EP2SGX90FF1508C5N - Stratix II GX FPGA, 90K LE, FCBGA-1508 | Intel
MPN: EP2SGX90FF1508C5N β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1750 | $17,500.00 |
| 100 | $1620 | $162,000.00 |
| 500 | $1490 | $745,000.00 |
| 1,000 | $1380 | $1,380,000.00 |
EP2SGX90FF1508C5N Overview
What is an FPGA? A Field-Programmable Gate Array is a semiconductor integrated circuit built around a matrix of configurable logic blocks (CLBs/LABs), programmable interconnect, and dedicated hard IP blocks (memory, DSP, transceivers, PLLs). FPGAs sit between general-purpose microcontrollers and fixed-function ASICs: they offer ASIC-class parallelism and throughput while remaining fully re-programmable in the field, making them ideal for prototyping, low-volume production, and applications whose algorithms evolve over the product lifetime.
Key features of the EP2SGX90FF1508C5N include 90,960 logic elements (LEs), 4,548 LABs, 4,520,448 RAM bits, 650 user I/O pins, and integrated high-speed transceivers supporting protocols such as PCI Express, Serial RapidIO, XAUI, CEI-6G, and Gigabit Ethernet. The part uses a 1.2 V core supply with separate VCCPD, VCCA, and transceiver supply rails, and supports configuration via passive serial, fast passive parallel, and JTAG modes.
The Stratix II GX architecture employs an adaptive logic module (ALM) - an 8-input fracturable LUT - delivering up to 25% higher performance and 50% lower power than the original Stratix family at the same process node. Hard IP blocks such as TriMatrix memory, DSP blocks, and embedded transceivers free up logic for application code rather than overhead functions.
Typical applications for the EP2SGX90FF1508C5N include 10 Gbps datacom/telecom line cards, high-end test and measurement equipment, military/aerospace signal processing, ASIC prototyping for ASIC-class compute engines, and high-throughput DSP pipelines (radar, beamforming, video processing).
When designing with this device, allocate a multi-rail power solution (core, I/O banks, PLL analog, transceiver PLLs) and follow the Stratix II GX pin connection guidelines for unused pins and bank VREF. The 40 x 40 mm FCBGA-1508 requires a multilayer PCB with microvia stack-ups, controlled-impedance traces for transceiver channels, and matched-length routing for source-synchronous interfaces.
This page synthesizes distributor pricing, application guidance, and a curated drop-in alternative list not found in a single manufacturer datasheet, helping engineers evaluate the EP2SGX90FF1508C5N against newer Stratix IV/Stratix V equivalents.
Drop-in alternatives for EP2SGX90FF1508C5N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP2SGX90FF1508C5N (same form factor and footprint) β differing in Package, Operating Temperature, Speed Grade, RoHS Status, Configuration Method.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP2SGX90FF1508C4N
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$1500 / Unit
View Datasheet βEP2SGX90FF1508C3N
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View Datasheet βEP2SGX90FF1508C5
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View Datasheet βEP2SGX90FF1508C5ES
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View Datasheet βEP2SGX90FF1508
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View Datasheet βEP2SGX90FF150834N
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$580 / Unit
View Datasheet βEP2SGX90FF1508C5N Maximum Ratings & Electrical Characteristics
| Family | Stratix II GX |
| Logic Elements (LEs) | 90,960 |
| Logic Array Blocks (LABs) | 4,548 |
| Total RAM Bits | 4,520,448 |
| User I/O Pins | 650 |
| Package | 1508-ball FCBGA (FBGA-1508), 40 x 40 mm, 1 mm pitch |
| Process Node | 90 nm CMOS |
| Core Voltage (VCCINT) | 1.2 V |
| Speed Grade | C5 (commercial, -5 speed) |
| Operating Temperature | Commercial (0C to +85C junction) |
| High-Speed Transceivers | Up to 20 channels, up to 6.375 Gbps |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG |
| Lead-Free / RoHS | Lead-free per JEDEC MS-034AAU-1 |
| Mounting Type | Surface Mount (BGA) |
EP2SGX90FF1508C5N 1508-ball fcbga (fbga-1508), 40 x 40 mm, 1 mm pitch Pin Configuration Guide
Pin configuration for EP2SGX90FF1508C5N (1508-ball fcbga (fbga-1508), 40 x 40 mm, 1 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP2SGX90FF1508C5N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP2SGX90FF1508C5N is suitable for 7 applications: 10 Gbps Telecom Line Cards, High-End Test and Measurement Equipment, ASIC Prototyping Platforms, Radar and Beamforming DSP, High-Throughput Video Processing, Industrial Control and Factory Automation, Legacy Sustainment and Field Upgrades.
