EP3CLS150F780C7 - 150K LE Cyclone III LS FPGA, 780-FBGA | Intel
MPN: EP3CLS150F780C7 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $240 | $240.00 |
| 10 | $220 | $2,200.00 |
| 100 | $195 | $19,500.00 |
| 500 | $175 | $87,500.00 |
| 1,000 | $155 | $155,000.00 |
EP3CLS150F780C7 Overview
An FPGA (Field Programmable Gate Array) is a programmable logic device consisting of an array of configurable logic blocks (CLBs), programmable interconnect, embedded memory blocks, DSP blocks, and hard I/O peripherals. FPGAs occupy a distinct tier above microcontrollers (fixed hardware, firmware-defined) and below ASICs (fully custom silicon): they offer hardware-level parallelism, in-system reconfigurability, and time-to-market advantages over fixed-function ICs, at lower per-unit cost and faster turnaround than full ASIC development. The Cyclone III LS family extends this lineage with a low-static-power variant of Cyclone III, suitable for thermally constrained embedded, industrial, and battery-powered systems.
Key features of the EP3CLS150F780C7 include 150,848 logic elements, 6,137,856 bits (748 Kbit) of embedded SRAM organized in M9K blocks, up to 413 user I/O pins with support for LVDS, LVTTL, SSTL, HSTL, and other single-ended/differential I/O standards, an integrated PLL count of four for clock management, and 1.2 V core operation with multi-rail support for I/O banks. The 780-FBGA package offers a 1 mm ball pitch and 29x29 mm footprint suitable for mid-complexity PCB designs.
The Cyclone III LS architecture combines a logic element array, M9K memory blocks, 18x18 hardware multipliers (DSP blocks), and PLLs to deliver DSP throughput up to 142 GMACS. Static power is reduced versus the standard Cyclone III family through process tuning, while dynamic power benefits from Quartus II power optimization features.
Typical applications include industrial machine vision, motor control and drives, video surveillance and image processing, software-defined radio front-ends, low-cost ASIC prototyping, and automotive driver-assistance prototypes. The wide temperature support and low-power design extend its use to outdoor and energy-constrained embedded platforms.
When designing with this device, allocate sufficient PCB area for the 29x29 mm BGA and ensure the BGA fanout is routed to support 1 mm pitch escape routing. Use the Quartus II design suite for synthesis, place-and-route, and timing closure, and verify signal-integrity margins on high-speed LVDS and DDR2/3 memory interfaces.
This page synthesizes distributor pricing, drop-in alternatives from the Cyclone III/III LS family, and practical design notes for the EP3CLS150F780C7 that go beyond what the manufacturer datasheet alone provides.
Drop-in alternatives for EP3CLS150F780C7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3CLS150F780C7 (same form factor and footprint) — differing in Process Technology, Package, Speed Grade, Family, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3CLS200F780C8
✅ Drop-In✓ In Stock
$1995 / Unit
View Datasheet →EP3CLS150F780C8
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$195.2 / Unit
View Datasheet →EP3CLS150F780I7
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$712.5 / Unit
View Datasheet →EP3C120F780C7N
✅ Drop-In✓ In Stock
$162 / Unit
View Datasheet →EP3CLS100F780C7
✅ Drop-In✓ In Stock
$632.4 / Unit
View Datasheet →EP3CLS150F780C7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$88.4 / Unit
View Datasheet →EP3CLS150F780C7 Maximum Ratings & Electrical Characteristics
| Family | Cyclone® III LS |
| Device Type | FPGA |
| Logic Elements | 150,848 |
| Logic Array Blocks (LABs) | 9428 |
| Total Memory Bits | 6,137,856 |
| Embedded Memory | 748 Kbit (M9K blocks) |
| User I/O Pins | 413 |
| PLLs | 4 |
| Global Clocks | 20 |
| Multiplier Blocks (18x18) | Available |
| Supply Voltage (Core) | 1.2 V |
| Process Technology | 65 nm low-power CMOS |
| Package | FBGA-780 (29x29 mm, 1 mm pitch) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Operating Temperature Grade | Commercial (0C to +85C) |
| Configuration | Serial / Passive Parallel / Fast Passive Parallel |
EP3CLS150F780C7 fbga-780 (29x29 mm, 1 mm pitch) Pin Configuration Guide
Pin configuration for EP3CLS150F780C7 (fbga-780 (29x29 mm, 1 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3CLS150F780C7.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3CLS150F780C7 is suitable for 7 applications: Industrial Machine Vision Systems, Motor Control and Industrial Drives, Video Surveillance and Image Processing, Software-Defined Radio Front-End, ASIC Prototyping and Hardware Emulation, Automotive Driver-Assistance Prototypes (Pre-Production), Embedded Display Controllers and HMI Panels.
