EP3SL50F484C4LG - 47.5K LE Stratix III L FPGA, 484-FBGA | Intel
MPN: EP3SL50F484C4LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $380 | $3,800.00 |
| 100 | $325 | $32,500.00 |
| 500 | $280 | $140,000.00 |
| 1,000 | $245 | $245,000.00 |
EP3SL50F484C4LG Overview
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that contains an array of configurable logic blocks (CLBs/LABs), programmable interconnect, dedicated block RAM, DSP blocks, and I/O cells, all controlled by SRAM-based configuration memory. Within Intel's portfolio, FPGAs sit at the top of the programmable-logic hierarchy, above CPLDs and below structured ASICs. The Stratix III L sub-family is the static-power-optimized variant of Stratix III, sharing the same logic fabric and transceiver architecture as the standard Stratix III while reducing leakage for thermally constrained designs.
The EP3SL50F484C4LG differentiates itself through a programmable power technology that allows unused logic, memory, and DSP blocks to be put into a low-power state, lowering static power by up to 50% compared to the standard Stratix III family. It supports up to 384 Kbits of distributed RAM, embedded M9K block RAM, and dedicated 18x18 multipliers for DSP, while offering user-selectable I/O standards including LVDS, LVTTL, LVCMOS, and SSTL on its 296 general-purpose I/O pins. The device includes 24 transceiver channels capable of multi-gigabit serial operation for chip-to-chip and backplane connectivity.
Architecturally, the device uses Intel's Logic Element (LE) as its fundamental building block, with each LE containing a 4-input LUT, a programmable register, and carry chain logic. LABs group 10 LEs together, and the Adaptive Logic Module (ALM) variant used in later families is not present in this generation - instead, the Stratix III uses the classic LE/LAB structure optimized for register-rich pipelines. Configuration is stored in SRAM and can be loaded from external flash or via JTAG, supporting in-system reprogrammability and design security through bitstream encryption.
Typical applications for the EP3SL50F484C4LG include high-performance digital signal processing cards, software-defined radio baseband engines, 40G/100G Ethernet line-card pipeline stages, ASIC prototyping, and industrial image-processing platforms. Its low static power makes it suitable for long-life telecommunications and military systems that must operate within a fixed thermal envelope. Compared with the larger EP3SL110 and EP3SL200 devices in the same family, the EP3SL50 sits at the lower end of the logic-density curve and is the most cost-optimized member while retaining the full Stratix III L feature set.
Designers should pay attention to power-plane decoupling, since Stratix III L requires multiple supply rails (VCC, VCCPT, VCCAUX, VCCA_FPLL) each with their own decoupling requirements. In-System Programming via JTAG is recommended for prototypes, while production boards typically use an external flash (EPCS) device for configuration. The 484-FBGA package supports high-speed signaling but requires careful PCB stack-up design, controlled-impedance traces, and proper via-in-pad or microvia escape to maintain signal integrity at multi-gigabit rates.
This page consolidates distributor pricing and parametric cross-references beyond what the manufacturer datasheet alone provides, including drop-in compatible Stratix III L variants and selection guidance between the C2, C3, C4, and I-grade speed/temperature options.
Drop-in alternatives for EP3SL50F484C4LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SL50F484C4LG (same form factor and footprint) — differing in Package, Family, Operating Temperature, Speed Grade, Embedded Memory.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SL50F484C4L
✅ Drop-In✓ In Stock
$651.25 / Unit
View Datasheet →EP3SL50F484C4G
✅ Drop-In✓ In Stock
$122.1 / Unit
View Datasheet →EP3SL50F484C4
✅ Drop-In✓ In Stock
$364.63 / Unit
View Datasheet →EP3SL50F484C3N
✅ Drop-In✓ In Stock
$458 / Unit
View Datasheet →EP3SL50F484C3G
✅ Drop-In✓ In Stock
$165 / Unit
View Datasheet →EP3SL50F484C2N
✅ Drop-In✓ In Stock
$175 / Unit
View Datasheet →EP3SE50F484C4LG
✅ Drop-In✓ In Stock
$370.6 / Unit
View Datasheet →EP3SL50F484C4LG Maximum Ratings & Electrical Characteristics
| Series | Stratix III L |
| Family | FPGA - Field Programmable Gate Array |
| Number of Logic Elements (LE) | 47500 |
| Number of LABs/CLBs | 1900 |
| Adaptive Logic Modules (ALM) | 19000 ALM |
| Total Embedded Memory | 2184192 bit (2.08 Mbit) |
| Number of I/O | 296 |
| Supply Voltage | 0.86 V to 1.15 V (1.1 V typical) |
| Operating Temperature | 0 C to +85 C (TJ) |
| Mounting Style | SMD/SMT |
| Package | 484-FBGA (23x23 mm) |
| Package Case | 484-BBGA, FCBGA |
| Packaging | Tray |
| Supplier Device Package | 484-FBGA |
| RoHS Status | Compliant |
| Speed Grade | C4 (commercial, slowest) |
| Process Node | 40 nm |
EP3SL50F484C4LG 484-fbga Pin Configuration Guide
Pin configuration for EP3SL50F484C4LG (484-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SL50F484C4LG.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SL50F484C4LG is suitable for 6 applications: Software-Defined Radio Baseband, 40G/100G Ethernet Line Card Pipeline, ASIC Prototyping Platform, Industrial Image Processing, Military / Aerospace Signal Processing, Medical Imaging Accelerator.
