EP3C80U484I7N - 81K Logic Elements Cyclone III FPGA | Intel
MPN: EP3C80U484I7N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $188.5 | $188.50 |
| 10 | $169.65 | $1,696.50 |
| 100 | $150.8 | $15,080.00 |
| 250 | $137.42 | $34,355.00 |
| 500 | $124.18 | $62,090.00 |
EP3C80U484I7N Overview
An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as multipliers and memory blocks. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) and are widely used to implement parallel processing, custom digital interfaces, and glue logic without the cost of an ASIC. Cyclone III specifically targets cost- and power-sensitive high-volume applications by combining 65 nm process technology with a low static power architecture.
Key features of the EP3C80U484I7N include 81,264 logic elements, 2,810,880 RAM bits (approx. 3.4 Mbit) of M9K embedded memory blocks, 244 embedded 18 x 18 multipliers (suitable for DSP functions), four Phase-Locked Loops (PLLs), and 295 user I/O. The device supports multiple I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL I/O, and includes dedicated high-speed serial interfaces for external memory controllers such as DDR/DDR2 SDRAM. Configuration is typically via active serial (AS), passive serial (PS), or JTAG.
The Cyclone III architecture is built on a 65 nm TSMC low-power process and uses a low-K dielectric to reduce interconnect capacitance. Eight input LUTs feed dedicated adder/subtractor/carry chains, and M9K memory blocks can be configured as RAM, ROM, shift registers, or FIFO buffers. The result is a balance of logic density, DSP throughput, and static power consumption optimized for cost-driven applications rather than maximum performance.
Typical applications for the EP3C80U484I7N include industrial motor control and factory automation, video surveillance and image processing pipelines, telecom line cards, automotive infotainment and driver assistance prototypes, portable medical instrumentation, and embedded DSP systems. Designers often pair it with DDR/DDR2 SDRAM and flash configuration memory on a multi-layer PCB.
When designing with this device, ensure proper decoupling on every VCCINT and VCCA power pin, follow the Cyclone III pin connection guidelines for unused pins (tie them to a defined logic level, do not float), and respect the 1.2 V core supply tolerance. JTAG and AS configuration pins should be accessible for in-system programming and board-level debug using Quartus II.
This page synthesizes distributor pricing, drop-in same-package Cyclone III alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP3C80U484I7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C80U484I7N (same form factor and footprint) — differing in Process Technology, Package, Embedded 18x18 Multipliers, RoHS Status, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3C80U484I7
✅ Drop-In✓ In Stock
$360.4 / Unit
View Datasheet →EP3C80U484C8N
✅ Drop-In✓ In Stock
$190.99 / Unit
View Datasheet →EP3C80U484C7N
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →EP3C55U484I7N
✅ Drop-In✓ In Stock
$188.5 / Unit
View Datasheet →EP3C40U484I7N
✅ Drop-In✓ In Stock
$118.8 / Unit
View Datasheet →EP3C80U484I7N Maximum Ratings & Electrical Characteristics
| Series | Cyclone III |
| Logic Elements | 81,264 |
| Total RAM Bits | 2,810,880 bits (343.5 Kbit M9K equivalent) |
| Embedded Memory | M9K blocks (9 Kbit each) |
| Embedded 18 x 18 Multipliers | 244 |
| PLLs | 4 |
| User I/O Pins (maximum) | 295 |
| Maximum Internal Frequency | 437 MHz |
| Core Supply Voltage (VCCINT) | 1.2 V |
| Speed Grade | I7 (industrial, 100 C junction, fast speed) |
| Operating Temperature | -40 C to +100 C (industrial) |
| Package | 484-FBGA (UBGA-484), 19 x 19 mm, 0.8 mm pitch |
| Mounting Type | Surface Mount (BGA) |
| Process Technology | 65 nm low-power CMOS |
| Configuration Modes | AS, PS, JTAG, FPP |
| MSL Level | 3 (168 hours) |
| RoHS Status | Compliant |
EP3C80U484I7N 484-fbga (ubga-484), 19 x 19 mm, 0.8 mm pitch Pin Configuration Guide
Pin configuration for EP3C80U484I7N (484-fbga (ubga-484), 19 x 19 mm, 0.8 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3C80U484I7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3C80U484I7N is suitable for 6 applications: Industrial Motor Control and Factory Automation, Video Surveillance and Image Processing Pipelines, Telecom Line Cards and Protocol Bridging, Automotive Infotainment and Driver Assistance Prototypes, Portable Medical Instrumentation and Patient Monitoring, Embedded DSP and Software-Defined Radio.
