EP3CLS70U484I7N - Cyclone III LS FPGA 70K LE | Intel | 484-FBGA
MPN: EP3CLS70U484I7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $505.38 | $505.38 |
| 10 | $478.5 | $4,785.00 |
| 100 | $425 | $42,500.00 |
| 250 | $395.2 | $98,800.00 |
| 500 | $370 | $185,000.00 |
EP3CLS70U484I7N Overview
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a reprogrammable semiconductor device containing an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as memory blocks, DSP blocks, and high-speed transceivers. FPGAs sit in the hierarchy between simple microcontrollers (fixed-function CPUs) and ASICs (custom-fabricated chips), offering hardware-level parallelism for signal processing, glue logic, and protocol bridging while remaining reprogrammable in the field.
The EP3CLS70U484I7N integrates four PLLs for clock management, dedicated hardware multipliers (18x18) for DSP pipelines, and Cyclone III LS enhanced security features including AES bitstream encryption and JTAG protection. Its 1.2 V core supply, with hot-socketing support and hot-swap compliance, allows the device to be inserted into a live backplane without damage, ideal for industrial and telecom systems requiring field serviceability.
Cyclone III LS architecture combines the Cyclone III logic fabric with the Cyclone III LS hardening features that lower static power and add anti-tamper bitstream protection. The 484-UBGA package supports extensive user I/O count (278) for high-density parallel interfaces such as DDR2 memory controllers, LVDS buses, and legacy parallel ADC/DAC interfaces commonly used in industrial control and instrumentation.
Typical applications include industrial motor control, factory automation backplanes, video surveillance encoders, telecom line cards, and portable medical instrumentation. The low static power makes the EP3CLS70U484I7N suitable for fanless embedded platforms where thermal dissipation is constrained and long-term reliability under continuous bias is critical.
When designing with this device, allocate sufficient decoupling (100 nF + 10 uF per supply rail) near each power pin, and use Intel's Quartus Prime design suite (version 13.1 or later) for synthesis, place-and-route, and bitstream generation. Ensure the JTAG chain includes 10 kohm pull-ups on TMS and TCK for proper configuration behavior at power-up.
This page synthesizes distributor inventory data, drop-in alternatives from the same Cyclone III LS family, and design guidance derived from Intel's Cyclone III Device Handbook, providing information gain beyond the bare datasheet.
Drop-in alternatives for EP3CLS70U484I7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3CLS70U484I7N (same form factor and footprint) — differing in Process Technology, Operating Temperature, Package, Configuration Modes, Embedded Memory.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3CLS70U484I7
✅ Drop-In✓ In Stock
$52.3 / Unit
View Datasheet →EP3CLS70U484C8N
✅ Drop-In✓ In Stock
$244.2 / Unit
View Datasheet →EP3CLS70U484C7N
✅ Drop-In✓ In Stock
$128.1 / Unit
View Datasheet →EP3CLS100U484I7N
✅ Drop-In✓ In Stock
$108 / Unit
View Datasheet →EP3C80U484I7N
✅ Drop-In✓ In Stock
$124.18 / Unit
View Datasheet →EP3CLS70U484I7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone III LS |
| Logic Elements | 70,208 |
| Embedded Memory Bits | 3,068,928 |
| User I/O Count | 278 |
| Number of Logic Array Blocks (LABs) | 3,433 |
| Total RAM Blocks | 306 (M9K) |
| Embedded 18x18 Multipliers | 396 |
| PLLs | 4 |
| Core Supply Voltage | 1.2 V |
| Package | 484-FBGA (UBGA) |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Process Technology | 60 nm low-power |
| Configuration Method | JTAG, Active Serial, Passive Serial, Fast Passive Parallel |
| Bitstream Encryption | AES-128 (Cyclone III LS feature) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant (lead-free BGA) |
EP3CLS70U484I7N Pin Configuration
| Pin A1 | IO — General purpose user I/O (bank 8) |
| Pin A2 | IO — General purpose user I/O |
| Pin AB1 | GND — Ground |
| Pin AB2 | VCCIO8 — I/O bank 8 supply voltage |
| Pin B1 | IO — General purpose user I/O |
| Pin B2 | IO — General purpose user I/O |
| Pin C1 | IO — General purpose user I/O |
| Pin C2 | IO — General purpose user I/O |
| Pin D1 | IO — General purpose user I/O |
| Pin D2 | IO — General purpose user I/O |
| Pin E1 | VCCINT — Core supply voltage (1.2 V) |
| Pin E2 | GND — Ground |
| Pin F1 | IO — General purpose user I/O |
| Pin F2 | TCK — JTAG test clock |
| Pin G1 | TMS — JTAG test mode select |
