EP3CLS70U484C7N - 70K LE Cyclone III LS FPGA 484-FBGA | Intel
MPN: EP3CLS70U484C7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $168.5 | $168.50 |
| 10 | $158.2 | $1,582.00 |
| 25 | $149.75 | $3,743.75 |
| 100 | $135.4 | $13,540.00 |
| 250 | $128.1 | $32,025.00 |
EP3CLS70U484C7N Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device whose logic functionality is defined by a user-supplied configuration bitstream rather than by hard-wired mask geometry. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs), which themselves belong to the digital integrated circuit (IC) and logic semiconductor taxonomy. Compared with ASICs, FPGAs offer rapid prototyping, in-field re-programmability, and lower NRE cost, while delivering deterministic parallel logic execution and reconfigurable I/O. The Cyclone III LS family specifically targets low total power consumption and functional-safety applications such as industrial control, automotive driver assistance, and medical instrumentation.
Key features include up to 198 embedded 18x18 multipliers for DSP, dedicated memory blocks (M9K) totaling approximately 2.5 Mbits, four general-purpose PLLs per device, and support for external memory interfaces including DDR, DDR2, and QDRII+ SRAM. The device also integrates a hard PCI Express Gen1 controller (PIPE interface) on selected package options, and supports mainstream serial protocols such as LVDS, SSTL, and HSTL I/O standards. Up to eight global clock networks and 16 dedicated clock pins simplify multi-clock-domain designs.
Architecturally, the Cyclone III LS device is composed of Logic Array Blocks (LABs), each containing 16 Logic Elements (LEs). Each LE includes a 4-input LUT, a programmable register, carry-chain logic, and a register chain. Configuration bitstream is loaded through JTAG, Active Serial (AS), Active Parallel (AP), or Passive Serial (PS) modes into SRAM-based configuration RAM, which remains volatile and requires a configuration flash on the board.
Typical applications include industrial motor control, factory automation PLCs, machine-vision preprocessing, automotive infotainment and telematics, low-cost software-defined radio, and portable medical devices. The combination of low static power and SEU-aware configuration memory also makes the device attractive for avionics subsystems and remote telemetry where bit-flip reliability matters.
When designing with this part, plan for at least one EPCS or EPCQ configuration flash and a robust decoupling network around all VCCINT, VCCA, and VCCIO rails. Quartus II (or its successor Quartus Prime) is the supported development environment and is required for synthesis, place-and-route, and timing closure.
Drop-in alternatives for EP3CLS70U484C7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3CLS70U484C7N (same form factor and footprint) — differing in Package, Process Technology, Operating Temperature, Speed Grade, Configuration Modes.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
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View Datasheet →EP3CLS70U484C7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone III LS |
| Logic Elements (LE) | 70,208 |
| Embedded Memory | 3,068,928 bits |
| Logic Array Blocks (LAB) | 4,388 |
| Maximum User I/O | 278 |
| Package | 484-FBGA (U484, 19x19 mm) |
| Process Technology | 65 nm CMOS |
| Core Supply Voltage (VCCINT) | 1.2 V |
| Speed Grade | 7 (commercial) |
| Operating Temperature | 0C to +85C (commercial) |
| Embedded 18x18 Multipliers | 198 |
| PLLs | 4 |
| Global Clock Networks | 8 |
| Configuration Modes | AS, AP, PS, JTAG |
| Memory Interface Support | DDR/DDR2/QDRII+ SRAM |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount |
EP3CLS70U484C7N 484-fbga (u484, 19x19 mm) Pin Configuration Guide
Pin configuration for EP3CLS70U484C7N (484-fbga (u484, 19x19 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3CLS70U484C7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3CLS70U484C7N is suitable for 6 applications: Industrial Motor Control, Machine Vision Preprocessing, Automotive Infotainment and Telematics, Portable Medical Instrumentation, Software-Defined Radio Front-End, Factory Automation PLCs and Edge Gateways.
Industrial Motor Control
The EP3CLS70U484C7N's 70,208 logic elements and 198 embedded 18x18 multipliers give designers enough headroom for field-oriented control (FOC) loops, PWM generation, and encoder decoding on a single chip. The Cyclone III LS family draws substantially lower static power than the non-LS Cyclone III, which matters in always-on industrial drives where standby current is regulated. The 278 user I/O pins let the FPGA interface simultaneously to three-phase gate drivers, resolver or Hall sensors, an Ethernet PHY, and isolated SPI ports without external muxing. Quartus II IP blocks for QEI decode and SVPWM are pre-verified and reduce time-to-prototype. Industrial customers benefit from the SEU-aware configuration memory for plants where cosmic-ray-induced bit-flips are a real risk.
