EP3CLS100U484C8N - Cyclone III LS FPGA, 100K LE, 484-FBGA | Intel
MPN: EP3CLS100U484C8N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $162.5 | $162.50 |
| 10 | $148.2 | $1,482.00 |
| 100 | $131.75 | $13,175.00 |
| 250 | $121 | $30,250.00 |
| 500 | $109.4 | $54,700.00 |
EP3CLS100U484C8N Overview
An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and embedded memory, all user-defined via a hardware description language such as Verilog or VHDL. Within the broader semiconductor hierarchy, FPGAs sit between general-purpose microcontrollers and application-specific integrated circuits (ASICs), offering post-fabrication flexibility without the NRE cost of an ASIC. The Cyclone III LS family specifically targets low-power designs (lower static power than the Cyclone III family), while the LS sub-family adds dedicated security and configuration features.
Key specifications for the EP3CLS100U484C8N include a 1.2 V core supply voltage, commercial-grade temperature range (C8 speed grade), support for up to 278 user I/Os across 8 I/O banks, and 4 PLLs. The device also integrates 100,448 logic elements, organized as 4,451 logical array blocks (LABs) and 100,448 adaptive logic modules (ALMs), plus dedicated 18x18 multipliers supporting DSP-style operations.
Architecturally, the Cyclone III LS uses a 60 nm low-K process and a hierarchical routing structure that balances timing closure with die-area efficiency. The 'LS' suffix differentiates it from the standard Cyclone III by adding features such as bit-stream encryption, JTAG-based configuration, and enhanced SEU mitigation for industrial environments.
Typical applications include industrial motor control, video processing bridges, low-cost software-defined radio front ends, factory automation I/O expansion, and portable medical instrumentation. The combination of 4.4 Mbit of block RAM and embedded multipliers also makes it a practical DSP coprocessor for mid-range signal-processing tasks.
When designing with this device, note that the BGA-484 footprint requires a 4- or 6-layer PCB with laser-drilled or microvia fan-out; standard JEDEC SOIC reflow profiles are supported, but BGA inspection (X-ray or AOI) is mandatory for production yield. Plan configuration memory separately - Cyclone III LS uses SRAM configuration, so an external EPCS or EPCQ flash device is required to store the bitstream.
This page synthesizes distributor pricing, drop-in alternatives sourced from the Cyclone III LS family and the larger Cyclone III family, and practical design notes that complement (and do not replace) the manufacturer datasheet.
Drop-in alternatives for EP3CLS100U484C8N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3CLS100U484C8N (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, Speed Grade, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3CLS100U484C8
✅ Drop-In✓ In Stock
$395 / Unit
View Datasheet →EP3CLS100U484C7N
✅ Drop-In✓ In Stock
$412.65 / Unit
View Datasheet →EP3CLS100U484C7
✅ Drop-In✓ In Stock
$520 / Unit
View Datasheet →EP3CLS100U484I7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$108 / Unit
View Datasheet →EP3CLS100F484C8N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$115.4 / Unit
View Datasheet →EP3C120F484C7N
✅ Drop-In✓ In Stock
$185 / Unit
View Datasheet →EP3CLS100U484C8N Maximum Ratings & Electrical Characteristics
| Device Type | FPGA (Field Programmable Gate Array) |
| Series | Cyclone III LS |
| Logic Elements | 100,448 |
| Logic Array Blocks (LABs) | 4,451 |
| Adaptive Logic Modules (ALMs) | 100,448 |
| Embedded Memory Bits | 4,451,328 bits (~4.4 Mbit) |
| Maximum User I/O | 278 |
| Number of PLLs | 4 |
| Core Supply Voltage | 1.2 V |
| Speed Grade | C8 (commercial) |
| Operating Temperature | Commercial (0C to +85C) |
| Package | 484-ball FineLine BGA (UBGA-484) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant (LEAD FREE per FindIC) |
| Process Technology | 60 nm low-K CMOS |
EP3CLS100U484C8N 484-ball fineline bga (ubga-484) Pin Configuration Guide
Pin configuration for EP3CLS100U484C8N (484-ball fineline bga (ubga-484) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3CLS100U484C8N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3CLS100U484C8N is suitable for 6 applications: Industrial Motor Control, Video Processing Bridges, Factory Automation I/O Expansion, Software-Defined Radio Front End, Portable Medical Instrumentation, Low-Cost Network Switch / Router Line Card.
