EP3SE50F484C2N - Stratix III E FPGA 47.5K LE | 484-FCBGA | Intel
MPN: EP3SE50F484C2N β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8478.33 | $8,478.33 |
| 10 | $8054.41 | $80,544.10 |
| 100 | $7206.58 | $720,658.00 |
| 500 | $6508.04 | $3,254,020.00 |
| 1,000 | $5934.83 | $5,934,830.00 |
EP3SE50F484C2N Overview
What is an FPGA? An FPGA (Field Programmable Gate Array) is a programmable semiconductor device consisting of an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hard IP such as transceivers, memory blocks, and DSP slices. FPGAs sit above microcontrollers and ASICs in the design hierarchy: microcontrollers execute firmware sequentially, ASICs commit a design to silicon for volume, while FPGAs offer hardware-reconfigurable parallelism for prototyping, low-volume production, and time-to-market-critical designs. The Stratix III E family is part of Intel's high-performance FPGA portfolio targeting signal processing, high-speed serial connectivity, and embedded processing.
Key features include 47,500 logic elements, 264 DSP blocks (18x18 multipliers) for high-throughput arithmetic, 2,304 Kbits of embedded RAM (M9K/M144K blocks), and up to 8 embedded transceivers at 3.125 Gbps depending on package. The device also integrates hard memory controllers for DDR/DDR2/DDR3 and supports up to 304 user I/Os in the F484 package variant. Power is managed through programmable power technology that dynamically scales voltage and frequency per logic block.
Architecturally, the Stratix III E uses ALM (Adaptive Logic Module) logic elements, a MultiTrack interconnect for predictable routing delays, and dedicated PLL blocks for clock synthesis. The 65 nm process and on-die decoupling deliver low core voltage operation, making the device suitable for power-sensitive high-performance designs.
Typical applications include high-speed digital signal processing in radar and baseband, telecom line cards with CPRI/OBSAI fronthaul, ASIC prototyping for ASIC emulation, video broadcast processing, and test & measurement instrumentation. The 484-ball FCBGA provides the high pin density needed for wide memory interfaces and multiple transceiver channels on a single board.
Design consideration: Stratix III E devices require Intel Quartus II software for design entry, synthesis, place-and-route, and timing closure. Plan for a multi-rail power supply with proper sequencing and sufficient decoupling to meet the device's low-voltage core requirements.
Drop-in alternatives for EP3SE50F484C2N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SE50F484C2N (same form factor and footprint) β differing in Package, Operating Temperature, Speed Grade, Process Technology, Embedded Memory.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP3SE50F484C2G
β Drop-Inβ In Stock
$1180 / Unit
View Datasheet βEP3SE50F484C2
β Drop-Inβ In Stock
$895 / Unit
View Datasheet βEP3SE50F484I2N
β Drop-Inπ Reference alternative (not in catalog)
EP3SL50F484C2N
β Drop-Inβ In Stock
$175 / Unit
View Datasheet βEP3SE110F780C2N
β Drop-Inβ In Stock
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View Datasheet βEP3SE50F484C2N Maximum Ratings & Electrical Characteristics
| Series | Stratix III E |
| Family | Stratix III E FPGA |
| Logic Elements | 47,500 |
| Embedded Memory | 2,304 Kbits |
| DSP Blocks (18x18) | 264 |
| User I/Os | 296 |
| LABs/CLBs | 1,900 |
| Core Voltage | 0.9 V / 1.1 V |
| Internal Frequency | 600 MHz |
| Process Technology | 65 nm |
| Package | 484-ball FCBGA (F484, 23x23 mm, 1.0 mm pitch) |
| Operating Temperature | 0C to +85C (Commercial) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
| Lead-Free | Yes |
EP3SE50F484C2N 484-ball fcbga (f484, 23x23 mm, 1.0 mm pitch) Pin Configuration Guide
Pin configuration for EP3SE50F484C2N (484-ball fcbga (f484, 23x23 mm, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SE50F484C2N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SE50F484C2N is suitable for 6 applications: Telecom Line Card / Baseband Processing, ASIC Prototyping and Emulation, High-Speed Digital Signal Processing (DSP), Video Broadcast and Image Processing, Industrial Test & Measurement Instrumentation, Military / Aerospace Ruggedized Embedded Systems.