10 Gbps Telecom Line Cards
The EP2SGX90FF1508C5N is well matched to 10 Gbps telecom line cards because of its up-to-20 transceiver channels running up to 6.375 Gbps and 90,960 logic elements for framer/mapper/forward-error-correction pipelines. Its 4,520,448 bits of TriMatrix embedded memory buffer packet descriptors and lookup tables without external SSRAM, while 650 user I/Os route SPI-4.2 or SFI-4.1 parallel fabric to backplane connectors. The FCBGA-1508 footprint supports controlled-impedance transceiver routing required by XAUI and CEI-6G, and the 90 nm process delivers the Fmax headroom needed for OTN framer datapaths at 10+ Gbps aggregate throughput.
Recommended
High-End Test and Measurement Equipment
The EP2SGX90FF1508C5N suits high-end oscilloscopes, logic analyzers, and protocol testers where 90K logic elements implement real-time DSP and trigger logic while 650 I/Os fan out to high-speed ADCs and DACs. The embedded transceivers deliver captured waveforms to host CPUs via PCI Express Gen2 or Serial RapidIO without external PHYs. The device's 4,520,448 bits of on-chip memory act as deep capture buffers, replacing external SRAM and reducing BOM cost. Industrial temperature variants of this part (e.g., EP2SGX90FF150834N) extend operation into calibration lab and production test environments.
Recommended
ASIC Prototyping Platforms
The EP2SGX90FF1508C5N is widely deployed in ASIC prototyping because 90,960 LEs, 4,520,448 memory bits, and 650 I/Os map directly to multi-million-gate ASICs in a single device. Multiple FPGAs can be tiled on a prototyping board using the high-speed transceivers as chip-to-chip interconnect, achieving near-ASIC performance for early software development and verification. The FCBGA-1508 package exposes all transceiver channels, simplifying multi-FPGA partitioning. Although NRND, the part remains available through distributors in volume, which is critical for sustaining prototype boards over multi-year ASIC development cycles.
Recommended
Radar and Beamforming DSP
The EP2SGX90FF1508C5N's TriMatrix memory and high logic density make it a strong fit for radar front-end beamforming and baseband DSP pipelines. Embedded DSP blocks (count not specified in provided data) handle FFT and pulse-compression math while the 90,960 logic elements implement adaptive beam-steering weights. High-speed transceivers stream digitized antenna data to back-end processors at multi-gigabit rates, and the 650 user I/Os route LVDS ADC samples into the FPGA at hundreds of MHz. Industrial-temp variants (EP2SGX90FF150834N) support the rugged environmental requirements of airborne and naval radar systems.
Recommended
High-Throughput Video Processing
Broadcast and pro-AV systems use the EP2SGX90FF1508C5N to process uncompressed 3G-SDI, HD-SDI, and dual-link SDI streams because the 90K logic elements sustain multi-channel scaling, color-space conversion, and overlay composition in real time. 650 user I/Os drive HDMI/DisplayPort transmitters and parallel video DACs, while 4,520,448 RAM bits absorb line and frame buffers without external DRAM. The transceivers output SDI at 2.97 Gbps per channel, eliminating external serializer chips. Production video switchers and routers have used Stratix II GX as the core processing element for over a decade.
Recommended
Industrial Control and Factory Automation
The EP2SGX90FF1508C5N's high I/O count (650 pins) and reconfigurable logic suit industrial controllers that must aggregate dozens of fieldbus interfaces such as EtherCAT, PROFINET, and SERCOS III while running deterministic real-time control loops on the 90,960 logic elements. Embedded transceivers handle industrial Ethernet PHYs without external components. The FCBGA-1508 mechanical package is appropriate for fixed installations but requires PCB-level thermal management - designers should follow the Stratix II GX thermal guidelines. Industrial temperature grade EP2SGX90FF150834N extends operating range into factory floor conditions.
Recommended
Legacy Sustainment and Field Upgrades
Military and aerospace programs with 15-25 year sustainment requirements continue to use the EP2SGX90FF1508C5N because it was designed into flight-certified systems and fielded in large quantities. Although NRND, the part remains in distributor inventory - Octopart reports ~43,160 pieces across 17 sources as of 2026-07-06 - which is sufficient for repair pipelines through the early 2030s. The drop-in nature of speed-grade variants (C3N, C4N, C5) and the temperature-grade variant (834N) provides flexibility for matching replacement parts to specific system qualification baselines.
