Intel

EP3CLS100U484I7 - Cyclone III LS FPGA, 100K LE, 484-FBGA | Intel

MPN: EP3CLS100U484I7 ✓ Active

In Stock Ships in 1-3 business days

1.2 V core Vdss 484-FBGA (UBGA), 1.0 mm pitch Package 20 Speed

From $188 USD / Unit

MOQ: 1 |

Price updated: 2026-09-09

Volume Pricing

Qty	Unit Price	Extended
1	$285	$285.00
10	$265.5	$2,655.00
100	$238	$23,800.00
500	$210	$105,000.00
1,000	$188	$188,000.00

ℹ️ All prices are in USD

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EP3CLS100U484I7 Overview

The Intel (formerly Altera) EP3CLS100U484I7 is a low-power Cyclone III LS Field Programmable Gate Array with 100,448 logic elements, 4,451,328 bits of embedded memory, and 278 user I/O pins, housed in a 484-ball FineLine BGA (UBGA) package. It is fabricated on TSMC's 60 nm low-power process and operates from a 1.2 V core supply with industrial temperature range support.

A Field Programmable Gate Array (FPGA) is a programmable logic device consisting of an array of configurable logic blocks (CLBs), programmable interconnect, and embedded hard IP such as block RAM, DSP blocks, and PLLs. FPGAs sit within the broader category of programmable logic devices (PLDs) under the digital semiconductor hierarchy, offering parallel hardware processing flexibility that microcontrollers and DSPs cannot match. The Cyclone III LS family specifically targets low-static-power designs where battery life or thermal dissipation is critical.

Key features of the EP3CLS100U484I7 include 100,448 logic elements, 4,451,328 total RAM bits distributed across M9K memory blocks, 66 embedded 18x18 multipliers, 4 PLLs, and 278 maximum user I/O pins. The device supports LVDS, LVCMOS, SSTL, and HSTL I/O standards with hot-socketing capability. Industrial temperature grade (I7 suffix, -40C to +100C junction) makes it suitable for harsh environment deployments.

Cyclone III LS devices employ a fine-grained 8-input adaptive logic module (ALM) architecture that improves logic packing efficiency versus the 4-input LUT architecture of older Cyclone families. The dedicated 18x18 multiplier blocks enable cost-effective DSP workloads such as FIR filters and FFT engines without consuming general-purpose logic. Configuration is via active serial (AS), passive serial (PS), fast passive parallel (FPP), or JTAG modes using industry-standard 16-64 Mbit EPCS or EPCQ configuration memories.

Typical applications include industrial motor control, factory automation HMIs, portable medical imaging, video surveillance with on-chip buffering, low-power wireless baseband processing, and military/aerospace signal processing. The 484-UBGA package with 1.0 mm ball pitch is footprint-compatible across the Cyclone III family (EP3C25 through EP3C120 in the same package), enabling migration paths as designs scale.

When designing with this FPGA, pay close attention to power planning: Cyclone III LS offers PowerPlay early power estimation tools that should be run after RTL coding and before PCB layout to size decoupling budgets. The 484-UBGA package requires 4-6 layer PCB stackup with 1.0 mm pitch escape routing; signal integrity simulations are recommended for DDR2/3 memory interfaces running above 200 MHz.

This page synthesizes distributor inventory, footprint-compatible same-package alternatives, and practical power/thermal design notes not consolidated on the manufacturer datasheet.

Drop-in alternatives for EP3CLS100U484I7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP3CLS100U484I7 (same form factor and footprint) — differing in Process Technology, Package, Operating Temperature, Logic Elements, RoHS Status.

EP3C40U484I7N

Intel

Process Technology: 65 nm

Package: 484-pin UBGA (Ultra FineLine BGA), 1.0 mm ball pitch

Operating Temperature: -40C to +100C (Industrial)