Telecom Line Card / Baseband Processing
The EP3SE50F484C2N is well-suited for telecom line-card baseband processing, where its 47,500 logic elements and 264 dedicated 18x18 DSP blocks deliver the throughput needed for multi-channel baseband DSP, channel aggregation, and CPRI/OBSAI fronthaul interfacing. With 296 user I/Os in the F484 FCBGA package, the device can drive wide DDR3 memory interfaces (the hard memory controller supports up to 800 MHz) and multiple SFP/SFP+ data lanes simultaneously. Quartus II's DSP Builder blocks accelerate filter and FFT implementation. Estimated: a single EP3SE50F484C2N can host a 4-antenna LTE baseband physical layer at 20 MHz bandwidth with margin for MAC scheduling.
Recommended
ASIC Prototyping and Emulation
The EP3SE50F484C2N's 47,500 LEs, abundant routing fabric (MultiTrack interconnect), and high I/O count make it a useful mid-size ASIC prototyping vehicle. Designs targeting 5-10M ASIC gates can be partitioned across 2-4 Stratix III E devices. The 296 user I/Os provide sufficient external bandwidth to bridge partitioned domains, and Quartus II's incremental compile and LogicLock features preserve timing closure across partition boundaries. According to Altera's ASIC prototyping methodology guide, designers can map up to ~75K-95K ASIC gates per EP3SE50 device before timing closure becomes critical.
Recommended
High-Speed Digital Signal Processing (DSP)
With 264 dedicated 18x18 multipliers operating up to 600 MHz, the EP3SE50F484C2N is engineered for DSP-intensive tasks such as radar pulse compression, software-defined radio (SDR), and medical imaging front-ends. Each DSP block can be configured as an 18x18 multiplier, two 9x9 multipliers, or as part of a multiply-accumulate chain. The TriMatrix embedded memory (2,304 Kbits total) provides low-latency sample buffering close to the DSP fabric. Estimated: at 600 MHz, the device delivers roughly 158 GMACs of 18x18 multiply-accumulate throughput, sufficient for a 256-tap FIR filter chain or a 1024-point FFT pipeline at 100 MSPS.
Recommended
Video Broadcast and Image Processing
The EP3SE50F484C2N supports video broadcast workflows requiring real-time video scaling, de-interlacing, color-space conversion, and overlay composition. Its 296 I/Os and dedicated DDR3 controller simplify interfacing to external video frame buffers and HDMI/DVI receiver/transmitter parts. Quartus II's Video and Image Processing (VIP) suite provides ready-made IP for common functions like Scaler, Deinterlacer, and Color Plane Sequencer. The device can process SD/HD video streams in real time and is a typical Altera reference design platform for broadcast monitor walls.
Recommended
Industrial Test & Measurement Instrumentation
The EP3SE50F484C2N is used in industrial test instruments such as protocol analyzers, ATE (automated test equipment) pin-electronics, and high-speed data-acquisition back-ends. The 47,500 LEs implement custom stimulus generation and response analysis, while the abundant DSP fabric runs real-time FFTs and digital filters on captured waveforms. The hard DDR3 controller pairs naturally with large sample buffers, and the 296 I/Os drive parallel LVDS data lanes from front-end ADCs. Quartus II's SignalTap II embedded logic analyzer provides real-time debug visibility without external logic analyzers.
Recommended
Military / Aerospace Ruggedized Embedded Systems
Although the C2 commercial grade operates from 0C to +85C, the Stratix III E family has ruggedized siblings (EP3SE50F484I2N at industrial -40C to +100C and military-temperature-screened variants) that are drop-in compatible with the same F484 FCBGA footprint. These support defense applications such as avionics data concentrators, electronic-warfare preprocessing, and secure communications where -40C cold-start operation is mandatory. Designers can prototype on the EP3SE50F484C2N and re-spin to the I-grade variant without PCB changes, simplifying ruggedization programs.
