EP3SE50F484C4LG - Stratix III E FPGA 47.5K LE | Intel | 484-FCBGA
MPN: EP3SE50F484C4LG ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $462 | $462.00 |
| 10 | $438.9 | $4,389.00 |
| 100 | $416.1 | $41,610.00 |
| 250 | $393.4 | $98,350.00 |
| 500 | $370.6 | $185,300.00 |
EP3SE50F484C4LG Overview
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs/ALMs) connected by a programmable interconnect fabric, allowing hardware designers to program arbitrary digital logic, memory, and DSP functions after manufacture. FPGAs sit within the broader taxonomy: programmable logic device (PLD) → FPGA → high-end SRAM-based FPGA → DSP-optimized FPGA. Stratix III E parts are positioned above the Cyclone family for cost-optimized designs and below the Stratix V family for newer 28 nm designs, making them the workhorse mid-range DSP FPGA of the late-2000s generation.
Key specifications include 19,000 ALMs, 47,500 LEs, 5.49 Mbits total embedded memory, 384 18x18-bit hardware multipliers, 4 PLLs, and a maximum user I/O count of 296. The device operates from a 1.1 V core supply, supports I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL, and offers a -4 speed grade with the C4 commercial temperature grade (0°C to +85°C). The L suffix indicates a lead-free, RoHS-compliant package finish.
Architecturally, the Stratix III E family leverages a programmable-power technology that allows unused logic and interconnect to enter a low-power state, dramatically reducing static power compared with prior Stratix II designs. The combination of high memory-to-logic ratio and abundant dedicated multipliers makes it well-suited to video processing, software-defined radio, and high-speed instrumentation where parallel DSP pipelines are required.
Typical applications include wireline telecom baseband processing, software-defined radio (SDR) baseband, video broadcast encoding/decoding, high-speed serial protocol bridging, ASIC prototyping, and high-performance computing accelerators. Designers targeting Stratix III typically pair the device with external DDR2/DDR3 memory controllers and high-speed LVDS links for data acquisition.
When designing with the EP3SE50F484C4LG, plan for an Altera/Intel Quartus II design-flow license (version 11.0 or later), use the FCBGA-484 land pattern from the package specification document, and provide a minimum of 8-layer PCB stackup with continuous ground planes under the BGA to manage simultaneous-switching-noise (SSN) on the 296 I/O pins.
This page synthesizes distributor pricing, same-brand drop-in speed/temperature/package alternatives, and practical PCB-thermal-design notes not found on a single manufacturer datasheet page.
Drop-in alternatives for EP3SE50F484C4LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SE50F484C4LG (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, RoHS Status, Embedded Memory.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SE50F484C4L
✅ Drop-In✓ In Stock
$1020 / Unit
View Datasheet →EP3SE50F484C4G
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →EP3SE50F484C4
✅ Drop-In✓ In Stock
$215 / Unit
View Datasheet →EP3SE50F484C3N
✅ Drop-In✓ In Stock
$832.1 / Unit
View Datasheet →EP3SE50F484C3G
✅ Drop-In✓ In Stock
$205 / Unit
View Datasheet →EP3SE50F484C4LG Maximum Ratings & Electrical Characteristics
| Family | Stratix® III E |
| Logic Elements | 47,500 LE |
| Adaptive Logic Modules (ALMs) | 19,000 ALM |
| Embedded Memory | 5.49 Mbit (2,886 Kbit M9K + M144K blocks) |
| Maximum User I/O | 296 |
| Hardware Multipliers (18x18) | 384 |
| PLLs | 4 |
| Operating Supply Voltage (Core) | 1.1 V |
| Operating Temperature Range | 0°C to +85°C (Commercial) |
| Speed Grade | -4 |
| Package | 484-Ball FCBGA, 23 x 23 mm |
| Mounting Type | Surface Mount |
| Process Node | 40 nm TSMC |
| Lead-Free / RoHS | Yes (lead-free finish, RoHS compliant) |
| MSL Level | 3 (per JEDEC J-STD-020) |
| Design Software | Quartus II 11.0 or later |
EP3SE50F484C4LG 484-ball fcbga, 23 x 23 mm Pin Configuration Guide
Pin configuration for EP3SE50F484C4LG (484-ball fcbga, 23 x 23 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SE50F484C4LG.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SE50F484C4LG is suitable for 6 applications: Software-Defined Radio Baseband, Video Broadcast Encoding/Decoding, ASIC Prototyping Platform, High-Speed Data Acquisition, Wireline Telecom Baseband, Industrial High-Performance Computing Accelerator.