Recommended
Machine Vision Preprocessing
The 3,068,928 bits of embedded M9K memory let the EP3CLS70U484C7N buffer multiple video lines at common image sensor resolutions (VGA through 720p) without external SRAM. Its 198 hardware multipliers accelerate 5x5 or 7x7 convolution kernels, Sobel edge detection, and median-filter operations in real time at 60-100 MHz pixel clocks. The FPGA's LVDS I/O support enables direct interface to CMOS image sensors that use sub-LVDS or HiSPi serialized output, eliminating a serializer chip. The 65 nm LS process keeps power low enough for fanless, sealed industrial enclosures. Designers can route the FPGA's processing output over GigE Vision or USB3 Vision to a host PC, with the FPGA acting as a smart front-end.
Recommended
Automotive Infotainment and Telematics
Automotive infotainment head units need a flexible display controller that can drive multiple panel resolutions, touch overlays, and audio DSP simultaneously. The EP3CLS70U484C7N handles TFT panel timing, LVDS serialization, I2S/TDM audio routing, and CAN/LIN bridging in one device, freeing the host MCU for higher-level OS tasks. The 1.2 V low-static-power core reduces cabin thermal load and aligns with auto OEM energy targets. Designers use the on-die PLL to generate pixel clocks for non-standard displays. The 484-ball U484 package supports the automotive production reflow profile. Note: for ASIL-rated safety functions, supplement with a Cyclone III LS CRC checker that monitors the active configuration bitstream for SEU errors during vehicle lifetime.
Recommended
Portable Medical Instrumentation
Patient-monitoring devices such as pulse oximeters, ECG holters, and portable ultrasound require low-power digital signal chains that fit in a battery-powered enclosure. The EP3CLS70U484C7N's 70K LE are sufficient to implement FIR/IIR filter banks, FFT engines, and QRS detection on a single chip, while the LS family's low static power extends battery life during continuous-wear operation. The device supports LVDS and SSTL I/O for direct connection to low-noise 16/24-bit ADCs without extra glue logic. The 65 nm process produces predictable analog switching noise, which is important for medical CE/EMC compliance. Quartus II's lockstep-aware synthesis flow helps meet IEC 62304 software-of-unknown-provenance requirements when the FPGA is treated as a software-configurable subsystem.
Recommended
Software-Defined Radio Front-End
Low-cost software-defined radio platforms (hobby, public-safety, narrowband IoT) use FPGAs to implement the digital down-conversion (DDC), channelization, and modulation/demodulation chain between a wideband ADC/DAC and a host processor. The EP3CLS70U484C7N's 198 18x18 multipliers and 4 PLLs handle the FIR and CORDIC math at typical IF sample rates of 30-100 MSPS. The 278 user I/O accept parallel LVDS ADC bus output plus a JESD-style reference clock. The 65 nm LS process delivers deterministic timing closure for low-jitter IF processing. The configuration CRC feature lets the device detect configuration bitstream corruption from airborne radiation in outdoor or aerial deployments, an edge case relevant for SDR-equipped UAVs.
Recommended
Factory Automation PLCs and Edge Gateways
Modern PLC backplanes and industrial edge gateways need a programmable glue logic layer that bridges legacy fieldbus (Modbus RTU, RS-485, CAN) with Ethernet/IP, PROFINET, or OPC UA. The EP3CLS70U484C7N implements custom serial protocols, deterministic latency bus arbitration, and MAC-side filtering at line rate. Its 70K LE are enough for a soft-core Nios II control processor plus custom IP blocks for protocol conversion. The 1.2 V LS core keeps power dissipation low for DIN-rail mounted cabinets where heat removal is constrained. The 484-ball U484 footprint exposes enough I/O to terminate four isolated RS-485 ports, one CAN, two SPI sensors, and an Ethernet MAC interface simultaneously. Industrial certifications typically include IEC 61131-2 conformance, which the FPGA's deterministic GPIO timing simplifies.