Recommended
Recommended Products Summary
Engineering reference data for EP2SGX90FF1508C5N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP2SGX90FF1508C4N | EP2SGX90FF1508C3N | EP2SGX90FF1508C5 | EP2SGX90FF1508C5ES | EP2SGX90FF1508 | EP2SGX90FF150834N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | FCBGA-1508 (FF1508), 40x40 mm, 1 mm pitch | FCBGA-1508 (FF1508) - same | FCBGA-1508 (FF1508) - same | FCBGA-1508 (FF1508) - same | FCBGA-1508 (FF1508) - same | FCBGA-1508 (FF1508) - same | FCBGA-1508 (FF1508) - same |
| Logic Elements | 90,960 | 90,960 | 90,960 | 90,960 | 90,960 | 90,960 | 90,960 |
| LABs | 4,548 | 4,548 | 4,548 | 4,548 | 4,548 | 4,548 | 4,548 |
| Total RAM Bits | 4,520,448 | 4,520,448 | 4,520,448 | 4,520,448 | 4,520,448 | 4,520,448 | 4,520,448 |
| User I/Os | 650 | 650 | 650 | 650 | 650 | 650 | 650 |
| Speed Grade | -5 (C5) | -4 (C4) - slower | -3 (C3) - slowest | -5 (C5) - same | -5 (C5) - same | unspecified | -3 industrial (834) |
| Operating Temperature | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Highest speed grade (-5) for Stratix II GX FF1508 family (vs EP2SGX90FF1508C4N)
- Stratix II GX FF1508 family with widest commercial-availability distributor coverage (vs EP2SGX90FF1508C3N)
- Standard commercial temperature grade for sustained operation (vs EP2SGX90FF150834N)
Design Notes
Stratix II GX requires multiple power rails: VCCINT (1.2 V core), VCCPD (I/O pre-driver, 3.3 V typical), VCCA (PLL analog, 2.5 V), VCCD_PLL (PLL digital), and per-bank VCCIO. Each transceiver channel needs VCCE (transmitter) and VCCA (receiver) supplies. Decoupling: place 0.1 uF X7R ceramic capacitors within 100 mil of every VCCINT ball, plus bulk decoupling of at least 4 x 22 uF per supply plane. Estimated: core current at 90 nm process for 90K LEs can reach 5-8 A under full toggle - check PDN impedance with a target of <2 mOhm from bulk cap to BGA ball.
The FCBGA-1508 (40 x 40 mm) package dissipates significant heat under full utilization. Use a minimum 8-layer PCB with an inner solid ground plane and at least one inner VCCINT plane in direct contact with the BGA thermal balls. Thermal vias under the exposed die paddle must be filled and plated for low thermal resistance. For commercial-grade parts at 85C ambient, target theta-JA under 5 C/W; industrial-grade parts (-40C to +100C) require heatsink or forced-air cooling above 15 W dissipation.
Design the PCB with microvia stack-ups because 1 mm BGA pitch cannot be reliably routed with through-vias on every ball. Use laser-drilled microvias (4-6 mil) for inner-layer fan-out from each BGA ball. Transceiver channels require 100-ohm differential routing with <5 mil intra-pair skew and matched loss up to 6.375 Gbps. Series AC-coupling capacitors (typically 100 nF) must be placed within 200 mil of the transmitter side per PCIe/XAUI channel-compliance requirements. Estimate: a full Stratix II GX design needs a 14-16 layer PCB with mixed microvia/stacked-via structures.
Common pitfalls when designing with EP2SGX90FF1508C5N: (1) leaving unused transceiver channels unpowered - per Stratix II GX pin connection guidelines, all XCVR_RX and XCVR_TX pins need specific termination even when unused. (2) Driving configuration pins during power-up without proper sequencing - use a CPLD or supervisor to hold nCONFIG low until all rails are stable. (3) Exceeding VCCPD-VCCINT voltage differential during hot-swap - VCCPD must ramp within 1 ms of VCCINT or the I/O drivers can latch-up. (4) Skipping MSL handling for the FCBGA - the package is MSL3, requiring bake-out before reflow if floor life is exceeded.
Compliance Information
Lead-free per JEDEC MS-034AAU-1 marking on package. RoHS and REACH compliance confirmed by Intel product documentation. AEC-Q100 is not applicable (this is an FPGA, not an automotive-grade IC). Conflict-minerals compliance per Intel supplier program.
