EP3CLS200F780C8 - Cyclone III LS FPGA, 198K LE, 780-BGA | Altera
MPN: EP3CLS200F780C8 β Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3240.31 | $3,240.31 |
| 10 | $2910.5 | $29,105.00 |
| 100 | $2590 | $259,000.00 |
| 500 | $2280 | $1,140,000.00 |
| 1,000 | $1995 | $1,995,000.00 |
EP3CLS200F780C8 Overview
A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor device whose logic fabric, routing, and I/O are configured by loading a user-defined bitstream into on-chip SRAM. FPGAs sit at the top of the programmable logic hierarchy, above CPLDs and below ASICs, and offer the highest logic density and richest DSP/memory capability for parallel processing. The Cyclone III LS family is Altera's low-power FPGA line, engineered to balance logic density with static and dynamic power reduction features such as programmable power technology and hot-socketing.
Key features of the EP3CLS200F780C8 include four phase-locked loops (PLLs) for clock management, embedded multiplier blocks supporting DSP operations up to 18 x 18 bits, 8 Mb of distributed plus block RAM, and dedicated high-speed serial interfaces absent on this fabric variant. The 'C8' speed grade targets an internal logic performance near 400 MHz depending on routing and design style. The 'LS' suffix denotes the Cyclone III LS sub-family, sharing the Cyclone III architecture with low-power enhancements.
Typical applications include industrial motor control, video processing pipelines, prototyping bridges, telecom line cards, and medium-density data acquisition front-ends. The 780-BGA package provides the largest pin count in the Cyclone III LS portfolio, enabling wide parallel buses and many LVDS pairs. When designing with this part, allocate I/O banks carefully against the 1.2 V core and banked I/O supply rails, and plan JTAG configuration via the dedicated configuration pins. This page synthesizes distributor stock, same-family drop-in alternatives, and PCB-level design guidance not compiled in the bare manufacturer datasheet.
Drop-in alternatives for EP3CLS200F780C8 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3CLS200F780C8 (same form factor and footprint) β differing in Package, Process Technology, Speed Grade, Logic Array Blocks (LABs), RoHS Status.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP3CLS200F780C7N
β Drop-Inβ In Stock
$199.5 / Unit
View Datasheet βEP3CLS200F780C7
β Drop-Inβ In Stock
$102.4 / Unit
View Datasheet βEP3CLS150F780C8N
β Drop-Inβ In Stock
$205 / Unit
View Datasheet βEP3CLS150F780C8
β Drop-Inβ In Stock
$195.2 / Unit
View Datasheet βEP3CLS150F780C7N
β Drop-Inβ In Stock
$88.4 / Unit
View Datasheet βEP3CLS100F780C8N
β Drop-Inβ In Stock
$105.8 / Unit
View Datasheet βEP3CLS200F780C8 Maximum Ratings & Electrical Characteristics
| Manufacturer | Altera (Intel Programmable Solutions Group) |
| Family | Cyclone III LS |
| Series | Cyclone III LS |
| Logic Elements | 198,464 |
| Embedded Memory Bits | 8,211,456 |
| User I/O Count | 413 |
| Package | 780-BGA (FBGA-780), 29 x 29 mm, 1 mm pitch |
| Supply Voltage (Core) | 1.2 V |
| Logic Blocks / CLBs | 198,464 (cell count per FindIC) |
| Maximum Internal Frequency | 450 MHz (per FindIC spec table) |
| Process Technology | 60 nm CMOS (TSMC) |
| Speed Grade | 8 (commercial) |
| Mounting Type | Surface Mount |
| RoHS Status | unknown |
EP3CLS200F780C8 780-bga (fbga-780), 29 x 29 mm, 1 mm pitch Pin Configuration Guide
Pin configuration for EP3CLS200F780C8 (780-bga (fbga-780), 29 x 29 mm, 1 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3CLS200F780C8.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3CLS200F780C8 is suitable for 7 applications: Industrial Motor Control, Video Processing Pipeline, Telecom Line Card Glue Logic, Prototyping and ASIC Emulation, Data Acquisition Front-End, Medical Imaging Equipment, Aerospace Test and Avionics Bridge.
Industrial Motor Control
The EP3CLS200F780C8's 198,464 logic elements and 413 user I/O make it well suited to multi-axis industrial motor controllers where the FPGA handles PWM generation, current sensing, encoder decoding, and real-time safety logic in parallel. The 1.2 V core plus programmable power technology reduces thermal load inside sealed motor-drive cabinets, while the 780-FBGA package supports the many LVDS pairs used for high-resolution encoder feedback. Quartus II Qsys blocks let designers reuse Altera-validated IP for FOC and Sigma-Delta ADC interfaces, shrinking BOM and shortening qualification cycles.
Recommended
Video Processing Pipeline
In video broadcast and surveillance equipment, the EP3CLS200F780C8 acts as a frame buffer and color-space converter between image sensors and SoCs. The device's 8.2 Mb of embedded memory supports several lines of horizontal video buffering at 1080p60, and the 18 x 18 embedded multipliers accelerate chroma resampling and deinterlacing without burdening the host CPU. With 413 user I/O, designers can simultaneously drive parallel RGB, BT.1120, and LVDS display outputs from a single device, avoiding extra bridge chips on the PCB.
Recommended
Telecom Line Card Glue Logic
Telecom line cards rely on FPGAs to bridge between network processors, framer ASICs, and backplane SERDES. The EP3CLS200F780C8 supplies enough user I/O and LVDS pairs to manage TDM buses, SPI/I2C control planes, and timing references in one device, while the 1.2 V core keeps power consumption compatible with NEBS thermal envelopes. The Cyclone III LS family supports hot-socketing, which is critical for in-service line-card replacement. The device's 1 mm pitch 780-BGA accommodates the dense routing of backplane midplanes without requiring microvia stacks on every net.