Industrial Machine Vision Systems
The EP3CLS150F780C7 fits industrial machine vision pipelines because its 150,848 logic elements plus 6,137,856 embedded memory bits can hold frame buffers and run Bayer-to-RGB conversion, blob detection, and object classification in fabric. The 413 user I/O pins connect directly to LVDS camera interfaces, motor encoders, GPIO-driven lighting strobes, and GbE PHYs. Low-static-power Cyclone III LS operation reduces thermal load inside sealed camera enclosures, eliminating active cooling in 0-85C environments. The 65 nm low-power process gives deterministic dynamic power for vision pipelines running 60-120 fps on QVGA-to-1080p sensors.
Recommended
Motor Control and Industrial Drives
The EP3CLS150F780C7 serves as a control core in AC induction, BLDC, and servo drives, where its 18x18 hardware multipliers, 4 PLLs, and 65 nm low-power process deliver deterministic current-loop computation at 16-32 kHz switching frequencies. The 413 I/O pins accommodate PWM channels, encoder inputs (QEP, Hall), ADC interfaces (parallel SAR up to 16-bit), and isolated communication ports (RS-485, CAN, SPI). Cyclone III LS static-power reduction keeps junction temperatures low even in enclosed IP65/IP67 motor housings. Quartus II Qsys integration enables rapid SoC composition with motor-control IP cores.
Recommended
Video Surveillance and Image Processing
The EP3CLS150F780C7 supports multi-channel H.264 baseline encoding, motion detection, and overlay compositing for video surveillance DVRs and IP cameras. The 6,137,856-bit embedded SRAM enables line buffering and reference-frame caching for SD/HD streams without external DRAM, while the abundant DSP blocks accelerate dewarping and analytics. The FBGA-780's 413 I/O pins handle multi-sensor input, HDMI/DVI outputs, and Ethernet PHYs. Low-static-power LS operation makes the device viable for fanless PoE-powered camera designs. According to Intel Cyclone III LS application notes, this density is the sweet spot for 4-channel 720p30 encoding.
Recommended
Software-Defined Radio Front-End
The EP3CLS150F780C7 handles DSP-heavy baseband processing in software-defined radio platforms: digital up/down conversion, pulse shaping, channelization, and adaptive filtering. Its 18x18 multipliers and 65 nm process deliver hundreds of GMACS of DSP throughput, while 413 LVDS-capable I/O pins interface to high-speed ADCs/DACs and antenna digital interfaces. The 4 PLLs generate the multiple sample clocks required for multi-radio architectures. Low-static-power Cyclone III LS operation makes the FPGA usable in battery-powered portable SDRs and manpack radios where thermal budget is constrained.
Recommended
ASIC Prototyping and Hardware Emulation
The EP3CLS150F780C7 is widely used for ASIC and ASSIC prototyping because its 150,848 LE and 9428 LABs deliver sufficient logic capacity for mid-complexity SoC bring-up. Quartus II synthesis accepts standard HDL flows, and the FBGA-780 footprint exposes enough I/O for trace/debug and stimulus. According to Intel Cyclone III LS device handbook, this density is well-suited for partitioning an ASIC design across multiple FPGAs via TDM or pin-multiplexing schemes. Low-static-power operation is beneficial for desktop prototype boards that lack active cooling.
Recommended
Automotive Driver-Assistance Prototypes (Pre-Production)
The EP3CLS150F780C7 supports pre-production prototyping of ADAS functions such as lane-departure warning, blind-spot detection, and pedestrian classification, though AEC-Q100 qualification is not implied for the C7 commercial-grade device. Engineers can prototype sensor-fusion algorithms using its DSP blocks, then port to qualified automotive parts. Industrial temperature variants (EP3CLS150F780I7) extend operating range to -40C to +100C for under-hood bench testing. The 413 I/O pins accommodate multiple camera inputs, radar interface logic, and CAN/LIN gateways.