Industrial Motor Control
The EP3CLS100U484C8N is well suited to multi-axis industrial motor control because its 100,448 logic elements can host multi-loop field-oriented control (FOC) state machines, while the four on-chip PLLs generate the high-resolution PWM clocks and encoder sample clocks that stepper and servo drives demand. Its 278 user I/Os accept Hall-sensor, resolver, and quadrature-encoder inputs simultaneously, and the embedded 18x18 multipliers accelerate the Park, Clarke, and inverse-Clarke transforms used to convert between stationary and rotating reference frames. The LS sub-family also adds bitstream encryption, which is increasingly required for proprietary motor-control IP. Designers typically instantiate the Altera/Intel FOC reference design as a starting point and reserve 20-30% of the LEs for application-specific protection and commutation logic.
Recommended
Video Processing Bridges
With 4.4 Mbit of embedded block RAM, the EP3CLS100U484C8N can absorb multiple lines of pixel data for frame-rate conversion, scaling, and on-screen display overlays in mid-range video bridges. Its 278 I/Os easily accommodate parallel RGB, BT.656, and LVDS display interfaces, while the 60 nm process keeps junction temperature low even when the fabric is continuously streaming video. Cyclone III LS devices support up to 200 MHz DDR2 memory controllers, so the FPGA can interface to external SDRAM/DDR2 frame buffers without glue logic. Typical designs route DVI/HDMI pixel streams through a color-space converter (e.g. RGB-to-YCbCr) implemented in DSP megafunctions. Compared with the standard Cyclone III family, LS adds JTAG security that protects licensed video-processing IP from cloning.
Recommended
Factory Automation I/O Expansion
The EP3CLS100U484C8N's 278 user I/Os make it ideal as a programmable I/O expander or protocol bridge in factory-automation controllers - one device can replace dozens of fixed-function multiplexer or buffer ICs. Designers use the 4 PLLs to derive separate timing domains for Profibus, EtherCAT, RS-485, and digital-IO scan loops, and the 100K logic elements easily host Industrial Ethernet slave stacks implemented in soft IP. The Cyclone III LS industrial temperature grade variants (EP3CLS100U484I7N) operate from -40C to +100C, which is essential for cabinet-mounted equipment. Embedded multipliers also handle the CRC calculation required by Ethernet and Profibus PHYs without taxing the fabric.
Software-Defined Radio Front End
For low-cost software-defined radio (SDR) front ends, the EP3CLS100U484C8N offers enough logic for a complete digital down-converter (DDC), finite-impulse-response (FIR) filter, and channelizer on a single chip. The hardware 18x18 multipliers accelerate the complex mixers that shift IQ samples from IF to baseband, while the 4.4 Mbit of block RAM buffers incoming ADC bursts before downstream packetization. Compared with a discrete DSP + MCU approach, the FPGA-based SDR front end is field-upgradable through JTAG - operators can deploy new demodulation waveforms without re-spinning hardware. The LS sub-family's bitstream encryption also protects licensed demodulator cores from cloning in commercial radio products.
Portable Medical Instrumentation
In portable medical devices such as bedside patient monitors and handheld ultrasound probes, the EP3CLS100U484C8N's low static power (a key Cyclone III LS advantage) extends battery runtime, while its 100K logic elements implement the entire signal-conditioning pipeline - analog front-end filtering, beamforming, and LCD/TFT display rendering. The 4 PLLs derive the high-frequency clocks needed for ADC sampling without external clock-generator ICs, and the 278 user I/Os accept tactile-key, LCD, and Bluetooth/WiFi module interfaces concurrently. Medical designs typically add an EPCS/EPCQ flash for safe bitstream storage and use the LS sub-family's encryption to meet HIPAA-aligned firmware-protection requirements.