Industrial Motor Control and Factory Automation
The EP3C80U484I7N is well-suited for industrial motor control and factory automation because its 81,264 logic elements, 244 dedicated 18x18 multipliers, and four PLLs can implement multi-axis field-oriented control (FOC) loops with deterministic latency. The 1.2 V core supply keeps static power below typical Cyclone III levels, important for enclosed control cabinets operating at 60 C ambient. Its 295 user I/O accept industrial signal levels (24 V via external isolation) and the I7 industrial temperature rating supports -40 C to +100 C operation in unheated factory floors.
Recommended
Video Surveillance and Image Processing Pipelines
The EP3C80U484I7N handles video surveillance and image processing workloads by leveraging its 244 embedded 18x18 multipliers and 2,810,880 RAM bits to implement real-time video pipelines including Bayer demosaicing, edge detection, and H.264 encoding pre-processing. M9K blocks can be configured as line buffers for full HD frame storage, while the four PLLs generate pixel-clock and memory-clock domains from a single reference. The I7 speed grade closes timing at 1080p60 in typical designs.
Recommended
Telecom Line Cards and Protocol Bridging
The EP3C80U484I7N is widely deployed in telecom line cards for protocol bridging between TDM, Ethernet, and serial RapidIO domains. Its 295 user I/O support multiple high-speed LVDS lanes, while the LVDS serializer/deserializer (SERDES) is implemented in soft logic fabric. The 437 MHz internal frequency handles 1 Gbps line-rate processing with margin. Industrial temperature rating ensures reliability in central-office environments up to +100 C local junction temperature.
Recommended
Automotive Infotainment and Driver Assistance Prototypes
The EP3C80U484I7N enables automotive infotainment and ADAS prototypes by combining sufficient logic density for multiple camera input streams with industrial-grade temperature tolerance. Its LVDS I/O supports automotive camera serializers (e.g., TI FPD-Link III), while the 244 multipliers handle real-time lane detection and object recognition algorithms. The 1.2 V core supply simplifies thermal design in dashboard enclosures, and 295 user I/O accommodate multiple displays, touch controllers, and CAN/LIN bridges simultaneously.
Recommended
Portable Medical Instrumentation and Patient Monitoring
The EP3C80U484I7N fits portable medical instrumentation by offering high logic density at a low 1.2 V core voltage that extends battery life in handheld patient monitors. Its embedded multipliers process ECG, pulse-oximetry, and respiration DSP algorithms in parallel, while the four PLLs derive multiple sampling rates from a single low-frequency crystal. Industrial temperature rating ensures reliable operation across hospital, ambulance, and home-care environments from -40 C to +100 C.
Recommended
Embedded DSP and Software-Defined Radio
The EP3C80U484I7N serves embedded DSP and software-defined radio (SDR) applications by providing 244 18x18 hardware multipliers capable of implementing FFT, FIR, and DDC cores at baseband sample rates up to 200 MSPS in the I7 speed grade. Its M9K memory blocks hold twiddle-factor tables and FIR coefficients, while LVDS I/O interface directly to ADC/DAC converters. The 1.2 V low-power fabric is critical for portable SDR dongles and battery-powered tactical radios where power budget is constrained.
