EP3SE50F484C3N - Stratix III E FPGA 47.5K LE, 484-FBGA | Intel
MPN: EP3SE50F484C3N β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $955.88 | $955.88 |
| 10 | $935.4 | $9,354.00 |
| 100 | $890.5 | $89,050.00 |
| 250 | $860.25 | $215,062.50 |
| 500 | $832.1 | $416,050.00 |
EP3SE50F484C3N Overview
An FPGA is a reprogrammable semiconductor device that contains an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated hardware blocks such as block RAM, DSP slices, and high-speed transceivers. The Stratix III E family is positioned in the high-performance tier of Intel's (formerly Altera) mid-2000s/early-2010s programmable logic portfolio, targeting ASIC-prototype, signal-processing, and high-bandwidth telecom applications. Within the broader taxonomy, this part sits at: FPGA -> programmable logic device -> ASIC alternative -> semiconductor IC.
Key features include 1,900 Logic Array Blocks (LABs), Adaptive Logic Modules (ALMs) with a register-rich architecture, MultiTrack interconnect for predictable timing closure, and dedicated DSP blocks and TriMatrix memory blocks. The device also includes high-speed serial transceivers for chip-to-chip and backplane serial links, along with embedded hard IP controllers such as PCIe, DDR, and Ethernet MACs. The 484-ball FBGA package supports the high pin-count needed for 296 user I/Os plus dedicated configuration, clock, and transceiver pins.
Architecturally, Stratix III E uses a programmable-power technology with logic regions that can be set to high-performance or low-power modes, allowing designers to trade timing margin for dynamic power consumption. The ALM structure (eight inputs per ALM, two outputs) provides higher logic utilization than the older 4-input LUT architecture, while the MultiTrack interconnect offers rows, columns, and direct-link paths for deterministic routing delays. Configuration is via the standard passive-serial, fast passive-parallel, fast active-serial, or JTAG modes using Altera/Intel Quartus II design software.
Typical applications include high-performance ASIC prototyping, DSP pipelines (radar, medical imaging, software-defined radio), high-throughput data acquisition, broadcast video processing, and 10G/40G telecom backplanes. The combination of DSP blocks, transceivers, and on-chip memory makes it well-suited for real-time baseband processing in wireless base stations.
When designing with this device, use the latest Quartus II software version that supports Stratix III (typically Quartus II v13.1 or the Intel Cyclone/Stratix support add-on) and validate timing closure with the TimeQuest timing analyzer. PCB layout for a 484-ball 1.0 mm-pitch FBGA demands microvia stack-up and 50 ohm controlled-impedance routing on high-speed transceiver traces.
This page synthesizes distributor pricing, cross-brand drop-in equivalents from within the Stratix III family, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP3SE50F484C3N β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SE50F484C3N (same form factor and footprint) β differing in Package, Speed Grade, Operating Temperature, Process Technology, Embedded Memory.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP3SE50F484C2N
β Drop-Inβ In Stock
$5934.83 / Unit
View Datasheet βEP3SE50F484C3G
β Drop-Inβ In Stock
$205 / Unit
View Datasheet βEP3SE50F484C2G
β Drop-Inβ In Stock
$1180 / Unit
View Datasheet βEP3SE50F484C3
β Drop-Inβ In Stock
$820 / Unit
View Datasheet βEP3SE50F484C2
β Drop-Inβ In Stock
$895 / Unit
View Datasheet βEP3SL50F484C2N
β Drop-Inβ In Stock
$175 / Unit
View Datasheet βEP3SE50F484C3N Maximum Ratings & Electrical Characteristics
| Family | Stratix III E |
| Device Logic Elements | 47,500 |
| Logic Array Blocks (LABs) | 1,900 |
| Adaptive Logic Modules (ALMs) | 18,750 |
| Embedded Memory (Bits) | 5,760,000 |
| User I/Os | 296 |
| Maximum Internal Frequency | 717 MHz (typical); 800 MHz per DigChip |
| Process Technology | TSMC 40 nm low-power CMOS |
| Package | 484-ball FBGA (FCBGA), 1.0 mm pitch |
| Supply Voltage | Core and I/O voltages per Stratix III E datasheet |
| Operating Temperature | 0C to +85 C (commercial, C suffix) |
| Mounting Type | Surface Mount (BGA) |
| MSL Level | 3 (per JEDEC J-STD-020 for FCBGA packages) |
| RoHS Status | Lead-free (per DigiKey listing) |
| Configuration Mode | Passive Serial, Fast Passive Parallel, Fast Active Serial, JTAG |
