EP3CLS150F484I7N - Cyclone III 150K LE FPGA | Intel | FBGA-484
MPN: EP3CLS150F484I7N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268.5 | $2,685.00 |
| 100 | $245 | $24,500.00 |
| 500 | $215.75 | $107,875.00 |
| 1,000 | $192.4 | $192,400.00 |
EP3CLS150F484I7N Overview
What is an FPGA? A Field Programmable Gate Array (FPGA) is a semiconductor device whose digital logic function is defined after manufacturing by loading a user-supplied bitstream into on-chip SRAM configuration memory. FPGAs occupy the middle ground between general-purpose microcontrollers (fixed instruction set, software-defined behavior) and application-specific integrated circuits (ASICs, fixed hardware). The Cyclone III LS specifically targets applications that require reconfigurable logic plus hardware root-of-trust: industrial motor control, secure communications, automotive driver assist, and medical imaging front-ends.
Key features of the EP3CLS150F484I7N include 150,848 logic elements distributed across 9,428 LABs (logic array blocks), 6.14 Mbits of embedded SRAM (M9K blocks), 210 18x18 multipliers capable of up to 450 MHz DSP performance, 4 PLLs, 20 global clock networks, and up to 210 user I/O pins. The device supports LVDS, LVCMOS, SSTL, and HSTL I/O standards with hot-socketing capability. Power consumption is optimized for cost-sensitive high-volume applications through 1.0 V core operation and selectable I/O bank voltages.
Architecturally, Cyclone III LS uses a 65 nm low-power CMOS process with a programmable interconnect fabric driven by SRAM configuration cells. The 'LS' suffix adds a tamper-resistant configuration subsystem including 256-bit AES encryption, a non-volatile security key, and a hardware JTAG block that can lock the device against readback. This makes the EP3CLS150F484I7N suitable for designs where IP protection is a contractual or regulatory requirement.
Typical applications include industrial Ethernet switches, motor-control servo drives, video surveillance DVR back-ends, software-defined radio modems, low-cost ASIC prototyping, and PCI Express endpoint bridges. The 484-ball FBGA package supports moderate-density board layouts and reflow soldering at standard JEDEC J-STD-020 profiles.
When designing with this device, allocate at least 4 configuration pins (nCONFIG, nSTATUS, CONFIG_DONE, DCLK or AS data lines) and respect the differential clock input pair placement rules. Quartus II (or newer Intel Quartus Prime) software is required for synthesis, place-and-route, and bitstream generation. The 'I7' speed grade and 'N' lead-free suffix indicate an industrial-temperature, lead-free / RoHS-compliant device.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP3CLS150F484I7N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3CLS150F484I7N (same form factor and footprint) — differing in Package, Operating Temperature, Process Technology, Logic Elements, Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3CLS150F484I7
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$101.1 / Unit
View Datasheet →EP3CLS200F484I7N
✅ Drop-In✓ In Stock
$198 / Unit
View Datasheet →EP3C120F484I7N
✅ Drop-In✓ In Stock
$84.7 / Unit
View Datasheet →EP3C80F484I7N
✅ Drop-In✓ In Stock
$286.91 / Unit
View Datasheet →EP3C55F484I7N
✅ Drop-In✓ In Stock
$205.4 / Unit
View Datasheet →EP3CLS150F484C8N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$115.2 / Unit
View Datasheet →EP3CLS150F484C7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$102.75 / Unit
View Datasheet →EP3CLS150F484I7N Maximum Ratings & Electrical Characteristics
| Family | Cyclone III LS |
| Logic Elements | 150,848 |
| Logic Array Blocks (LABs) | 9,428 |
| Embedded Memory (M9K blocks) | 6,137,856 bits (6.14 Mbit) |
| Embedded Multipliers (18x18) | 210 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Maximum User I/O | 210 |
| Package | FBGA-484 (FineLine BGA) |
| Process Technology | 65 nm low-power CMOS |
| Core Voltage | 1.0 V (typical) |
| Operating Temperature | -40C to +100C (Industrial, 'I') |
| Speed Grade | 7 |
| Lead-Free / RoHS | Yes (suffix 'N') |
| Configuration Schemes | AS, AP, PS, FPP, JTAG |
| Security Features | 256-bit AES bitstream encryption, JTAG secure mode, CRC |
| DSP Performance | Up to 450 MHz on 18x18 multipliers |
EP3CLS150F484I7N fbga-484 (fineline bga) Pin Configuration Guide
Pin configuration for EP3CLS150F484I7N (fbga-484 (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3CLS150F484I7N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3CLS150F484I7N is suitable for 6 applications: Industrial Motor Control, Video Surveillance / DVR Back-End, Industrial Ethernet Switch / Protocol Bridge, Software-Defined Radio Modem, Medical Imaging Front-End, ASIC Prototyping Platform.
