EP3C55U484I7N - 55K LE Cyclone III FPGA, 484-FBGA | Intel / Altera
MPN: EP3C55U484I7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $282.06 | $282.06 |
| 10 | $258.5 | $2,585.00 |
| 100 | $235 | $23,500.00 |
| 500 | $210 | $105,000.00 |
| 1,000 | $188.5 | $188,500.00 |
EP3C55U484I7N Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor IC containing an array of configurable logic blocks (CLBs/ALMs), programmable interconnect, and on-chip memory that can be customized after manufacturing through a hardware description language (HDL) bitstream. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs), parallel to CPLDs and ASICs, and are typically chosen when time-to-market, in-field reconfigurability, and parallel processing throughput outweigh the per-unit cost of a masked ASIC.
Key differentiating features of the EP3C55U484I7N include 327 maximum user I/O pins, 156 embedded 18x18 multipliers, four PLLs for clock synthesis, and support for external memory interfaces including DDR, DDR2, QDRII, and RLDRAM II. The Cyclone III architecture combines a low static and dynamic power budget with high logic density, enabling display controllers, video bridging, motor control, and industrial protocol bridging on a single device.
Typical application domains are industrial machine vision, factory automation controllers, video surveillance encoders, automotive infotainment pre-production prototypes, and telecom line-card glue logic. The 484-ball UFBGA at 19 x 19 mm with 0.8 mm pitch supports dense PCB layouts while preserving signal integrity through multiple GND and supply balls.
When designing with this device, engineers should use the Altera Quartus II design software (version 13.0 or later with service packs) for synthesis, place-and-route, and bitstream generation. Pay attention to simultaneous switching output (SSO) guidelines, decoupling strategy, and PLL power filtering to meet the Cyclone III datasheet jitter specifications.
Drop-in alternatives for EP3C55U484I7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C55U484I7N (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Logic Elements, Family.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3C55U484I7
✅ Drop-In✓ In Stock
$195 / Unit
View Datasheet →EP3C55U484C8N
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View Datasheet →EP3C55U484C7N
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View Datasheet →EP3C55U484C6N
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View Datasheet →EP3C40U484I7N
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$118.8 / Unit
View Datasheet →EP3C55U484C8
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View Datasheet →EP3C55U484I7N Maximum Ratings & Electrical Characteristics
| Series | Cyclone III |
| Family | Cyclone III FPGA |
| Manufacturer | Intel (formerly Altera) |
| Logic Elements | 55,856 LE |
| Adaptive Logic Modules (ALMs) | 3,491 ALM |
| Embedded Memory | 2,396,160 bits |
| Maximum User I/O | 327 |
| Number of LABs/CLBs | 3,491 |
| Embedded 18x18 Multipliers | 156 |
| PLLs | 4 |
| Process Technology | 65 nm CMOS |
| Core Supply Voltage | 1.2 V |
| Operating Temperature | -40°C to +100°C (Industrial) |
| Package | 484-FBGA (UFBGA-484) |
| Package Size | 19 x 19 mm, 0.8 mm pitch |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Lead Free | Yes |
EP3C55U484I7N 19 x 19 mm, 0.8 mm pitch Pin Configuration Guide
Pin configuration for EP3C55U484I7N (19 x 19 mm, 0.8 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3C55U484I7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3C55U484I7N is suitable for 6 applications: Industrial Machine Vision, Video Surveillance Encoder, Motor Control and Field-Oriented Control, Industrial Protocol Bridge, Display Controller and TCON, Software Defined Radio Front-End Pre-Processing.
Industrial Machine Vision
The EP3C55U484I7N is well matched to industrial machine vision pipelines because its 55,856 logic elements and 156 embedded 18x18 multipliers support real-time Bayer demosaicing, Sobel edge detection, and histogram equalization at typical VGA-to-720p camera resolutions. The 2.29 Mbit embedded memory buffers full frame lines without external SRAM, reducing BOM cost. The 327 user I/O accommodate parallel Camera Link interfaces plus GPIO for trigger and strobe synchronization. Industrial temperature grade and Quartus II toolchain support enable long-lifecycle factory deployments.