Recommended
Recommended Products Summary
Engineering reference data for EP3CLS70U484C7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3CLS70U484C7 | EP3CLS100U484C7N | EP3CLS100U484C7 | EP3CLS100U484C8N | EP3CLS70U484C8N | EP3CLS70U484I7N | EP3C55U484C7N |
|---|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FBGA (U484) | 484-FBGA (U484) - same | 484-FBGA (U484) - same | 484-FBGA (U484) - same | 484-FBGA (U484) - same | 484-FBGA (U484) - same | 484-FBGA (U484) - same | 484-FBGA (U484) - same |
| Logic Elements | 70,208 | 70,208 | 100,448 | 100,448 | 100,448 | 70,208 | 70,208 | 55,856 |
| Family | Cyclone III LS (low-static-power) | Cyclone III LS | Cyclone III LS | Cyclone III LS | Cyclone III LS | Cyclone III LS | Cyclone III LS | Cyclone III (non-LS) |
| Embedded Memory | 3,068,928 bits | 3,068,928 bits | 4,456,448 bits | 4,456,448 bits | 4,456,448 bits | 3,068,928 bits | 3,068,928 bits | 2,396,160 bits |
| 18x18 Multipliers | 198 | 198 | 276 | 276 | 276 | 198 | 198 | 156 |
| Speed Grade | 7 (commercial) | 7 | 7 | 7 | 8 (slower) | 8 (slower) | 7 (industrial temp) | 7 |
| Temperature Range | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | -40C to +100C (industrial) | 0C to +85C |
Key Differentiators
- Larger embedded memory and more multipliers for the same pin-compatible footprint (vs EP3CLS70U484C7)
- On-die configuration-bitstream CRC engine for SEU detection (vs EP3C55U484C7N)
- Direct density upgrade path within the same U484 footprint (vs EP3CLS100U484C7N)
- Industrial temperature range option in the same U484 footprint (vs EP3CLS70U484C8N)
Design Notes
Plan a multi-rail supply tree: VCCINT = 1.2 V (with the regulator sized for ~1 A peak during configuration), VCCIO = 1.2/1.5/1.8/2.5/3.3 V per bank (each bank can be independent), VCCA = 2.5 V for analog PLL circuits, and VCCPD = 3.3 V for configuration I/O. Use a TI TPS74401 or equivalent LDO with at least 4.7 uF bulk plus 0.1 uF + 0.01 uF decoupling on every VCC pin per the Cyclone III LS Hardware Design Guidelines.
The U484 is a 1.0 mm pitch FineLine BGA. Use a 4-6 layer PCB with stacked micro-vias (laser-drilled, 0.1 mm pad) on every BGA ball and at least two ground reference planes directly under the device. All VCCINT pins must be individually decoupled. PCB stackup must keep the VCCINT plane no more than 5 mils from the BGA pad layer to minimize inductance; this is critical for simultaneously switching output (SSO) noise and overall signal integrity.
Estimated: at typical industrial utilization (~50% LE, ~25% RAM, 100 MHz core) the EP3CLS70U484C7N dissipates approximately 1.0-1.5 W. The U484 thermal pad should be soldered to a copper pour of at least 1.5 sq.in. on the top layer, plus 4-6 thermal vias to an internal ground plane. Without the thermal pad soldered, junction temperature may exceed 100C in a sealed enclosure. Verify with a thermal probe after first prototype bring-up.
Do NOT confuse the EP3CLS70U484C7N (U484 484-ball UBGGA, 19x19 mm) with the EP3CLS70F484C7N (F484 484-pin FineLine BGA, 23x23 mm). The two packages have different footprints and different pin/ball maps. Always verify the package code in the MPN against your PCB land pattern. Configuration bitstream must be regenerated for any speed-grade or package variant change; do not reuse an old .sof/.pof across different speed grades.
Differential pairs (LVDS) must be routed as 100 ohm differential with intra-pair skew under 20 ps and length matching to within 50 mils of the receiver. Place clock nets on inner stripline layers between two ground planes. Keep PLL analog supply traces short and isolated; route VCCA through a ferrite bead from a quiet 2.5 V rail. Avoid running LVTTL switching signals under the BGA to prevent coupling into configuration pins.
Compliance Information
RoHS compliant per Intel/Altera product page. Halogen-free per Intel policy. Not AEC-Q100 qualified (FPGA family intended for industrial/commercial; AEC-Q100 qualified parts would require a different part number).
