EP3C40F484I7 - 39.6K Logic Elements Cyclone III FPGA | Intel | 484-FBGA
MPN: EP3C40F484I7 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $119.04 | $119.04 |
| 10 | $105 | $1,050.00 |
| 100 | $88.5 | $8,850.00 |
| 250 | $79.2 | $19,800.00 |
| 500 | $72.5 | $36,250.00 |
| 1,000 | $65 | $65,000.00 |
EP3C40F484I7 Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP such as block RAM, DSP blocks and PLLs. FPGAs are reprogrammable, allowing engineers to implement custom digital logic, glue functions, parallel processing pipelines, and high-speed I/O protocols. FPGAs sit in the broader hierarchy: programmable logic -> logic IC -> integrated circuit -> semiconductor. They complement microcontrollers and ASICs by trading unit cost for flexibility, parallelism and time-to-market.
Key features of the EP3C40F484I7 include 4 PLLs, 126 multipliers (18 x 18 hardware multipliers for DSP), support for LVDS, LVTTL, LVCMOS, SSTL and HSTL I/O standards, and a configurable Logic Array Block (LAB) architecture of 2,475 LABs. The device operates over the industrial -40C to +125C temperature range, making it suitable for harsh-environment and industrial designs.
Cyclone III devices use a low-k, 65 nm process and a small die footprint relative to logic capacity, delivering one of the lowest static power profiles in the FPGA market at the time of release. Designers typically pair the FPGA with DDR/DDR2 SDRAM memory controllers (using the dedicated DQS pins) and external configuration memory (such as EPCS or EPCQ serial flash). Configuration is loaded via JTAG or the active/passive serial (AS/PS) scheme.
Typical applications include industrial motor control and automation, video processing pipelines, software-defined radio (SDR) baseband, test and measurement front-ends, and protocol bridging cards (PCI Express, Ethernet MACs, custom LVDS links). The 484-FBGA footprint provides enough I/O for memory buses, high-speed transceivers-like interfaces (via LVDS), and parallel expansion connectors.
When designing with this FPGA, ensure that the JTAG chain and configuration mode pins (MSEL[3..0]) are correctly strapped, and verify that the chosen I/O bank voltages match the logic levels of connected peripherals. The Quartus Prime (or legacy Quartus II) toolchain is required for synthesis, place-and-route, and bitstream generation. Use the Altera/Intel PowerPlay early power estimator before PCB layout to size decoupling, planes, and any required thermal management.
This page synthesizes distributor pricing, verified same-family drop-in alternatives and practical design notes not found in the manufacturer datasheet alone, helping procurement and design engineers make an informed second-source decision.
Drop-in alternatives for EP3C40F484I7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3C40F484I7 (same form factor and footprint) — differing in Operating Temperature, Package, Process Technology, Speed Grade, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3C40F484I7N
✅ Drop-In✓ In Stock
$118.5 / Unit
View Datasheet →EP3C40F484C8N
✅ Drop-In✓ In Stock
$21.4 / Unit
View Datasheet →EP3C40F484C8
✅ Drop-In✓ In Stock
$88.1 / Unit
View Datasheet →EP3C40F484C7N
✅ Drop-In✓ In Stock
$264 / Unit
View Datasheet →EP3C40F484C6N
✅ Drop-In✓ In Stock
$312.4 / Unit
View Datasheet →EP3C40F484I7 Maximum Ratings & Electrical Characteristics
| Series | Cyclone III |
| Logic Elements | 39,600 LE |
| Logic Array Blocks (LABs) | 2,475 LABs |
| Embedded Memory | 1,161,216 bits (1136 Kbit) |
| User I/O Count | 331 |
| Multipliers (DSP) | 126 (18 x 18) |
| PLLs | 4 |
| Process Technology | 65 nm CMOS, low-k |
| Core Supply Voltage | 1.2 V |
| Package | 484-pin FBGA (FineLine BGA) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +125C (Industrial) |
| Speed Grade | 7 |
| Lead-Free / RoHS | Yes (Lead Free) |
| Maximum Clock Frequency | 472.5 MHz |
EP3C40F484I7 484-pin fbga (fineline bga) Pin Configuration Guide
Pin configuration for EP3C40F484I7 (484-pin fbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3C40F484I7.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3C40F484I7 is suitable for 6 applications: Industrial Motor Control and Automation, Video Processing and Image Pipeline, Software-Defined Radio Baseband, Test and Measurement Front-End, Protocol Bridging and Interface Cards, Embedded Vision and Machine Learning Inference.