Software-Defined Radio Baseband
The EP3SE50F484C4LG fits SDR baseband processing because it integrates 384 dedicated 18x18 hardware multipliers and 5.49 Mbits of embedded block RAM, which directly map to the FFT, channelization, and digital down-conversion (DDC) blocks required in a software-radio baseband. The 47,500 LEs accommodate the wide digital filter and demodulator datapaths, while 4 PLLs generate the multiple sample-clock domains (typically 122.88 MHz for LTE, 245.76 MHz for 5G NR fronthaul) with low jitter. In a typical LTE small-cell design, the FPGA sits between a wideband ADC (e.g., AD9680) and a backhaul modem, performing the sample-rate conversion, FFT, and resource-element demapping in real time. Compared with a DSP+ASIC partition, the single-chip FPGA approach reduces BOM and allows late-binding protocol upgrades.
Recommended
Video Broadcast Encoding/Decoding
Broadcast video encoder/decoder designs use the EP3SE50F484C4LG because its 47,500 LEs and 384 18x18 multipliers deliver enough parallelism to process 4:2:2 10-bit H.264/AVC or JPEG2000 compression pipelines at 3G-SDI rates (2.97 Gbps). The 5.49 Mbit embedded block RAM serves as line buffers for motion-estimation and deblocking filters, eliminating external SRAM in many designs and reducing PCB complexity. The 296 user I/Os support multiple parallel SDI input ports, while the 4 PLLs provide the multiple video clocks (148.5 MHz, 74.25 MHz, 27 MHz) with deterministic phase alignment. Compared with ASIC implementations, an FPGA solution lets broadcasters ship firmware upgrades for new codec profiles (e.g., HEVC) without re-spinning hardware.
Recommended
ASIC Prototyping Platform
ASIC prototyping is a classic Stratix III E use case: the EP3SE50F484C4LG provides enough logic capacity (47,500 LEs) and routing headroom (Stratix III fabric is widely regarded as one of the easier families to map ASIC RTL onto) for emulating SoC designs targeting 5M-10M ASIC gates. The 5.49 Mbit embedded memory approximates on-chip SRAM, while the 296 user I/Os allow partitioning large ASIC nets across multiple FPGAs with abundant inter-chip LVDS links. Quartus II's TimeQuest closure flow and Chip Planner tool make it straightforward to debug timing and routing congestion. Compared with ASIC tapeout, FPGA prototyping enables software bring-up, IP validation, and benchmark runs at MHz speeds weeks before silicon is available, dramatically reducing risk and time-to-market.
Recommended
High-Speed Data Acquisition
The EP3SE50F484C4LG is well-suited for high-speed data acquisition (DAQ) front-ends because it can ingest multiple parallel LVDS streams from ADCs (e.g., 16-bit 250 MSPS AD9268) into its 296 user I/Os, run real-time digital down-conversion or polyphase filtering in its 384 18x18 multipliers, and buffer burst samples in its 5.49 Mbit block RAM before DMA to host. The 4 PLLs provide the multiple sample-clock domains typical of multi-channel oscilloscope or radar front-ends, with deterministic jitter of well under 100 ps. Compared with a DSP+ASIC, the FPGA approach keeps the DAQ vendor's firmware updatable for new trigger modes and post-processing algorithms, and the high I/O count enables integration of front-panel digital I/O on the same device.
Recommended
Wireline Telecom Baseband
Wireline telecom systems use the EP3SE50F484C4LG for cross-connect, framer, and packet-processing line cards where high logic density (47,500 LEs) and abundant memory bandwidth (5.49 Mbit block RAM) are required. The FPGA implements HDLC/PPP framing, Reed-Solomon FEC, and traffic-management queuing at line-speed, then hands off to a network processor or ASIC for the forwarding plane. The 296 user I/Os provide ample parallel LVDS lanes for backplane interconnect, while 4 PLLs deliver the multiple clock domains typical of a 10G/40G line card. Compared with ASIC line-card solutions, an FPGA approach allows the equipment vendor to add new features (e.g., OTU4 encapsulation) via firmware, with Quartus II enabling incremental compile for fast turnaround.