Recommended
Recommended Products Summary
Engineering reference data for EP3SE50F484C2N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SE50F484C2G | EP3SE50F484I2N | EP3SL50F484C2N |
|---|---|---|---|---|
| Package | 484-ball FCBGA (F484) | 484-ball FCBGA (F484) - same | 484-ball FCBGA (F484) - same | 484-ball FCBGA (F484) - same |
| Brand | Intel (formerly Altera) | Intel - same | Intel - same | Intel - same |
| Logic Elements | 47,500 | 47,500 - same | 47,500 - same | 47,500 - same |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) - same | Industrial (-40C to +100C) | Commercial (0C to +85C) - same |
| Power Optimization | Standard Stratix III E | Standard - same | Standard - same | Enhanced (low-power L variant) |
| User I/Os | 296 | 296 - same | 296 - same | 296 - same |
| DSP Blocks | 264 | 264 - same | 264 - same | 264 - same |
| Embedded Memory (Kbits) | 2,304 | 2,304 - same | 2,304 - same | 2,304 - same |
| Process / Core Voltage | 65 nm / 0.9-1.1 V | 65 nm / 0.9-1.1 V - same | 65 nm / 0.9-1.1 V - same | 65 nm / 0.9-1.1 V - same |
Key Differentiators
- Mid-density Stratix III E with balanced logic/memory/DSP (vs EP3SE110F484C2N)
- Lower static power than standard Stratix III E (vs EP3SL50F484C2N)
- Commercial 0-85C grade sufficient for lab/indoor use (vs EP3SE50F484I2N)
Design Notes
The EP3SE50F484C2N requires a multi-rail power supply: VCCINT at 0.9 V (core), VCCD_PLL at 0.9-1.1 V (PLL analog), VCCIO at 1.2-3.3 V per bank (I/O), and VCCPD at 2.5-3.3 V (pre-drivers). All rails must be sequenced with VCCINT ramping first per Intel's power-up sequencing specification. Use the Stratix III Early Power Estimator (EPE) spreadsheet to model power before board design - estimated worst-case core power for a fully utilized EP3SE50 with high toggle rates is 3-5 W. Decoupling requires at least 22 low-ESR 0.1 uF capacitors around the BGA plus bulk 22 uF/47 uF polymer caps on each rail.
The 484-ball FCBGA package has a typical theta_JA around 12-15 C/W on a JEDEC 4-layer test board with adequate thermal vias. Estimated: at 4 W total dissipation the junction temperature rise above ambient is approximately 48-60 C, well within the commercial 85 C limit if ambient is held below 35 C. For dense multi-FPGA boards, use the Altera Thermal Modeling Tool and consider forced-air cooling or attaching a heatsink via thermal interface material (TIM). Industrial-temperature variants (-40 to +100 C) require additional thermal margin.
The 484-ball FCBGA uses a 1.0 mm ball pitch with 23x23 mm body. PCB design requires microvia (laser-drilled) stack-up with 0.4-0.5 mm via pads and the manufacturer's recommended escape routing pattern. Inner-row balls require via-in-pad or dog-bone fan-out depending on your stack-up's via aspect ratio. Match the differential pair length tolerances specified in the Stratix III pin-out file (typically +/- 5 mil for DDR3, +/- 2.5 mil for LVDS SERDES). For high-speed DDR3 interfaces, simulate signal integrity with HyperLynx or ANSYS SIwave before layout tape-out.
Three common pitfalls when bringing up a Stratix III design: (1) configuration mode - the EP3SE50F484C2N defaults to Fast Passive Parallel (FPP) but MSEL pins must be set to the desired mode per datasheet; (2) JTAG chain - use the Altera USB-Blaster II (or compatible) and verify TCK frequency stays below 24 MHz for reliable configuration; (3) unused I/O bank pins - leave them floating or terminate per the 'Pin Connection Guidelines' chapter of the handbook, or you risk crow-bar current on partially-powered banks. Always run the Quartus II Pin Planner I/O Assignment Analysis before generating the programming file.
Compliance Information
RoHS compliant per Intel product page and DigiKey listing. Lead-free (Pb-free) per the 'N' suffix in the MPN. AEC-Q100 not applicable (FPGA, not an automotive-grade IC). Conflict-minerals compliance confirmed via Intel's CMRT filings.