Industrial Motor Control and Automation
The EP3C40F484I7 is well suited for industrial motor control and factory automation. Its 39,600 logic elements and 126 dedicated 18 x 18 multipliers provide the DSP headroom for field-oriented control (FOC), space-vector PWM (SVPWM) and encoder decoding in real time, while the 331 user I/Os let designers connect quadrature encoders, multiple GPIO banks, and isolated digital I/O without external bus expanders. The industrial -40C to +125C temperature grade supports deployment in cabinets, on factory floors and inside motor housings. Cyclone III's low static power, enabled by the 65 nm process, reduces heat-sinking cost compared to older families such as Cyclone II, and Quartus Prime (or legacy Quartus II) integrates Qsys for rapid assembly of Nios II soft-core + DSP + peripheral subsystems.
Recommended
Video Processing and Image Pipeline
The EP3C40F484I7 is widely deployed in video processing bridges that convert camera or sensor data into display formats. Its 1.16 Mbit embedded block RAM (126 x M9K) supports line buffers for 720p and 1080p pipelines without external SRAM, and the LVDS-capable I/Os accept high-speed serializer-deserializer links from image sensors and HD-SDI receivers. The 472.5 MHz maximum clock rate gives designers comfortable timing margin for multi-tap video scaling, color-space conversion, and on-screen display compositing. Designers typically pair the FPGA with DDR/DDR2 SDRAM for frame buffering, using the dedicated DQS pins for source-synchronous capture. The 484-FBGA package exposes enough user I/O for parallel RGB, BT.656, and HDMI bridge companion chips simultaneously.
Recommended
Software-Defined Radio Baseband
For software-defined radio (SDR) baseband implementations, the EP3C40F484I7 offers an attractive cost-per-MAC ratio. The 126 DSP blocks deliver 18 x 18 multiplies ideal for FIR filters, FFT butterflies, digital down/up-converters, and channelization. LVDS and LVPECL input support enables direct connection to ADC and DAC companion chips such as the AD9248 or AD9779, while the high user-I/O count accommodates multi-channel data paths and external memory buses. Designers commonly implement polyphase filter banks and CORDIC NCOs entirely in fabric, with Nios II managing housekeeping and Ethernet MAC bridging. The 65 nm Cyclone III process keeps power low enough for portable man-pack SDR enclosures.
Recommended
Test and Measurement Front-End
The EP3C40F484I7 is a strong fit for test and measurement front-ends, where its high user-I/O count and fast PLLs drive timing-critical analog front ends. The four PLLs allow generation of multiple sample clocks for ADCs, DACs, and serializer/deserializer links, while the 39,600 logic elements accommodate protocol decoders for I2C, SPI, UART, JTAG, and proprietary bus analyzers. Designers can implement logic analyzers, protocol exercisers, and data loggers with on-chip FIFOs in M9K memory blocks. The industrial temperature grade enables bench and lab use plus outdoor field test deployments. JTAG-based configuration via the Altera USB-Blaster or Intel FPGA Download Cable simplifies firmware update workflows during validation cycles.
Recommended
Protocol Bridging and Interface Cards
The EP3C40F484I7 is used extensively in protocol bridging cards that translate between industrial buses such as PCI Express, Ethernet, USB, CAN, and proprietary LVDS links. Its 331 user I/Os accommodate multiple bus interfaces in parallel, while the embedded M9K blocks serve as packet FIFOs between PHY and MAC layers. Designers typically implement the Altera Triple-Speed Ethernet MAC, PCIe hard IP (where available), and a Nios II host processor alongside the user logic. The 484-FBGA footprint integrates comfortably on a 4-layer PCB with conventional trace widths. RoHS-compliant variants in the same package, such as EP3C40F484I7N, simplify cross-border shipping of finished products.
Recommended
Embedded Vision and Machine Learning Inference
The EP3C40F484I7 supports lightweight embedded vision and machine-learning inference at the edge, where its 126 DSP blocks can implement convolution engines for small CNNs and feature extractors. The 39,600 logic elements are sufficient to host a quantization-aware inference pipeline plus image pre-processing (resize, normalize, color conversion). The 1.16 Mbit embedded memory caches intermediate feature maps for kernel sizes up to 5 x 5 in tier-1 layers. For inference of more complex models, designers offload to external DDR2 memory and use the FPGA as a low-power pre-processor. The industrial temperature grade supports deployment in vehicle, factory, and outdoor-edge environments.
