EP3C40U484I7N - Cyclone III FPGA 39.6K LE 484-UBGA | Intel
MPN: EP3C40U484I7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $198 | $198.00 |
| 10 | $178.2 | $1,782.00 |
| 100 | $158.4 | $15,840.00 |
| 500 | $138.6 | $69,300.00 |
| 1,000 | $118.8 | $118,800.00 |
EP3C40U484I7N Overview
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that contains an array of configurable logic blocks (CLBs) connected by programmable interconnect, allowing hardware designers to implement arbitrary digital circuits. FPGAs sit in the semiconductor hierarchy between application-specific integrated circuits (ASICs) and general-purpose microcontrollers: more flexible than an ASIC and far more parallel than a microcontroller. Cyclone III sits in Intel's low-cost, low-power FPGA tier - designed for high-volume, cost-sensitive applications where ASIC NRE cost is unjustified.
Key features include up to 4 PLL blocks per device, dedicated DDR/DDR2/QDRII memory interfaces with 200 MHz performance, and 1.2 V core voltage operation. The 65 nm process combined with internal voltage regulation reduces static power significantly compared with the Cyclone II generation. The 484-UBGA package offers a 1.0 mm ball pitch and supports up to 331 user I/O pins for high-density parallel interfaces.
The Cyclone III architecture uses four-input look-up tables (LUTs), 9-Kbit M9K memory blocks, and 18x18-bit hardware multipliers arranged in columns adjacent to the M9K blocks. This column-based layout enables efficient DSP pipelines because multipliers and memory can be co-located with logic. Embedded multipliers can also be configured as 9x9 multipliers when higher precision is not required, doubling the available multiplier count.
Typical applications include industrial motor control, video processing, automotive driver assistance, telecommunications infrastructure, and embedded digital signal processing. The combination of high logic density, embedded memory, and hardware multipliers makes Cyclone III well suited to mid-range DSP and parallel data acquisition designs.
When designing with this device, ensure your I/O bank voltage plan is consistent with the peripherals you connect; mixed-voltage I/O banks must not exceed the absolute maximum ratings. Use the Quartus II (or later) design toolchain for synthesis, place-and-route, and timing closure - Cyclone III support is included in current Quartus versions.
This page synthesizes distributor pricing, same-brand drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP3C40U484I7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C40U484I7N (same form factor and footprint) — differing in Package, Process Technology, Family, Operating Temperature, Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3C40U484I7
✅ Drop-In✓ In Stock
$52.1 / Unit
View Datasheet →EP3C40U484C8N
✅ Drop-In✓ In Stock
$71.04 / Unit
View Datasheet →EP3C40U484C7N
✅ Drop-In✓ In Stock
$119.4 / Unit
View Datasheet →EP3C40F484I7N
✅ Drop-In✓ In Stock
$118.5 / Unit
View Datasheet →EP3C40U484A7N
✅ Drop-In✓ In Stock
$21.45 / Unit
View Datasheet →EP3C40U484I7N Maximum Ratings & Electrical Characteristics
| Series | Cyclone III |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements (LE) | 39,600 |
| Total Memory Bits | 1,161,216 bits |
| Embedded Memory (M9K Blocks) | 126 |
| Embedded 18x18 Multipliers | 126 |
| PLLs | 4 |
| Maximum User I/O | 331 |
| Process Technology | 65 nm |
| Core Voltage | 1.2 V |
| Operating Temperature | -40C to +100C (Industrial) |
| Package | 484-pin UBGA (Ultra FineLine BGA), 1.0 mm ball pitch |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| MSL Level | 3 |
| Speed Grade | 7 (mid) |
EP3C40U484I7N Pin Configuration
| Pin A1 | I/O — User I/O pin (bank-dependent voltage) |
| Pin A2 | I/O — User I/O pin |
| Pin B1 | I/O — User I/O pin |
| Pin B2 | VCCIO — I/O bank supply voltage |
| Pin C1 | GND — Ground reference |
| Pin C2 | VCCINT — Core 1.2 V supply |
| Pin D1 | I/O — User I/O pin |
| Pin D2 | I/O — User I/O pin |
| Pin E1 | I/O — User I/O pin |
| Pin E2 | VCCIO — I/O bank supply voltage |
| Pin F1 | GND — Ground reference |
| Pin F2 | VCCINT — Core 1.2 V supply |
| Pin G1 | I/O — User I/O pin |
| Pin G2 | I/O — User I/O pin |
| Pin H1 | I/O — User I/O pin |
| Pin H2 | VCCIO — I/O bank supply voltage |
| Pin J1 | GND — Ground reference |
| Pin J2 | VCCINT — Core 1.2 V supply |
| Pin K1 | I/O — User I/O pin |
| Pin K2 | I/O — User I/O pin |
| Pin L1 | TCK — JTAG test clock |
| Pin L2 | TMS — JTAG test mode select |
| Pin M1 | TDI — JTAG test data in |
| Pin M2 | TDO — JTAG test data out |
Typical Applications
EP3C40U484I7N is suitable for 6 applications: Industrial Motor Control, Video Processing & Image Pipeline, Telecommunications Infrastructure, Automotive Driver Assistance (ADAS), Embedded DSP / Software-Defined Radio, Test & Measurement Instrumentation.
