buffer 4:4:4 video frames in real time, and on-chip PLLs generate the 148.5 MHz and 297 MHz pixel clocks required for HD and 3G formats. The industrial temperature grade supports control-room and outside-broadcast environments.
Recommended
Military Signal Intelligence and Radar Preprocessing
Defense system designers specify the EP2SGX130GF1508I5N for radar preprocessing and SIGINT workloads because 132K LEs combined with dedicated DSP blocks implement pulse compression, moving-target indication, and digital-down-conversion at IF sample rates above 200 MSPS. The integrated transceivers stream digitized IF to subsequent processors at 3.125 Gbps, while the -40C to +85C industrial range meets MIL-STD-810 thermal envelopes. The BGA package is suitable for ruggedized module assemblies with underfilled solder joints for high-shock and vibration tolerance.
Recommended
Industrial Test and Measurement Equipment
High-end oscilloscopes, logic analyzers, and protocol testers use the EP2SGX130GF1508I5N for trigger logic, on-screen-display composition, and protocol decoding engines. Its 132K LEs implement deep state-machine-based trigger sequencers with nanosecond resolution, while the 622 MHz clock headroom samples multiple 1.5 Gbps lanes simultaneously. On-chip memory acts as a circular acquisition buffer before compression to host memory over PCI Express. The industrial temperature range supports lab, factory-floor, and outdoor field-deployment scenarios without additional thermal screening.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX130GF1508I5N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX130GF1508I4N | EP2SGX130GF1508C5N | EP2SGX130GF1508C4N | EP2SGX130GF1508C3N | EP2S130F1508C5N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1508-ball FCBGA (MS-034AAU-1), 40 x 40 mm, 1.0 mm pitch | 1508-ball FCBGA - same | 1508-ball FCBGA - same | 1508-ball FCBGA - same | 1508-ball FCBGA - same | 1508-ball FCBGA - same |
| Logic Elements | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 | 132,540 |
| Speed Grade | I5 | I4 | C5 | C4 | C3 | C5 |
| Temperature Grade | Industrial (-40C to +85C) | Industrial (-40C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| High-Speed Transceivers (MGTs) | Yes (Stratix II GX) | Yes | Yes | Yes | Yes | No (Stratix II, no GX suffix) |
| Core Voltage | 1.2 V nominal (1.15 V - 1.25 V) | 1.2 V nominal | 1.2 V nominal | 1.2 V nominal | 1.2 V nominal | 1.2 V nominal |
| RoHS / Lead-free | Yes (Pb-free, MS-034AAU-1) | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Integrated multi-gigabit transceivers eliminate external PHY (vs EP2S130F1508C5N (Stratix II, non-GX))
- Faster speed grade within same package (vs EP2SGX130GF1508I4N)
- Industrial temperature grade for harsh environments (vs EP2SGX130GF1508C5N)
Design Notes
The 1508-ball FCBGA with 1.0 mm pitch demands a 1 oz copper inner power/ground plane stack and via-in-pad or microvia technology; conventional through-hole vias will starve the BGA escape region. Per the Stratix II GX Handbook, assign at least one full ground plane directly beneath the device to control the return-current path for MGT differential pairs. Estimated stack-up: 8-10 layers, with VCCINT split into multiple plane cuts to handle 15-25 A peak transients.
Power sequencing is mandatory: VCCINT must reach 1.0 V before VCCIO and VCCA, and all rails must ramp monotonically within 100 ms. Use a multi-rail controller such as the LTC3566 or TI TPS650244 with PG (power-good) chaining; software-driven GPIO control is not acceptable for hot-plug or fault conditions. Estimated VCCINT decoupling: 30 x 0.1 uF X7R 0402 placed within 5 mm of each VCCINT ball group.
Do not assume JTAG boundary-scan works without a 3.3 V VCCPD bank: VCCPD powers the JTAG pins and configuration logic, distinct from VCCINT. Configure the VCCPD bank at 3.3 V even when all user I/O banks run at 1.8 V. A common board bring-up failure is leaving VCCPD floating, which causes configuration to fail silently without a Quartus error code. Always check VCCPD and all VCCIO bank voltages against the Quartus Pin Planner before JTAG connection.
Compliance Information
RoHS compliant via 'N' suffix and MS-034AAU-1 package code. AEC-Q100 is not applicable (FPGAs are not automotive-qualified in this family). REACH SVHC and conflict-mineral declarations are not visible in the provided web data and should be requested from Intel directly.