Recommended
Recommended Products Summary
Engineering reference data for EP3C80U484I7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C80U484I7 | EP3C80U484C8N | EP3C80U484C7N | EP3C55U484I7N | EP3C40U484I7N |
|---|---|---|---|---|---|---|
| Package | UBGA-484 (19x19 mm, 0.8 mm pitch) | UBGA-484 - same | UBGA-484 - same | UBGA-484 - same | UBGA-484 - same | UBGA-484 - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 81,264 | 81,264 | 81,264 | 81,264 | 55,296 (-32%) | 39,600 (-51%) |
| Total RAM Bits | 2,810,880 bits | 2,810,880 bits | 2,810,880 bits | 2,810,880 bits | 2,396,160 bits (-15%) | 1,161,216 bits (-59%) |
| Embedded 18x18 Multipliers | 244 | 244 | 244 | 244 | 156 (-36%) | 126 (-48%) |
| User I/O (max) | 295 | 295 | 295 | 295 | 327 | 331 |
| Speed Grade | I7 (industrial, fast) | I7 - same | C8 (commercial, slow) | C7 (commercial, intermediate) | I7 - same | I7 - same |
| Operating Temperature | -40 C to +100 C | -40 C to +100 C | 0 C to +85 C | 0 C to +85 C | -40 C to +100 C | -40 C to +100 C |
| Core Supply (VCCINT) | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Key Differentiators
- Highest LE density in Cyclone III with 295 user I/O in UBGA-484 (vs EP3C55U484I7N)
- Industrial -40 C to +100 C temperature range with fast I7 speed grade (vs EP3C80U484C8N)
- Low static power 65 nm process with 1.2 V core (vs Cyclone II EP2C80F484)
Design Notes
Estimated: the EP3C80U484I7N core draws approximately 250 mA quiescent at 1.2 V (VCCINT) at room temperature, plus dynamic current proportional to toggle rate. According to the Cyclone III Device Handbook, decoupling requires one 100 nF X7R 0402 ceramic per VCCINT pin and one 10 uF bulk tantalum or ceramic per VCCINT bank. PLL VCCA pins need additional 100 nF and 10 uF decoupling placed within 50 mils of the pin to minimize jitter.
The UBGA-484 package has 0.8 mm ball pitch which requires a 4-layer PCB minimum with 0.5 oz copper, laser-drilled microvias, and ENIG or immersion-silver surface finish for reliable assembly. Fanout should use dog-bone or via-in-pad pattern with ground stitching vias placed between signal vias for impedance control. According to the manufacturer, full ground and power planes directly under the BGA with no signal traces are required to minimize inductance and provide thermal dissipation.
Common pitfalls when designing with the EP3C80U484I7N include: (1) leaving unused pins floating - they must be tied to a defined logic level per the pin connection guidelines; (2) exceeding 1.2 V on VCCINT by more than 5 percent - this can damage the 65 nm core; (3) omitting JTAG pull-up resistors on TCK, TMS, TDI - causing configuration failures; (4) incorrect MSL3 handling - dry pack must be resealed or parts baked at 125 C for 24 hours if exposed more than 168 hours before reflow.
Differential pair routing for LVDS channels must maintain 100 ohm differential impedance with matched length within 20 mils. According to the Cyclone III Device Handbook, each LVDS pair requires a 100 ohm termination resistor placed at the receiver end within 250 mils of the FPGA pin. DDR/DDR2 memory interfaces should use fly-by topology with VTT termination at the end of the address/command bus; place the FPGA and memory on the same PCB side to avoid via stubs on critical clock lanes.
Compliance Information
RoHS compliant per manufacturer material declaration. Lead-free BGA balls. Not AEC-Q100 qualified - for automotive safety-critical applications an automotive-grade FPGA should be selected from Cyclone IV or Cyclone V automotive family. MSL 3 moisture sensitivity.