Industrial Motor Control
The EP3C40U484I7N is well suited to industrial motor control applications because of its 126 embedded 18x18 multipliers and 126 M9K memory blocks. The 39,600 LEs provide ample logic for multi-axis Field-Oriented Control (FOC) loops, while the dedicated multipliers accelerate Park/Clarke transforms and PID computations in hardware. With 331 user I/O pins in the 484-UBGA package, the device can interface to multiple encoder inputs, PWM outputs, and analog front-ends simultaneously. Industrial-grade temperature rating (-40C to +100C) and the 4 PLLs for precise PWM timing make it a strong fit for variable-frequency drives, servo controllers, and robotic motion platforms.
Recommended
Video Processing & Image Pipeline
The EP3C40U484I7N's 1.16 Mbit of embedded memory and 126 multipliers enable real-time video processing pipelines such as scaling, color-space conversion, and edge detection. The 484-UBGA package supports the wide parallel data buses (16-32 bits) needed to ingest HD video at 60 fps without buffering to external memory. Its 4 PLLs generate pixel clocks, memory clocks, and processing clocks independently, allowing the timing closure required for deterministic video frame timing. The industrial temperature range ensures operation in outdoor surveillance, broadcast, and machine-vision enclosures.
Recommended
Telecommunications Infrastructure
Telecommunications infrastructure benefits from the EP3C40U484I7N's combination of high logic density, embedded memory, and SERDES-free parallel I/O that can be paired with external PHY devices. The 39.6K LEs are sufficient to implement glue logic, packet classifiers, and timing-recovery state machines for mid-range line cards or customer-premises equipment (CPE). Its 4 PLLs synthesize independent clocks for Ethernet PHYs, framer ICs, and backplane SERDES, while the 331 user I/O pins accommodate multiple SGMII/RGMII/GMII interfaces and management buses. The industrial temperature grade ensures reliable operation in outdoor base-station and roadside-cabinet deployments.
Recommended
Automotive Driver Assistance (ADAS)
For ADAS prototypes and pre-production ECUs, the EP3C40U484I7N provides the logic density and embedded DSP resources needed for sensor-fusion preprocessing on radar, lidar, and camera data streams. The 126 hardware 18x18 multipliers accelerate FFTs and FIR filters used in radar signal processing, while 1.16 Mbit of embedded memory holds window coefficients and intermediate sample buffers without external SRAM. The 484-UBGA package supports the high pin count required to interface to multiple camera parallel ports and automotive Ethernet PHYs. The automotive-grade EP3C40U484A7N variant extends qualification for AEC-Q100-style temperature profiles, although the I7N industrial part is widely used in pre-production vehicles.
Recommended
Embedded DSP / Software-Defined Radio
The EP3C40U484I7N's 126 hardware multipliers make it a strong fit for software-defined radio (SDR) baseband processing at sample rates up to approximately 100 MHz, depending on filter complexity. The M9K memory blocks store FIR filter coefficients and intermediate IQ samples close to the multipliers, enabling pipelined DSP layouts that close timing at high clock rates. The 4 PLLs derive independent sample, processing, and interface clocks from a single low-noise reference oscillator, simplifying RF front-end integration. The industrial temperature grade supports outdoor and vehicular deployments such as public-safety radio and avionics receiver prototypes.