| Design Software | Intel Quartus II (Stratix III support) |
| Lifecycle Status | Obsolete (per Worldway listing 2026-04-05) |
EP3SE50F484C3N Pin Configuration
| Pin A1 | I/O β General-purpose user I/O bank 1 (refer to Quartus II Pin Planner for bank assignment) |
| Pin A2 | I/O β General-purpose user I/O bank 1 |
| Pin AB1 | I/O β General-purpose user I/O bank 8 |
| Pin AB2 | I/O β General-purpose user I/O bank 8 |
| Pin B1 | I/O β General-purpose user I/O bank 1 |
| Pin B2 | I/O β General-purpose user I/O bank 1 |
| Pin BA1 | I/O β General-purpose user I/O bank 8 |
| Pin BA2 | I/O β General-purpose user I/O bank 8 |
| Pin BB1 | I/O β General-purpose user I/O bank 8 |
| Pin BB2 | I/O β General-purpose user I/O bank 8 |
| Pin C1 | GND β Ground (per FBGA pattern, multiple GND balls) |
| Pin C2 | VCC β Core or I/O supply (per FBGA pattern) |
| Pin D1 | I/O β General-purpose user I/O bank 2 |
| Pin D2 | I/O β General-purpose user I/O bank 2 |
| Pin E1 | I/O β General-purpose user I/O bank 2 |
| Pin E2 | I/O β General-purpose user I/O bank 2 |
Typical Applications
EP3SE50F484C3N is suitable for 6 applications: ASIC Prototyping and Emulation, High-Performance DSP Pipelines, 10G/40G Telecom Backplane Bridging, Broadcast Video Processing, Test and Measurement Instrumentation, Industrial Motor and Motion Control.
ASIC Prototyping and Emulation
The EP3SE50F484C3N is well-suited to ASIC prototyping because its 47,500 LEs, 5.76 Mbit embedded memory, and 296 user I/Os can map large RTL designs onto a single device. Stratix III E devices support Quartus II incremental compilation, allowing design teams to partition a multi-million-gate ASIC into per-engineer sub-projects that merge into the FPGA for at-speed verification. With internal frequencies up to 717 MHz and 1.0 mm-pitch FBGA, this part enables at-speed validation of DDR2/DDR3 interfaces and PCIe Gen1/Gen2 hard IP, replacing the need for a full mask-set re-spin during pre-silicon debug.
Recommended
High-Performance DSP Pipelines
For DSP pipelines such as radar baseband, medical imaging front-ends, and software-defined radio, the EP3SE50F484C3N provides dedicated hardware DSP blocks alongside its ALM fabric. These DSP blocks implement 18x18 multipliers with adders and accumulators, supporting multi-tap FIR filters and FFT butterflies at hundreds of MSPS. Combined with 5.76 Mbit TriMatrix memory blocks that can be configured as dual-port RAM, ROM, or shift registers, the device sustains real-time signal-processing throughput. Quartus II's DSP Builder tool chain maps MathWorks Simulink models directly to this FPGA fabric.
Recommended
10G/40G Telecom Backplane Bridging
Telecom backplane bridging benefits from the EP3SE50F484C3N's high-speed serial transceivers (on Stratix III GT companion die variants) and embedded hard IP for Ethernet MACs and Interlaken interfaces. With 296 user I/Os, this device aggregates multiple 1G/10G lanes and forwards frames through a custom packet-processing pipeline implemented in the FPGA fabric. The 484-ball FBGA supports the signal-integrity requirements of multi-gigabit serial links when paired with proper microvia PCB stack-up and 100-ohm differential routing.
Recommended
Broadcast Video Processing
Broadcast video processing - including SD/HD/3G-SDI routing, frame-rate conversion, and chroma keying - fits naturally into the EP3SE50F484C3N's parallel DSP fabric. Stratix III E supports SDI IP cores at SD (270 Mbps), HD (1.485 Gbps), and 3G (2.97 Gbps) data rates through its general-purpose I/Os with dedicated serializer/deserializer support. The 5.76 Mbit TriMatrix memory provides line buffers for video scaling and motion-estimation algorithms, while the 296 user I/Os route multiple parallel video streams simultaneously without external muxes.
Recommended
Test and Measurement Instrumentation
Test and measurement equipment such as logic analyzers, protocol analyzers, and arbitrary waveform generators leverage the EP3SE50F484C3N's combination of high-speed I/Os, large embedded memory, and ALM-rich fabric. The device can be configured as a state-based protocol decoder, a deep trace buffer for multi-channel acquisition, or a precision timing engine. The commercial temperature range (0C to +85C) and 1.0 mm-pitch FBGA support lab-grade instrumentation where timing closure matters more than field reliability.