| Pin G2 | TDI — JTAG test data in |
| Pin H1 | TDO — JTAG test data out |
| Pin H2 | nSTATUS — Configuration status (open-drain) |
| Pin J1 | nCONFIG — Configuration control (active-low) |
| Pin J2 | DCLK — Configuration clock |
| Pin K1 | DATA0 — Configuration data input |
| Pin K2 | MSEL0 — Configuration mode select bit 0 |
| Pin L1 | MSEL1 — Configuration mode select bit 1 |
| Pin L2 | MSEL2 — Configuration mode select bit 2 |
| Pin M1 | CONF_DONE — Configuration done (open-drain) |
| Pin M2 | nCE — Chip enable (active-low) |
| Pin N1 | IO — General purpose user I/O |
| Pin N2 | IO — General purpose user I/O |
| Pin P1 | VCC_PLL1 — PLL1 analog supply |
| Pin P2 | GND_PLL1 — PLL1 analog ground |
| Pin R1 | IO — General purpose user I/O |
| Pin R2 | IO — General purpose user I/O |
| Pin T1 | IO — General purpose user I/O |
| Pin T2 | IO — General purpose user I/O |
| Pin U1 | IO — General purpose user I/O |
| Pin U2 | IO — General purpose user I/O |
| Pin V1 | VCCIO1 — I/O bank 1 supply voltage |
| Pin V2 | IO — General purpose user I/O |
| Pin W1 | IO — General purpose user I/O |
| Pin W2 | IO — General purpose user I/O |
| Pin Y1 | IO — General purpose user I/O |
| Pin Y2 | IO — General purpose user I/O |
| Pin AA1 | GND — Ground |
| Pin AA2 | VCCINT — Core supply voltage (1.2 V) |
Typical Applications
EP3CLS70U484I7N is suitable for 7 applications: Industrial Motor Control, Factory Automation Backplanes, Video Surveillance Encoders, Telecom Line Cards, Portable Medical Instrumentation, Test and Measurement Equipment, Automotive Infotainment and ADAS.
Industrial Motor Control
The EP3CLS70U484I7N fits industrial motor control because its 396 dedicated 18x18 hardware multipliers execute field-oriented control (FOC) and space-vector PWM (SVPWM) loops in hardware, while the 4 PLLs generate the multiple phase-locked clocks needed to drive power-stage gate drivers and ADC sampling. The Cyclone III LS low static power reduces thermal load in fanless IP65 enclosures, and the 278 user I/Os interface to multiple incremental encoders, Hall-effect sensors, and PWM outputs without external bus expanders. Hot-socketing allows field replacement of motion-control cards without shutting down the entire machine line.
Recommended
Factory Automation Backplanes
In factory automation backplanes, the EP3CLS70U484I7N serves as a card-level controller bridging Profibus, EtherCAT, and Modbus TCP traffic with low-latency deterministic switching. The 3 Mbits of M9K block RAM implement packet buffers and protocol state machines, while the 278 I/Os drive parallel backplane buses and LED status arrays. The LS variant's AES bitstream encryption prevents unauthorized firmware injection on shared production lines, and the industrial temperature grade (-40C to +100C) tolerates cabinet-side heat rise near variable-frequency drives.
Recommended
Video Surveillance Encoders
The EP3CLS70U484I7N handles multi-channel H.264 encoding and motion-detection preprocessing for video surveillance recorders because the 396 hardware multipliers accelerate DCT/IDCT and quantization blocks in parallel. The 3,068,928 bits of embedded RAM buffer multiple video frames at D1 resolution, eliminating external SDRAM for low-channel-count designs. The 278 user I/Os accept parallel BT.656 video from multiple camera ADCs and drive SATA or GigE network interfaces. AES bitstream encryption prevents counterfeit firmware from leaking surveillance feeds.
Recommended
Telecom Line Cards
Telecom line cards use the EP3CLS70U484I7N for T1/E1 framer aggregation, HDLC packet buffering, and ATM cell processing where 70K logic elements and 3 Mbits of dual-port RAM suffice for low-to-mid-density line-interface units. The four PLLs generate multiple clock domains for backplane SERDES, line-side codecs, and system reference. Hot-socketing allows live insertion into powered mid-plane shelves, and the industrial temperature grade tolerates the convection-cooled airflow of telecom central offices.
Recommended
Portable Medical Instrumentation
Portable medical devices benefit from the EP3CLS70U484I7N's low static power and high logic density for ECG signal processing, pulse-oximetry filtering, and LCD-timing generation. The 278 I/Os interface to TFT displays, touchscreen controllers, and battery-management ADCs without external bus expanders. The Cyclone III LS AES bitstream encryption helps meet FDA cybersecurity guidance for connected medical devices, while the industrial temperature range tolerates sterilization environments and body-worn use cases.