Low-Cost Network Switch / Router Line Card
The EP3CLS100U484C8N can serve as a 1-Gigabit Ethernet line-card processor in small business routers and managed switches, where 278 user I/Os are enough to feed multiple SGMII/RGMII PHYs plus management LEDs and serial console ports. The 100K logic elements host packet-classification, ACL, and forwarding-table logic, and the 4.4 Mbit of block RAM stores millions of IPv4 route entries without external TCAM. Compared with an ASSP network processor, the FPGA-based design allows customers to upgrade features (e.g. add IPv6 or OpenFlow support) via bitstream download in the field, which is a major value proposition for managed-network OEMs. Industrial-temperature LS variants fit outdoor PoE-switch line cards.
Recommended Products Summary
Engineering reference data for EP3CLS100U484C8N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3CLS100U484C8 | EP3CLS100U484C7N | EP3CLS100U484C7 | EP3CLS100U484I7N | EP3CLS100F484C8N | EP3C120F484C7N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA (UBGA-484) | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Logic Elements | 100,448 | 100,448 | 100,448 | 100,448 | 100,448 | 100,448 | 119,088 (+19%) |
| Embedded Memory (bits) | 4,451,328 | 4,451,328 | 4,451,328 | 4,451,328 | 4,451,328 | 4,451,328 | 3,981,312 (-10%) |
| Maximum User I/O | 278 | 278 | 278 | 278 | 278 | 278 | 284 (+2%) |
| Speed Grade | C8 (commercial) | C8 | C7 (faster) | C7 (faster) | C7 industrial | C8 | C7 |
| Operating Temperature | Commercial (0C to +85C) | Commercial | Commercial | Commercial | Industrial (-40C to +100C) | Commercial | Commercial |
| Lead-Free (RoHS) | Yes | No (lead-bearing) | Yes | No (lead-bearing) | Yes | Yes | Yes |
| Series | Cyclone III LS (with encryption) | Cyclone III LS | Cyclone III LS | Cyclone III LS | Cyclone III LS | Cyclone III LS | Cyclone III (no encryption) |
| Number of PLLs | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
Key Differentiators
- Built-in bitstream encryption (vs EP3C120F484C7N)
- Lead-free RoHS-compliant termination (vs EP3CLS100U484C8)
- Lower static power than non-LS Cyclone III (vs EP3C80U484C8N)
Design Notes
The 484-ball FineLine BGA package requires at least a 4-layer PCB with microvias or laser-drilled vias for fan-out. Use 0.5-oz copper on outer layers and 1-oz on inner planes to meet the 1.2 V core current demand (estimated: 100K-LE Cyclone III LS draws ~1.5 A peak at full toggle). Keep BGA escape traces under the ball pad to avoid breakout congestion; the Xilinx footprint-compatibility is irrelevant since this is a vendor-specific package.
Cyclone III LS uses SRAM configuration, so the device is volatile - on every power-up it must load the bitstream from an external EPCS16, EPCS64, or EPCQ64 flash. Forgetting this flash on the BOM is a classic NPI pitfall. Also note that without a configuration clock (DCLK) pulled high or terminated, the FPGA will not enumerate; use the dedicated 25 MHz or 100 MHz on-board oscillator per the manufacturer datasheet reference design.
Estimated: At 100% toggle rate across 100K logic elements, the Cyclone III LS family typically dissipates 1.5-2.0 W; commercial-C8 device ambient must stay below 85C. With the 484-FBGA package theta_JA around 15 C/W (with 4-layer PCB and adequate airflow), junction temperature stays within 50C above ambient, which is comfortable for the C8 speed grade. For industrial C7/I7 variants (up to 100C ambient), keep toggle activity below 70% to maintain margin.
Compliance Information
RoHS/lead-free confirmed via FindIC description 'LEAD FREE' and the 'N' suffix per JEDEC J-STD-609. AEC-Q100 automotive qualification not available in Cyclone III LS family - choose Cyclone IV automotive variants for that requirement. Halogen-free status not stated in verified web data.