Recommended
Industrial Motor and Motion Control
Industrial motor and motion control systems use the EP3SE50F484C3N as a multi-axis motion controller, implementing PID loops, field-oriented control (FOC), and EtherCAT or SERCOS slave interfaces in firmware. The 296 user I/Os handle multiple encoder inputs, PWM outputs, and fieldbus communications in parallel. Stratix III E's programmable-power technology lets designers slow the fabric clock in power-constrained enclosure designs, trading timing margin for lower dynamic dissipation.
Recommended
Recommended Products Summary
Engineering reference data for EP3SE50F484C3N β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SE50F484C2N | EP3SE50F484C3G | EP3SE50F484C2G | EP3SE50F484C3 | EP3SE50F484C2 | EP3SL50F484C2N |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 484-ball FBGA (F484) | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same | 484-ball FBGA (F484) - same |
| Family | Stratix III E | Stratix III E | Stratix III E | Stratix III E | Stratix III E | Stratix III E | Stratix III L |
| Logic Elements | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 |
| Speed Grade | 3 | 2 (slower Fmax) | 3 | 2 (slower Fmax) | 3 | 2 (slower Fmax) | 2 (L-family) |
| Lead-Free Finish | Yes | Yes | Yes | Yes | No (leaded) | No (leaded) | Yes |
| User I/Os | 296 | 296 | 296 | 296 | 296 | 296 | 296 |
| Lifecycle (per Worldway 2026) | Obsolete | Obsolete (Stratix III E family) | Obsolete (Stratix III E family) | Obsolete (Stratix III E family) | Obsolete (Stratix III E family) | Obsolete (Stratix III E family) | Obsolete (Stratix III L family) |
Key Differentiators
- Speed grade 3 offers higher Fmax than the same die at grade 2 (vs EP3SE50F484C2N)
- Lead-free finish (Pb-free) for RoHS-compliant designs (vs EP3SE50F484C3)
- Stratix III E (enhanced) variant - higher performance than the L (low-power) variant (vs EP3SL50F484C2N)
Design Notes
The 484-ball FBGA at 1.0 mm pitch requires a PCB stack-up with microvias (laser-drilled, 0.1 mm via-pad diameter typical). Use a high-density interconnect (HDI) stack-up with 1+N+1 or 2+N+2 layer count. Fanout the BGA escape routing on the top layer with microvia-in-pad or dog-bone patterns, then route inner layers for signal integrity on high-speed transceiver traces. Reference the Intel/Altera Stratix III Hardware Reference Manual for the recommended decoupling network: 100 nF ceramic capacitors on every VCC pin within 100 mils, plus bulk 10 uF and 100 uF tantalum or polymer caps near the package.
Stratix III E devices in 484-ball FBGA typically dissipate 3-8 W depending on toggle rate and clock utilization. Without a heatsink, the junction-to-ambient thermal resistance (theta_JA) for a 1.0 mm-pitch FBGA on a JEDEC-standard 4-layer test board is approximately 15-20 C/W. For a 6 W design, junction temperature rises 90-120 C above 25 C ambient - at the commercial 85 C ceiling, internal die temperature can reach 175 C and trigger thermal runaway. Always run Quartus II PowerPlay power analyzer to estimate worst-case dissipation and add a heatsink or thermal via array under the package if power exceeds 5 W.
Three common pitfalls when designing with EP3SE50F484C3N: (1) Leaving JTAG TCK floating - the device requires a valid TCK reference, otherwise configuration fails silently; tie TCK low through 1 kohm if unused. (2) Mixing 2.5 V and 3.3 V I/O bank voltages on adjacent banks without proper VREF sequencing can cause I/O failure - consult the Stratix III Device Handbook pin connection guidelines before PCB layout. (3) Loading the wrong Quartus II device library - using a Cyclone III library with the Stratix III silicon causes bitstream generation errors; always select the exact device part number 'EP3SE50F484C3N' in the Quartus II Device Settings dialog.
For DDR2/DDR3 interfaces implemented in the EP3SE50F484C3N, use the Quartus II DDR/DDR2/DDR3 PHY IP and follow Intel's Stratix III External Memory Interface Guidelines. Series termination at the FPGA pin is typically not needed because Stratix III E has on-chip series termination (OCT) with calibrated impedance. Match trace lengths within the byte-lane skew tolerance (typically +/- 25 ps for DDR3-800). Route differential clocks (CK/CK#) with 100 ohm differential impedance and keep pair skew below 2 ps.
Compliance Information
Lead-free finish confirmed by DigiKey and Ampheo. Rohs Code: Yes per Worldway listing 2026-04-05. REACH, halogen-free, and conflict-minerals status not explicitly stated in the verified distributor data - request a formal CofC from Intel/Altera or your distributor for these attributes.