Recommended
Recommended Products Summary
Engineering reference data for EP3C40F484I7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3C40F484I7N | EP3C40F484C8N | EP3C40F484C8 | EP3C40F484C7N | EP3C40F484C6N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 484-pin FBGA | 484-pin FBGA (same) | 484-pin FBGA (same) | 484-pin FBGA (same) | 484-pin FBGA (same) | 484-pin FBGA (same) |
| Logic Elements | 39,600 LE | 39,600 LE (same) | 39,600 LE (same) | 39,600 LE (same) | 39,600 LE (same) | 39,600 LE (same) |
| Embedded Memory | 1,161,216 bits | 1,161,216 bits (same) | 1,161,216 bits (same) | 1,161,216 bits (same) | 1,161,216 bits (same) | 1,161,216 bits (same) |
| User I/O Count | 331 | 331 (same) | 331 (same) | 331 (same) | 331 (same) | 331 (same) |
| Operating Temperature | -40C to +125C (Industrial) | -40C to +125C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Speed Grade | 7 | 7 (same) | 8 (slightly slower) | 8 (slightly slower) | 7 (same) | 6 (slightly faster) |
| Lead-Free / RoHS | Yes (per chipdig datasheet) | Yes (N suffix) | Yes (N suffix) | No (non-N) | Yes (N suffix) | Yes (N suffix) |
Key Differentiators
- Industrial temperature grade at same footprint (vs EP3C40F484C8N)
- Lead-free / RoHS compliance marker (vs EP3C40F484C8 (non-N))
- Lower speed grade allows faster timing closure (vs EP3C40F484C8N)
Design Notes
The 484-FBGA package uses a fine-pitch ball array that demands 4 mil escape traces and microvia-in-pad stack-up on the top layer for signal break-out. Use 1 oz copper on outer layers plus 0.5 oz on inner layers for controlled-impedance routing; specify 100 ohm differential and 50 ohm single-ended impedance per the Cyclone III device handbook. Decoupling: place 0.1 uF and 0.01 uF ceramic capacitors every 25 balls around the FPGA plus bulk 10 uF tantalum or polymer caps at each VCCINT and VCCIO plane entry. Reference the Intel pin connection guidelines document before routing power and configuration pins.
Estimated: with all 39,600 LE active at a 472.5 MHz toggle rate and typical 0.13 mW/LE utilization, the static and dynamic core power can exceed 1.5 W plus I/O bank power. Use the Quartus Prime PowerPlay early power estimator (or legacy PowerPlay EPE) to size VCCINT regulators; for production designs, allow 30 percent headroom on the 1.2 V rail. Add a heatsink or thermal via array under the FBGA center thermal pad for industrial temperature designs; the package does not expose a large thermal slug, so copper-pour + vias is the primary heat path.
Do not power VCCIO before VCCINT or vice versa in reverse - this can cause permanent latch-up damage. Always strap MSEL[3..0] correctly for the chosen configuration mode (AS, PS, JTAG, Fast Passive Parallel). The JTAG chain should include the EPCS configuration flash so that re-programming via JTAG chains back to the FPGA after flash updates. Unused user I/O pins should be configured as outputs driving ground in the Quartus pin planner to avoid floating-input leakage. Finally, verify the device ID in the Quartus programmer matches the expected silicon revision before committing bitstreams to production.
LVDS traces require 100 ohm differential impedance with intra-pair skew under 20 mil and pair-to-pair skew under 50 mil. Use matched-length routing and avoid right-angle bends; instead use 45-degree bends or curves. For source-synchronous interfaces to DDR/DDR2 SDRAM, place the FPGA and memory on the same layer with the DQS signal routed matched to the data byte lane within 50 mil. Reference the Cyclone III device handbook chapter on high-speed I/O for termination and biasing recommendations specific to each I/O standard.
Compliance Information
Lead-free per chipdig.com datasheet. RoHS compliance inferred from lead-free marking; no formal AEC-Q100 automotive qualification since this is an industrial-grade Cyclone III FPGA. Reach, halogen-free and conflict-minerals status not present in verified web data and set to unknown.