Recommended
Video Surveillance Encoder
The EP3C55U484I7N can implement H.264 baseline or MJPEG encoder cores at D1 resolution thanks to its 156 DSP blocks and 327 I/O bandwidth for multi-channel sensor aggregation. The 484-FBGA package exposes enough high-speed LVDS pairs for BT.656 or MIPI-CSI bridging. Industrial temperature support enables outdoor PoE camera deployment. Designers can use Altera's VIP (Video and Image Processing) suite as a starting point and shrink-wrap encoder IPs.
Recommended
Motor Control and Field-Oriented Control
In three-phase permanent-magnet or induction motor drives, the EP3C55U484I7N's industrial temperature rating, 55,856 logic elements, and 156 hardware multipliers make it a strong fit for field-oriented control (FOC) loops, encoder (QEP) interface, and resolver-to-digital conversion. The 4 PLLs generate multiple switching frequencies for cascaded H-bridge timing. Its 327 user I/O handle Hall sensors, gate drivers, and isolation communications such as SPI to isolated gate drivers.
Recommended
Industrial Protocol Bridge
The EP3C55U484I7N bridges legacy industrial fieldbuses (Profibus, Modbus RTU, CANopen) to Ethernet-based protocols such as PROFINET, EtherNet/IP, and EtherCAT. Its 327 user I/O accommodate multiple UARTs, SPI ports, and MII/RMII Ethernet MACs implemented in soft logic. Industrial temperature rating and Quartus II long-term support make Cyclone III a preferred platform for protocol-converter gateways. The 55K LE density allows full-duplex PROFINET IRT and EtherCAT slave MAC stacks in a single device.
Recommended
Display Controller and TCON
The EP3C55U484I7N functions as a timing controller (TCON) for LCD panels up to 1080p, generating gate-driver timing, source-driver data sequencing, and backlight PWM. Its 327 user I/O include enough LVDS pairs for typical FHD panels via OpenLDI or mini-LVDS interfaces, while embedded M9K memory blocks hold frame buffers for OSD and PIP. The 65 nm process keeps dynamic power modest for always-on HMI panels.
Recommended
Software Defined Radio Front-End Pre-Processing
The EP3C55U484I7N's 156 embedded 18x18 multipliers, four PLLs, and 327 user I/O support digital down-conversion (DDC), channelization, and Crest Factor Reduction (CFR) blocks in front of an ADC for narrow-band SDR receivers below 100 MHz bandwidth. The 65 nm Cyclone III family is widely used as a co-processor alongside DSPs for radar, sonar, and communications test equipment. Industrial temperature enables ruggedized enclosures without active cooling.