Software-Defined Radio Baseband
The EP3SL50F484C4LG fits SDR baseband processing because its 47,500 logic elements, 2.08 Mbits of embedded M9K block RAM, and dedicated 18x18 multipliers provide the throughput needed for sample-rate conversion, channelization, and modulation/demodulation while the 'L' suffix keeps static power low enough for long-life telecom chassis. Designers typically instantiate a bank of digital up/down converters and FFT cores that consume both the DSP blocks and several thousand LEs; the device's 296 user I/Os accept parallel ADC/DAC data plus CPRI/OBSAI links without external bridging. Compared to a general-purpose DSP, the FPGA allows field-reprogrammability for evolving waveform standards (LTE, 5G NR, tactical radios), while the 1.1 V core and programmable-power features reduce thermal load in dense line-card slots.
Recommended
40G/100G Ethernet Line Card Pipeline
In a 40G/100G line card, the EP3SL50F484C4LG acts as the traffic-manager and pre-classification stage, benefiting from its 296 high-speed LVDS/SSTL-capable I/Os for parallel SFI-X buses and 24 embedded transceivers for multi-gigabit serial links. The 2.08 Mbits of block RAM are organized as multiple packet buffers and FIFO queues that aggregate bursts before handing them off to a network processor. The 'L' (low-power) variant is selected here because line cards are densely packed and rely on chassis airflow rather than per-chip heatsinks; Stratix III L cuts leakage enough to keep junction rise within 25 C even at full throughput. Designers map PCS, MAC, and look-up-table stages into separate LABs and reserve DSP blocks for CRC and hashing accelerators.
Recommended
ASIC Prototyping Platform
Engineers building ASIC prototypes commonly choose the EP3SL50F484C4LG because its 47,500 LEs map cleanly to mid-size SoC RTL partitions, while the 484-FBGA package exposes 296 user I/Os for inter-chip bridging in a multi-FPGA emulation stack. The Stratix III L architecture supports TLM and transactor-based verification flows, and the embedded block RAM models ASIC SRAM with high fidelity. Quartus Prime's incremental compile and LogicLock regions make it straightforward to partition large designs across several EP3SL50 devices. The 'LG' lead-free variant is preferred for modern green-design compliance, and the C4 speed grade is usually sufficient for functional validation because timing closure is rarely the bottleneck at this stage.
Recommended
Industrial Image Processing
Machine-vision and inspection systems benefit from the EP3SL50F484C4LG's parallel sensor interfaces (Camera Link, LVDS, MIPI-CSI bridges) through its 296 I/Os, combined with DSP blocks for convolution kernels and 2.08 Mbits of block RAM for line buffers. The 'L' variant's low static power allows sealed IP67 enclosures with limited convection cooling, since total board dissipation can be held under 10 W even when running full HD pipelines at 60 fps. Industrial customers also appreciate the long product lifecycle of Stratix III L, which Intel maintains well beyond the typical consumer-IC window, protecting multi-year production runs.
Recommended
Military / Aerospace Signal Processing
Defense programs select the EP3SL50F484C4LG for radar DSP, electronic-warfare, and avionics data-acquisition systems because of the Stratix III L family's mature tool-chain support, low-leakage silicon, and long-term availability. With 47,500 LEs and 2.08 Mbits of block RAM, designers can implement pulse-Doppler FFTs, beamforming weights, and I/Q channelizers in a single device, while the 484-FBGA package provides ample I/O for ADCs, DACs, and serialized RF data links. The 1.1 V core reduces in-flight thermal load, and the 'L' variant's low static power extends mission endurance on airborne platforms with limited cooling.