Industrial Motor Control
The EP3CLS150F484I7N is well matched to industrial servo drives and inverter controllers. Its 210 dedicated 18x18 hardware multipliers handle field-oriented-control (FOC) math at the typical 10-20 kHz PWM switching frequency, while 6.14 Mbit of embedded SRAM buffers current-loop and encoder-decoding state without external memory. The 210 user I/O pins drive multi-axis inverter bridges, and the -40C to +100C industrial temperature rating supports cabinet-mounted installations. Unlike microcontrollers, the FPGA's parallel hardware execution sustains deterministic sub-microsecond control-loop latency under heavy interrupt load.
Recommended
Video Surveillance / DVR Back-End
In multi-channel DVR and NVR back-ends, the EP3CLS150F484I7N handles H.264/H.265 encode offload, motion-detection preprocessing, and video pipelining. The 150K logic elements sustain 4-8 channels of 1080p30 preprocessing at 150 MHz, and 6.14 Mbit embedded memory holds reference frames for short-loop motion compensation. The LS family's 256-bit AES bitstream encryption protects manufacturer IP in competitive surveillance markets. Compared with ASSP SoCs, the FPGA's reconfigurable fabric lets OEMs add proprietary analytics without respinning the host board.
Recommended
Industrial Ethernet Switch / Protocol Bridge
The EP3CLS150F484I7N supports wire-speed protocol bridging for EtherCAT, PROFINET, and EtherNet/IP gateways. Its 20 global clock networks feed multiple Ethernet MAC IPs running concurrently, and 6.14 Mbit embedded SRAM provides line-rate packet buffers on the order of 16K packets at 64-byte payloads. The 210 I/O pins accommodate multi-port MII/RGMII PHYs plus GPIO for diagnostics, and the industrial temperature range suits factory-floor deployments. Hardware AES encryption in the LS family protects proprietary gateway bitstreams.
Recommended
Software-Defined Radio Modem
In software-defined radio baseband designs, the EP3CLS150F484I7N implements multi-standard waveform processing (LTE, WiMAX, proprietary) with parallel DSP blocks. The 210 18x18 multipliers sustain channel filter, FFT, and channel-coding arithmetic at baseband sample rates up to 100 MSPS, while 6.14 Mbit embedded memory holds waveform coefficients and symbol buffers. The 4 on-chip PLLs generate the multiple baseband clocks required for ADC/DAC interfacing, and the LS family's hardware AES protects waveform IP.
Recommended
Medical Imaging Front-End
The EP3CLS150F484I7N is deployed in ultrasound beamformers and patient-monitoring pre-processors. Its parallel multiplier array executes beamforming summation across 32-64 channels at real-time rates, and the 6.14 Mbit embedded SRAM holds channel calibration coefficients and beamformed frame buffers. The 4 PLLs synchronize ADC sample clocks with beamformer clocks, and the -40C to +100C industrial temperature rating tolerates chassis-internal heating. Hardware AES encryption helps protect patient-data bitstreams in regulated deployments.
Recommended
ASIC Prototyping Platform
Designers use the EP3CLS150F484I7N as a target for ASIC RTL prototyping because 150K logic elements map roughly to 3-5 million gates of typical ASIC netlists. The 6.14 Mbit embedded memory models ASIC SRAM macros, and the 210 I/O pins permit real-world peripheral interfacing. Compared with emulators, the FPGA's standard JTAG and AS configuration modes simplify bring-up, while Quartus Prime synthesis shortens the prototype iteration cycle. Once the RTL is validated, the same firmware tools used for the FPGA prototype can be reused for ASIC tape-out.