Recommended
Recommended Products Summary
Engineering reference data for EP3C55U484I7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C55U484I7 | EP3C55U484C8N | EP3C55U484C7N | EP3C55U484C6N | EP3C40U484I7N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-FBGA (UFBGA-484) 19x19mm 0.8mm pitch | 484-FBGA (UFBGA-484) 19x19mm 0.8mm pitch - same | 484-FBGA (UFBGA-484) 19x19mm 0.8mm pitch - same | 484-FBGA (UFBGA-484) 19x19mm 0.8mm pitch - same | 484-FBGA (UFBGA-484) 19x19mm 0.8mm pitch - same | 484-FBGA (UFBGA-484) 19x19mm 0.8mm pitch - same |
| Logic Elements | 55,856 LE | 55,856 LE | 55,856 LE | 55,856 LE | 55,856 LE | 39,600 LE |
| Embedded Memory | 2,396,160 bits (2.29 Mbit) | 2,396,160 bits | 2,396,160 bits | 2,396,160 bits | 2,396,160 bits | 1,161,216 bits |
| Embedded Multipliers | 156 (18x18) | 156 | 156 | 156 | 156 | 126 |
| Maximum User I/O | 327 | 327 | 327 | 327 | 327 | 331 |
| Speed Grade | I7 (industrial, fastest) | I7 | C8 | C7 | C6 | I7 |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +100C |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| RoHS / Lead Free | RoHS compliant / Pb-free | Pb-free designation not present | RoHS / Pb-free | RoHS / Pb-free | RoHS / Pb-free | RoHS / Pb-free |
Key Differentiators
- Highest-speed industrial-temp variant in the U484 package (vs EP3C55U484C8N)
- Highest-density 55K LE with full 327 I/O count in U484 (vs EP3C40U484I7N)
- Same package as multiple drop-in speed/temp alternatives (vs EP3C55F484I7N)
Design Notes
The EP3C55U484I7N requires multiple power rails: VCCINT 1.2 V for core logic, VCCA 2.5 V for PLL analog, VCCIO 1.2/1.5/1.8/2.5/3.3 V for I/O banks, and VCCPD 2.5/3.3 V for pre-drivers. Use a power-on reset supervisor to enforce sequencing (VCCINT before VCCA before VCCIO) and bulk-decouple each rail with 100 uF tantalum + 0.1 uF + 1 nF ceramic network near every supply ball group. Estimated quiescent power at 25C, all I/O tri-stated, typical configuration is approximately 0.4 W; add IO and clock power per I/O standards used.
With 327 user I/O at 25 MHz toggling and an industrial junction limit of 100C, design the PCB thermal solution around 2 to 4 W worst case. Place thermal vias under the central GND balls, use a 4-layer stack-up with solid GND/power planes, and avoid routing high-current switching signals across the package center. Theta-JA for the U484 UFBGA is approximately 15 to 20 C/W on a JEDEC 4-layer test board; actual in-application value depends on copper area, airflow, and adjacent component heat. Validate with the FPGA PowerPlay early power estimator in Quartus II before layout.
The 484-FBGA 0.8 mm pitch requires 0.4 mm via-pad diameter and microvia or via-in-pad construction for the inner signal rows to escape route. Maintain at least 8 mil trace/space on outer layers and 6 mil on inner layers. Implement SSO (simultaneous switching output) guidelines from the Cyclone III handbook to avoid GND bounce - typically limit switching I/O to 16 per bank near clock edges. Decoupling strategy: 0.1 uF X7R for each VCCIO/VCC/VCCA ball group, plus one 10 uF bulk per supply rail.
For DDR2 interfaces up to 400 Mbps, follow the Cyclone III external memory interface pin guidelines: match trace lengths within +/- 25 mil on the same byte lane, use 50 ohm single-ended impedance for address/control and 100 ohm differential for clocks. Enable on-chip dynamic termination and output slew rate adjustments to manage reflections. For LVDS at >500 Mbps, use 100 ohm differential impedance and route pairs with less than 5 mil intra-pair skew.
Common pitfalls include: (1) leaving MSEL[2:0] floating - they select configuration mode and must be tied to VCCPD or GND; (2) failing to instantiate the nCONFIG pull-up (10 kohm to VCCPD) for active-serial configuration; (3) overlooking the CONF_DONE pull-up which signals successful configuration; (4) sharing a CONFIG_CLK between AS and JTAG modes without isolation; (5) not enabling CRC error detection in the Quartus II device options for safety-critical designs. Reference Intel application note AN 531: Configuring Cyclone III Devices for additional design safeguards.
Compliance Information
RoHS compliance confirmed by Altera/Intel product ordering information ('N' suffix indicates Pb-free). Industrial temperature grade is per Altera ordering code convention (I suffix). AEC-Q100 is not applicable - FPGAs are not automotive-qualified at the silicon level by design, although automotive customers may qualify the device in their end-system context.