Recommended
Embedded Display Controllers and HMI Panels
The EP3CLS150F780C7 serves as the graphics and touch controller in industrial HMI panels, medical displays, and kiosk terminals. Its logic and memory capacity drives LCD timing, color-space conversion, alpha blending, and touch-screen decoding without an external GPU. The 413 I/O pins support LVDS/TTL display interfaces, capacitive-touch sensing, and backlight PWM control. According to Intel Cyclone III LS reference designs, the device can drive up to WUXGA (1920x1200) resolution. Low-static-power LS operation enables fanless sealed HMI enclosures with extended MTBF.
Recommended
Recommended Products Summary
Engineering reference data for EP3CLS150F780C7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3CLS200F780C8 | EP3C120F780C7N | EP3CLS100F780C7 | EP3CLS150F780C8 | EP3CLS150F780I7 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | FBGA-780 (29x29 mm) | FBGA-780 (29x29 mm) - same | FBGA-780 (29x29 mm) - same | FBGA-780 (29x29 mm) - same | FBGA-780 (29x29 mm) - same | FBGA-780 (29x29 mm) - same |
| Logic Elements | 150,848 | 197,600 | 119,088 | 100,448 | 150,848 (same) | 150,848 (same) |
| Family | Cyclone III LS | Cyclone III LS | Cyclone III (standard) | Cyclone III LS | Cyclone III LS | Cyclone III LS |
| Embedded Memory Bits | 6,137,856 | 8,121,216 | 3,981,312 | 3,732,480 | 6,137,856 (same) | 6,137,856 (same) |
| User I/O Pins | 413 | 429 | 429 | 429 | 413 (same) | 413 (same) |
| Speed Grade | C7 (commercial) | C8 | C7 | C7 | C8 | I7 (industrial temp) |
| Temperature Grade | Commercial 0-85C | Commercial 0-85C | Commercial 0-85C | Commercial 0-85C | Commercial 0-85C | Industrial -40C to +100C |
| Approx. Unit Price (1k qty, USD) | 155.00 | Higher (estimated) | Lower (estimated) | Lower (estimated) | Similar (estimated) | Higher (estimated) |
Key Differentiators
- Higher logic density within same FBGA-780 footprint vs EP3CLS100F780C7 (vs EP3CLS100F780C7)
- Lower static power than standard Cyclone III at comparable density (vs EP3C120F780C7N)
- C7 speed grade vs C8 in higher-density EP3CLS200F780C8 (vs EP3CLS200F780C8)
Design Notes
The 780-ball FineLine BGA at 1 mm pitch requires microvia or via-in-pad PCB technology for inner-row balls. Per Intel Cyclone III LS hardware design guidelines, route the inner balls using dog-bone fanout only on 4-layer stack-ups; for 6+ layer stack-ups, microvia-in-pad is preferred to maintain signal-integrity margins. Maintain a continuous ground plane under the BGA and stitch vias on a 1-2 mm grid around the package to suppress ground bounce on simultaneous-switching outputs.
Estimated: at 1.2 V core with 150,848 LE switching at typical 20% toggle rate, dynamic current approximates 1-2 A; static current in the LS family is in the 100-300 mA range. Use a switching regulator followed by a low-noise LDO for the 1.2 V rail, and isolate VCCIO rails per bank. Sequencing must enforce 1.2 V core rise before VCCIO to prevent I/O latch-up; consult the Cyclone III LS handbook power-on-reset timing diagram for tRAMP and sequence requirements. Decoupling: 0.1 uF X7R per power pin pair, plus 4.7 uF bulk per rail.
Estimated: do not exceed 1.2 V +/- 5% on the core supply or the device enters brown-out. MSEL pins must be tied to the correct configuration mode (AS, PS, FPP, or JTAG-only) before power-up; otherwise configuration fails or the device enters an undefined state. JTAG pins TCK, TMS, TDI, TDO require pull-ups/pull-downs per the Cyclone III LS handbook. The CONF_DONE and nSTATUS signals need external 10 kΩ pull-ups to VCCIO. For industrial designs above 85C, choose the I-suffix variant (EP3CLS150F780I7).
Compliance Information
RoHS compliant per Altera/Intel product page. Not AEC-Q100 qualified; the C7 suffix indicates commercial temperature grade. For automotive applications, choose qualified parts from other families.