Recommended
Recommended Products Summary
Engineering reference data for EP3CLS150F484I7N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3CLS150F484I7 | EP3CLS200F484I7N | EP3C120F484I7N | EP3C80F484I7N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | FBGA-484 | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same |
| Logic Elements | 150,848 | 150,848 - same | 200,000 (Cyclone III LS) | 120,000 (Cyclone III) | 81,000 (Cyclone III) |
| Embedded Memory | 6.14 Mbit | 6.14 Mbit | 8.55 Mbit | 3.89 Mbit | 2.74 Mbit |
| 18x18 Multipliers | 210 | 210 | 250 | 288 | 128 |
| Maximum User I/O | 210 | 210 | 193 | 213 | 295 |
| AES Encryption | Yes (LS family) | Yes | Yes | No | No |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C |
| Speed Grade | 7 | 7 | 7 | 7 | 7 |
Key Differentiators
- Largest 150K-LE Cyclone III LS in FBGA-484 footprint (vs EP3C120F484I7N)
- 256-bit AES bitstream encryption (vs EP3C120F484I7N (non-LS))
- Balanced DSP and logic density for mid-range applications (vs EP3CLS200F484I7N)
Design Notes
The EP3CLS150F484I7N in FBGA-484 has a typical junction-to-ambient thermal resistance (theta_JA) around 11 C/W with adequate PCB thermal vias under the package center. Estimated: at full design utilization (90% LE, 80% RAM, 50% multipliers) the device dissipates approximately 2-3 W steady-state; with 4 thermal vias under the BGA center thermal pad connected to an inner copper plane, junction temperature stays below 100C in still air at 70C ambient. For chassis-mounted industrial designs without forced airflow, add a 6 mm x 6 mm copper heatsink or extend the inner ground plane to maximize heat spreading.
The EP3CLS150F484I7N requires four separate supply rails: VCCINT (1.0 V core), VCCA (2.5 V PLL analog), VCCIO (per-bank, 1.2 V to 3.3 V), and VCCD_PLL (1.0 V PLL digital). Decoupling requirements per Intel Cyclone III Device Handbook: 100 nF X7R for every 5 LABs and one 10 uF bulk cap per supply, placed within 100 mils of the respective balls. Sequencing: VCCINT must ramp before VCCIO; failure to sequence damages internal ESD structures. Add a load switch or sequencer IC (e.g., LTC2928) when rails come from separate regulators.
The FBGA-484 has a 1.0 mm pitch with 484 balls on a 22x22 array (with depopulated corners). PCB layout must use microvia stacks or HDI technology with 0.4 mm laser-drilled microvias in pad for reliable assembly. Estimated: escape routing requires at least 4 routing layers between BGA and first breakout; for full I/O utilization, plan for 8-10 routing layers. Follow Intel AN 483 (formerly Altera AN 483) for FPGA-specific PCB stack-up guidance including impedance-controlled traces for LVDS pairs and reference-plane continuity under high-speed clock nets.
Three common pitfalls when designing with the EP3CLS150F484I7N: (1) assigning JTAG signals (TCK, TMS, TDI, TDO) to user I/O without disabling JTAG mode in the Quartus device options - this causes JTAG contention. (2) Forgetting to specify the configuration scheme (AS, PS, FPP) in the Quartus pin planner, leading to unassigned MSEL pins and a non-functional board. (3) Using the 'I7' speed grade with Quartus timing constraints that assume the faster 'C8' grade - hold-time violations appear at low voltage and cold temperature. Always download the matching device datasheet section for the exact speed grade.
Clock routing is the most layout-sensitive aspect. The 4 PLLs feed 20 global clock networks; long clock traces must be matched within 25 ps to avoid skew-induced timing failures. Estimated: route all clock nets on an inner stripline layer adjacent to a continuous ground plane. Place PLL filter components (the 0.1 uF + 10 uF RC network on VCCA) within 200 mils of the PLL ball with no signal traces crossing under the filter network to prevent coupling of high-frequency noise into the PLL voltage domain.
Compliance Information
RoHS compliant per 'N' suffix in MPN; lead-free (Pb-free) ball finish per JEDEC J-STD-020. Halogen-free per Intel Cyclone III LS materials declaration. AEC-Q100 not applicable - this is an FPGA intended for industrial/commercial use, not automotive-grade. For automotive designs, consider Cyclone IV or Cyclone V automotive-qualified variants.