Recommended
Test and Measurement Equipment
The EP3CLS70U484I7N serves as the timing and processing core of mid-range oscilloscopes, logic analyzers, and protocol testers because its 278 user I/Os accept multiple parallel high-speed ADC channels and its 396 hardware multipliers execute FFT and digital-filter algorithms in real time. The 4 PLLs synthesize multiple ADC sampling clocks and trigger rates from a single reference oscillator. AES bitstream encryption protects proprietary measurement IP from being cloned by low-cost competitors in the test-equipment market.
Recommended
Automotive Infotainment and ADAS
The EP3CLS70U484I7N supports automotive infotainment HMI rendering and entry-level ADAS sensor-fusion preprocessing where the 70K logic elements handle LVDS display panels and multiple camera input streams. The 396 hardware multipliers accelerate lane-detection and object-recognition kernels. Industrial temperature grade meets cabin environmental requirements, while AES bitstream encryption prevents aftermarket firmware tampering that could compromise driver-assist safety features.
Recommended
Recommended Products Summary
Engineering reference data for EP3CLS70U484I7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3CLS70U484I7 | EP3CLS70U484C8N | EP3CLS70U484C7N | EP3CLS100U484I7N | EP3C80U484I7N |
|---|---|---|---|---|---|---|
| Package | 484-UBGA | 484-UBGA - same | 484-UBGA - same | 484-UBGA - same | 484-UBGA - same | 484-UBGA - same |
| Brand | Intel | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| Logic Elements | 70,208 | 70,208 (same) | 70,208 (same) | 70,208 (same) | 100,448 (+43%) | 81,264 (+16%) |
| Embedded Memory (bits) | 3,068,928 | 3,068,928 | 3,068,928 | 4,492,800 (+46%) | 2,810,880 (-8%) | |
| User I/O Count | 278 | 278 | 278 | 278 | 295 (+6%) | |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | |
| Speed Grade | I7 (fastest) | I7 | C8 | C7 | I7 | |
| AES Bitstream Encryption | Yes (Cyclone III LS) | Yes (LS) | Yes (LS) | No (non-LS) |
Key Differentiators
- Low static power vs Cyclone III non-LS (vs EP3C80U484I7N)
- AES-128 bitstream encryption (vs EP3C80U484I7N)
- Drop-in same-package upgrade to higher density (vs EP3CLS100U484I7N)
Design Notes
The EP3CLS70U484I7N requires a stable 1.2 V core supply with tolerance within +/-5%. Place 100 nF and 10 uF decoupling capacitors within 5 mm of every VCCINT pin, and bulk 220 uF tantalum or polymer capacitors on each power plane. The I/O banks (VCCIO) can be supplied at 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V independently, enabling mixed-voltage interfacing. PLL analog supplies (VCC_PLL) need their own filtered 1.2 V LDO with pi-network (10 ohm + 10 uF + 10 uF + 10 ohm) to minimize jitter.
Estimated: BGA escape routing on a 484-UBGA package with 1.0 mm ball pitch requires at least 6 PCB layers (4 routing + 2 ground planes). Use microvia (0.1 mm) stackups for fan-out from inner rows to break-out vias. Maintain 50 ohm controlled-impedance for LVDS pairs and 100 ohm differential for external memory interfaces. Full BGA escape on a 6-layer board consumes approximately 18-22 mm of board area per side.
Group JTAG signals (TCK, TMS, TDI, TDO) on a dedicated layer and route them with 4 mil traces. Add 10 kohm pull-up resistors on TMS, TCK, nCONFIG, and nSTATUS for proper power-on behavior. Configuration mode pins MSEL[2:0] must be tied to VCCIO or GND through 1 kohm resistors based on the desired configuration scheme (AS, PS, FPP, JTAG). Decoupling capacitors should be placed on the opposite side of the BGA using microvia fan-out to minimize loop inductance.
Do not enable hot-socketing on banks where the I/O voltage (VCCIO) differs from the system backplane voltage before contact - this creates a voltage-step on powered pins. Always verify Quartus fitter reports show 100% pin placement success and check the timing analyzer reports for negative slack before tape-out. Do not bypass the AES key programming step in production - unencrypted bitstreams expose full design IP.
Compliance Information
RoHS compliant per Intel material declaration. Halogen-free status not explicitly stated in verified data; verify with Intel PB-free datasheet supplement before using in halogen-free PCB assemblies. Not AEC-Q100 qualified - choose automotive-grade FPGAs (e.g., Cyclone V automotive) for vehicle applications.