Recommended
Prototyping and ASIC Emulation
Designers building pre-silicon prototypes for ASIC and SoC verification often select the EP3CLS200F780C8 for its 198K logic elements and rich memory bandwidth, which can host millions of ASIC gates through soft-core mapping. The 780-FBGA provides the I/O count required to bring out wide ASIC buses, while Quartus II incremental compile keeps iteration cycles fast. Compared to ASIC respins, the FPGA path offers months of schedule savings, and the same bitstream can be reused in early field trials before tape-out.
Recommended
Data Acquisition Front-End
High-channel-count data acquisition systems pair the EP3CLS200F780C8 with multi-MHz ADCs to perform real-time decimation, channel calibration, and trigger logic. The device's 18 x 18 DSP blocks accelerate finite-impulse-response filters, while the 8 Mb of block RAM holds rotating sample buffers per channel. The 413 I/O support 16 or more parallel LVDS ADC lanes, and the 780-FBGA footprint keeps the part close to the analog front-end to minimize stub lengths and preserve SNR.
Recommended
Medical Imaging Equipment
The EP3CLS200F780C8 fits medical imaging controllers in ultrasound and endoscopy carts, where the FPGA aggregates multiple sensor streams, performs beamforming or pixel correction, and delivers processed frames to a host processor. The Cyclone III LS low-power architecture reduces heat near patient-facing enclosures, while the 780-FBGA package supports the many LVDS data lanes needed for modern image sensors. Designers must validate deterministic latency through TimeQuest to meet IEC 62304-style software safety expectations, even though no formal AEC-Q100 equivalent applies here.
Recommended
Aerospace Test and Avionics Bridge
Avionics test rigs and military bridge systems leverage the EP3CLS200F780C8 to translate between ARINC 429, MIL-STD-1553, and Ethernet interfaces. The high I/O count of the 780-FBGA exposes enough channels for multiple buses, and the 1.2 V core keeps power dissipation manageable in sealed test fixtures. Designers targeting DO-254 design assurance should pair the FPGA with the documented handbook safety guidelines, since formal DO-254 evidence is the integrator's responsibility, not the silicon vendor's.
Recommended
Recommended Products Summary
Engineering reference data for EP3CLS200F780C8 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3CLS200F780C7N | EP3CLS200F780C7 | EP3CLS150F780C8N | EP3CLS150F780C8 | EP3CLS150F780C7N | EP3CLS100F780C8N |
|---|---|---|---|---|---|---|---|
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Package | 780-BGA (FBGA-780), 29 x 29 mm, 1 mm pitch | 780-BGA (FBGA-780), same | 780-BGA (FBGA-780), same | 780-BGA (FBGA-780), same | 780-BGA (FBGA-780), same | 780-BGA (FBGA-780), same | 780-BGA (FBGA-780), same |
| Logic Elements | 198,464 | 198,464 | 198,464 | 149,424 | 149,424 | 149,424 | 98,000 (approx) |
| Speed Grade | C8 | C7 | C7 | C8 | C8 | C7 | C8 |
| User I/O | 413 | 413 | 413 | 413 | 413 | 413 | 413 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Pb-Free / Lead Finish | unknown | Pb-free (N suffix) | Leaded variant | Pb-free | Leaded variant | Pb-free | Pb-free |
| Lifecycle / Availability | Last-time-buy phase | Last-time-buy phase | Last-time-buy phase | Last-time-buy phase | Last-time-buy phase | Last-time-buy phase | Last-time-buy phase |
Key Differentiators
- Highest logic density in the Cyclone III LS 780-FBGA family (vs EP3CLS150F780C8N)
- Faster speed grade for timing-critical paths (vs EP3CLS200F780C7N)
- Same-package footprint across the Cyclone III LS family (vs EP3C80F780C8N (older Cyclone III))
Design Notes
Estimated: with a 1.2 V core at typical Cyclone III LS utilization, plan for 1.5 to 3 W of core power at 100% toggle on the EP3CLS200F780C8, plus I/O bank power proportional to switching activity. Use the Altera PowerPlay Early Power Estimator spreadsheet to refine before board layout, and place low-impedance decoupling (10 uF bulk plus 100 nF per VCC pin group) within 5 mm of each bank supply pin. Verify bank-referenced I/O voltages (e.g., 2.5 V, 3.3 V) match the schematic before power-on.
The 780-FBGA uses 1 mm ball pitch on a 29 x 29 mm body, so at minimum a 6-layer PCB with stacked microvias on inner layers is recommended. Escape routing should fan out on the top layer first, then break into the inner layers through microvias; dog-bone fan-outs are acceptable but reduce routing channels. Match all differential pair lengths to within 150 mil for LVDS interfaces and keep reference planes continuous under the BGA field to suppress simultaneous-switching noise.
Do not load a Cyclone III bitstream into a Cyclone III LS device, or vice versa: the configuration bitstream differs even at the same package and speed grade, and IDCODE checks in Quartus II programmer will reject mismatches. Also verify MSL handling per JEDEC J-STD-033 before reflow; the 780-FBGA is typically MSL3, so a dry-pack and floor-life budget must be respected during PCB assembly. Finally, do not assume the 'LS' and standard Cyclone III pinouts are identical: the F780 ball maps differ in at least the configuration pin group.
Compliance Information
Compliance values not stated explicitly in verified web data; Altera/Intel product page should be consulted for the specific C8N vs C8 lead-finish option. AEC-Q100 is not applicable to this FPGA grade.