Recommended
Medical Imaging Accelerator
Ultrasound, CT, and MRI pre-processing subsystems leverage the EP3SL50F484C4LG's parallel DSP capability and 2.08 Mbits of block RAM to run beamforming, back-projection, and image-reconstruction algorithms at low latency. The 296 I/Os allow direct interfacing with parallel-channel ADC arrays commonly used in 64-128 element ultrasound probes, while the FPGA's deterministic latency is critical for real-time diagnostic imaging. The 'L' variant's reduced static power keeps the patient-adjacent thermal envelope within medical-device limits, and the lead-free 'LG' finish supports IEC 60601-1 environmental compliance for global hospital deployments.
Recommended
Recommended Products Summary
Engineering reference data for EP3SL50F484C4LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SL50F484C4L | EP3SL50F484C4G | EP3SL50F484C4 | EP3SL50F484C3N | EP3SL50F484C2N | EP3SE50F484C4LG |
|---|---|---|---|---|---|---|---|
| Package | 484-FBGA (23x23 mm) | 484-FBGA (23x23 mm) - same | 484-FBGA (23x23 mm) - same | 484-FBGA (23x23 mm) - same | 484-FBGA (23x23 mm) - same | 484-FBGA (23x23 mm) - same | 484-FBGA (23x23 mm) - same |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Series | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III E |
| Logic Elements | 47500 | 47500 | 47500 | 47500 | 47500 | 47500 | 47500 |
| Embedded Memory | 2.08 Mbit | 2.08 Mbit | 2.08 Mbit | 2.08 Mbit | 2.08 Mbit | 2.08 Mbit | 2.08 Mbit |
| User I/O | 296 | 296 | 296 | 296 | 296 | 296 | 296 |
| Speed Grade | C4 (slowest commercial) | C4 | C4 | C4 | C3 (faster) | C2 (fastest) | C4 |
| Lead-free / RoHS | Yes (LG finish) | No (legacy) | Yes (G finish) | No | No (N suffix) | No | Yes |
Key Differentiators
- Lower static power than standard Stratix III (vs EP3SE50F484C4LG)
- Lead-free ball finish for global RoHS deployments (vs EP3SL50F484C4)
- Drop-in same-footprint speed grade flexibility (vs EP3SL50F484C2N)
Design Notes
The EP3SL50F484C4LG requires four separate power rails: VCC (core, 1.1 V typical), VCCPT (3.3 V), VCCAUX (2.5 V), and VCCA_FPLL (2.5 V). Each rail needs its own bulk and decoupling capacitor network as described in the Stratix III L Hardware Reference manual. Designers should estimate power with the Quartus PowerPlay Early Power Estimator before board bring-up to size regulators correctly.
Although the 'L' suffix reduces static power relative to the standard Stratix III, junction temperature can still exceed 85 C in confined enclosures. Provide a thermal pad or copper pour connected to the package substrate balls, and ensure airflow of at least 200 LFM across the BGA. Use the Stratix III L thermal model in Quartus to simulate worst-case junction rise before committing to a heatsink-less design.
The 484-FBGA package has 1.0 mm ball pitch and demands a 4-6 layer PCB stack-up with microvia escape. Match all high-speed transceiver traces to 100 ohm differential impedance and length-match within 150 mils. Place configuration flash (EPCS) within 4 inches of the dedicated AS pins and route the clock trace as a 50 ohm controlled-impedance line.
Do not assume 'drop-in' between Stratix III and Stratix IV - the configuration pinout and transceiver channel count differ. Also avoid mixing LVTTL and LVDS on the same I/O bank without consulting the bank-VCCIO compatibility matrix in the datasheet. Finally, do not enable bitstream encryption without a working JTAG path, otherwise a configuration error can lock the device.
For multi-gigabit serial links up to 3.125 Gbps, route differential pairs over a continuous reference plane and avoid layer transitions. Use the on-chip ALTGX or ALT2GXB transceiver blocks; AC-couple the lines with 0.1 uF capacitors placed within 1 cm of the BGA. Verify signal integrity with Intel's SignalTap logic analyzer or external BERT during board bring-up.
Compliance Information
RoHS compliance indicated by 'LG' suffix. AEC-Q100 not applicable - this is a commercial/industrial-grade FPGA, not an automotive qualified part. Industrial-temp variant (I4) is available for harsher environments.