Recommended
Test & Measurement Instrumentation
Bench and production test instruments benefit from the EP3C40U484I7N's fast logic and high I/O count for protocol-aware pattern generation, protocol-aware triggering, and DSP-based signal conditioning. The 39.6K LEs can host soft-cores for instrument control alongside custom measurement IP, while the 126 multipliers accelerate FFT-based spectrum analysis and digital-filter-based signal generation. Its 484-UBGA package supports the high-speed parallel ADC/DAC interfaces required for 16-bit digitizers at 250 MSPS, and the industrial temperature range allows deployment in factory test racks and field-service carts.
Recommended
Recommended Products Summary
Engineering reference data for EP3C40U484I7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C40U484I7 | EP3C40U484C8N | EP3C40U484C7N | EP3C40F484I7N | EP3C40U484A7N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-UBGA | 484-UBGA - same | 484-UBGA - same | 484-UBGA - same | 484-FBGA - same ball count, different BGA code | 484-UBGA - same |
| Logic Elements | 39,600 | 39,600 - same | 39,600 - same | 39,600 - same | 39,600 - same | 39,600 - same |
| Embedded Memory | 1,161,216 bits (126 M9K) | 1,161,216 bits - same | 1,161,216 bits - same | 1,161,216 bits - same | 1,161,216 bits - same | 1,161,216 bits - same |
| Temperature Grade | Industrial -40C to +100C | Industrial - same | Commercial 0C to +85C | Commercial 0C to +85C | Industrial - same | Automotive-grade |
| Speed Grade | 7 | 7 - same | 8 (faster) | 7 - same | 7 - same | 7 - same |
| PLLs | 4 | 4 - same | 4 - same | 4 - same | 4 - same | 4 - same |
| Max User I/O | 331 | 331 - same | 331 - same | 331 - same | 331 - same | 331 - same |
| Core Voltage | 1.2 V | 1.2 V - same | 1.2 V - same | 1.2 V - same | 1.2 V - same | 1.2 V - same |
Key Differentiators
- Industrial temperature grade with full Cyclone III logic density at the lowest cost point in the family (vs EP3C40U484C8N (commercial temperature))
- Same-die compatibility with the F484 FineLine BGA variant for design flexibility (vs EP3C40F484I7N)
- Pin-compatible with the automotive-grade A7N variant for production upgrade path (vs EP3C40U484A7N)
Design Notes
Estimated: The EP3C40U484I7N's 1.2 V core supply (VCCINT) must deliver up to approximately 1-2 A under typical 39.6K-LE utilization with moderate toggle rates, plus additional current for I/O banks at 3.3 V/2.5 V/1.8 V/1.5 V. Use a low-noise LDO or DC-DC regulator followed by an LC filter for VCCINT; place decoupling capacitors (0.1 uF plus 10 uF bulk) within 5 mm of each VCCINT ball to meet the Cyclone III power-integrity guidelines. Power sequencing between VCCINT and VCCIO is not strictly required for Cyclone III but is good practice to avoid latch-up during hot-plug events.
The 484-UBGA package has a junction-to-ambient thermal resistance (theta_JA) of approximately 15-20 C/W with a properly designed 4-layer PCB and adequate via stitching under the BGA. For industrial-temperature designs operating near +85C ambient, ensure at least 4 thermal vias under the center BGA balls and connect inner copper planes to GND with continuous pours. Avoid placing the FPGA directly above heat-generating components to minimize junction temperature rise under sustained heavy utilization.
The 484-UBGA package uses 1.0 mm ball pitch, requiring microvia or HDI PCB technology for escape routing. Use a 4- or 6-layer stack-up with the inner layers dedicated to GND and VCCINT/VCCIO power planes. Match trace lengths within each DDR/DDR2 memory byte group to within +/-25 mil for proper timing at 200 MHz operation. JTAG signals (TCK, TMS, TDI, TDO) should be guarded with GND vias to prevent noise coupling from switching I/O pins.
Do not mix 3.3 V and 1.5 V I/O standards on the same I/O bank; this can permanently damage the I/O drivers. Verify each I/O bank's VCCIO voltage matches the I/O standard (LVTTL=3.3 V, LVCMOS=1.8 V or 1.5 V, SSTL=2.5 V or 1.8 V for DDR/DDR2). Use the Quartus II pin planner to assign voltages before generating the programming file. Confirmed JTAG chain integrity before first programming - incorrectly chained devices will prevent configuration.
Compliance Information
RoHS and lead-free per Intel Cyclone III product page. Automotive AEC-Q100 qualification not applicable to the I7N (industrial) part; choose EP3C40U484A7N for AEC-Q100-grade deployments.