Recommended
Industrial High-Performance Computing Accelerator
Industrial high-performance computing (HPC) accelerator cards use the EP3SE50F484C4LG as a co-processor for parallel kernels such as real-time FFT, finite-difference time-domain (FDTD), or CFD. The 384 18x18 multipliers execute SIMD-style signal-processing kernels at clock rates up to 300 MHz, while the 5.49 Mbit block RAM stores intermediate vectors. The 47,500 LEs accommodate the surrounding control logic, scatter-gather DMA engines, and PCIe transaction layers. In a typical deployment, the FPGA is paired with a host CPU over PCIe Gen1/Gen2 and receives kernel-launch and data-block descriptors via the host driver. Compared with a GPU, an FPGA accelerator offers lower latency per kernel (no CUDA driver overhead) and deterministic execution, which is critical for real-time industrial control loops.
Recommended
Recommended Products Summary
Engineering reference data for EP3SE50F484C4LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SE50F484C4L | EP3SE50F484C4G | EP3SE50F484C4 | EP3SE50F484C3N | EP3SE50F484C3G |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 484-FCBGA (23x23 mm) | 484-FCBGA (23x23 mm) - same | 484-FCBGA (23x23 mm) - same | 484-FCBGA (23x23 mm) - same | 484-FCBGA (23x23 mm) - same | 484-FCBGA (23x23 mm) - same |
| Logic Elements | 47,500 LE | 47,500 LE | 47,500 LE | 47,500 LE | 47,500 LE | 47,500 LE |
| Speed Grade | -4 | -4 | -4 | -4 | -3 (faster) | -3 (faster) |
| Temperature Grade | Commercial (0 to +85 C) | Commercial (0 to +85 C) | Commercial (0 to +85 C) | Commercial (0 to +85 C) | Commercial (0 to +85 C) | Commercial (0 to +85 C) |
| Lead-Free / RoHS | Yes (L suffix, lead-free finish) | Yes (L suffix) | Yes (L suffix) | No (no L suffix) | No (no L suffix) | Yes (L suffix) |
| Packing | Tray (G suffix) | Tray (no G) | Tape & Reel (G) | Tray | Tray | Tape & Reel (G) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Packing option specifically for tray-based production line-card build (vs EP3SE50F484C4L (tray) vs EP3SE50F484C4G (tape-and-reel))
- Speed grade -4 is the lowest-power, lowest-cost tier for typical DSP pipelines (vs EP3SE50F484C4LG (-4) vs EP3SE50F484C3N (-3))
- Lead-free RoHS-compliant terminal finish (vs EP3SE50F484C4LG (lead-free) vs EP3SE50F484C4 (non-lead-free))
Design Notes
Use a minimum 8-layer PCB stackup with continuous VCC (1.1 V core) and GND planes directly under the 484-FCBGA device. Assign one plane layer entirely to GND and another entirely to VCC, with 4 signal layers above the GND plane. Microvia / stacked-via construction is strongly recommended for inner-row balls; dog-bone fanout on 0.5 mm pitch is feasible on 4-mil core/laser-drilled 0.1 mm vias. Decoupling follows Intel Stratix III PDN: 0.1 uF X7R 0402 within 100 mils of every VCC/VCCPT/VCCAUX/VCCIO ball pair, plus 10 uF X5R 0805 per power pin pair and 22 uF/47 uF bulk per supply rail.
The 484-FCBGA package has a theta_JA of approximately 11 C/W with a 4-layer JEDEC test board and 1 m/s airflow, but at worst-case commercial ambient 85 C with full fabric utilization the device can dissipate 5-8 W. Provide a minimum 6 sq cm of unbroken copper under the exposed die pad on top and bottom layers, stitched with 0.3 mm thermal vias (24-mil drill, 12-mil copper) at 1.2 mm pitch. For chassis with no airflow, derate ambient to 60 C or reduce the utilization to under 70%. Use the Stratix III thermal model in Quartus II PowerPlay to estimate junction temperature during synthesis.
Assign LVDS pairs to the same I/O bank and place them on the outer two signal layers adjacent to the package edge; assign DDR/DDR2 memory interfaces to dedicated top/bottom layers with matched trace lengths (tolerance +/- 25 mil for DQ, +/- 50 mil for DQS). Route 2.5 V VCCAUX and 3.3 V VCCIO with 1 oz copper and 0.5 mm clearance; route 1.1 V VCC/VCCPT with 2 oz copper and 1 mm clearance to minimize IR drop. Place all clock inputs (REFCLK) within 50 mils of the FPGA and guard them with GND vias on both sides. Validate signal-integrity post-layout with the Quartus II SignalTap logic analyzer and HyperLynx SI.
Compliance Information
RoHS compliant and lead-free per Intel/Altera datasheet. Halogen-free and conflict-minerals status not explicitly stated in public datasheets; consult Intel product compliance team for declarations.
