EP3SE50F780C4 - 47.5K LE Stratix III FPGA 488 I/O 780-FBGA | Altera
MPN: EP3SE50F780C4 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $907.85 | $907.85 |
| 10 | $862.45 | $8,624.50 |
| 100 | $817.07 | $81,707.00 |
| 500 | $771.67 | $385,835.00 |
| 1,000 | $726.28 | $726,280.00 |
EP3SE50F780C4 Overview
What is an FPGA? An FPGA (Field-Programmable Gate Array) is a programmable semiconductor device containing configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP blocks (memory, transceivers, DSP multipliers) that designers can reconfigure post-manufacture. Within the hierarchy of digital ICs, an FPGA sits alongside microcontrollers, DSPs, and ASICs as a high-flexibility computational platform used for prototyping, low-volume production, and applications demanding hardware parallelism such as signal processing and high-speed interfacing.
The EP3SE50F780C4 implements Altera's Adaptive Logic Module (ALM) architecture and MultiTrack interconnect, enabling efficient mapping of wide logic functions. Dedicated features include TriMatrix embedded memory blocks (MRAM, M9K, M144K), embedded multipliers for DSP, and high-speed transceivers supporting protocols such as PCI Express, Gigabit Ethernet, and Serial RapidIO. The 488 I/O count and 780-ball package place it in the high-density segment for parallel data-path and bridging designs.
Typical applications for the EP3SE50F780C4 include high-speed communications backplanes, military and aerospace signal processing, ASIC prototyping, and high-throughput data acquisition systems. Its combination of logic density, embedded memory, and high I/O count makes it well-suited for designs that require parallel processing, custom protocol bridging, or DSP-intensive workloads.
When designing with the EP3SE50F780C4, plan for FPGA-internal power decoupling, multi-rail sequencing (typically 1.1 V core plus 2.5 V/3.3 V auxiliary), and a thermal management strategy that uses the package's exposed thermal pad. Quartus II / Quartus Prime toolchain support is mandatory for bitstream generation, place-and-route, and timing closure.
This page synthesizes real-time distributor pricing, verified drop-in Stratix III family alternatives, and practical PCB and thermal design notes that are not available in the manufacturer datasheet alone.
Drop-in alternatives for EP3SE50F780C4 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SE50F780C4 (same form factor and footprint) β differing in Package, Speed Grade, Operating Temperature, Family, Mounting Type.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP3SE50F780C3
β Drop-Inβ In Stock
$890 / Unit
View Datasheet βEP3SE50F780C3N
β Drop-Inβ In Stock
$717.12 / Unit
View Datasheet βEP3SE50F780C3G
β Drop-Inβ In Stock
$1030 / Unit
View Datasheet βEP3SE50F780C2
β Drop-Inβ In Stock
$1195 / Unit
View Datasheet βEP3SE50F780C2N
β Drop-Inβ In Stock
$278.9 / Unit
View Datasheet βEP3SE50F780C2G
β Drop-Inβ In Stock
$1985 / Unit
View Datasheet βEP3SE50F780C4 Maximum Ratings & Electrical Characteristics
| Family | Stratix III E |
| Logic Elements (LE) | 47,500 |
| Embedded Memory (bits) | 5,760,000 |
| Maximum User I/O | 488 |
| Logic Array Blocks (LABs) | 1,900 |
| Maximum Internal Frequency | 800 MHz |
| Process Technology | 65 nm |
| Core Supply Voltage | 1.1 V |
| Speed Grade | C4 (commercial) |
| Operating Temperature | 0C to +85C |
| Package | 780-Ball FC-FBGA (BBGA) |
| Mounting Type | Surface Mount |
EP3SE50F780C4 780-ball fc-fbga (bbga) Pin Configuration Guide
Pin configuration for EP3SE50F780C4 (780-ball fc-fbga (bbga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SE50F780C4.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SE50F780C4 is suitable for 6 applications: High-Speed Communications Backplanes, ASIC Prototyping and Emulation, Military and Aerospace Signal Processing, High-Throughput Data Acquisition, Industrial Automation and Machine Vision, Test and Measurement Instrumentation.
High-Speed Communications Backplanes
The EP3SE50F780C4 fits high-speed communications backplane designs where multiple protocol channels must terminate simultaneously. With 488 user I/O and dedicated high-speed transceivers, the FPGA aggregates multi-gigabit serial links (e.g., 10G Ethernet, Serial RapidIO) and bridges them to parallel backplane buses. Its 47.5K logic elements and 5.76 Mbits of TriMatrix embedded memory buffer protocol headers and payload data, while 1,900 LABs and 800 MHz internal frequency sustain wire-speed processing. The 780-FBGA package exposes sufficient I/O for multi-channel aggregation, and Stratix III E core logic keeps deterministic latency. Compared to discrete PHY + ASIC implementations, this single-chip solution reduces BOM, simplifies timing closure, and accelerates NRE. Quartus Prime supports the necessary IP cores for backplane protocol handling.
Recommended
ASIC Prototyping and Emulation
The EP3SE50F780C4 is well-suited to ASIC prototyping and in-circuit emulation because Stratix III E logic closely mirrors ASIC gate-level timing and the 65 nm process matches older ASIC foundry nodes. With 47.5K LE, designers map one or more ASIC blocks per device and stitch multiple FPGAs together for larger ASIC validation. The 780-FBGA exposes up to 488 I/O for inter-FPGA hand-off signals required in multi-FPGA prototyping cages. Embedded TriMatrix memory stands in for SRAM macros, and dedicated multipliers stand in for DSP cores. Quartus Prime's synthesis and incremental compile flows accelerate bring-up. This application is recommended when the target ASIC will be fabricated on a similar process node and the team needs bit-accurate pre-silicon validation.
Recommended
Military and Aerospace Signal Processing
The EP3SE50F780C4 fits military and aerospace signal processing platforms that need radiation-tolerant high-density logic in a ruggedized package. The 780-FBGA provides mechanical robustness for vibration and thermal cycling. The 800 MHz internal frequency, 47.5K LE, and 5.76 Mbits of embedded memory support real-time FFT, channelization, beamforming, and modulation/demodulation pipelines. The device pairs with external ADC/DAC front-ends for radar, EW, and satellite-comm payloads. Designers should verify radiation hardening and MIL-STD-810 qualification status with the vendor before deploying for safety-critical applications. For extended temperature ranges, the I4 speed-grade variant (EP3SE50F780I4) provides the same die in industrial temperature range.
Recommended
High-Throughput Data Acquisition
The EP3SE50F780C4 suits high-throughput data acquisition systems where multiple ADC channels stream samples into FPGA fabric for real-time processing. The 488 user I/O enables parallel LVDS or DDR interface connections from dozens of ADC channels, while 5.76 Mbits of embedded memory buffers incoming sample streams. The 47.5K LE supports FIR filtering, channel calibration, and protocol encapsulation, and the 800 MHz internal frequency sustains multi-GSPS aggregate throughput. The 780-FBGA package's high pin count is critical when interfacing to many parallel converters. The device pairs naturally with high-speed JESD204B ADCs/DACs via the Stratix III transceivers. Quartus Prime provides JESD204B IP that drops into the FPGA fabric with minimal user intervention.
Recommended
Industrial Automation and Machine Vision
The EP3SE50F780C4 supports industrial automation controllers and machine vision processing pipelines that demand deterministic latency and parallel sensor aggregation. The 47.5K LE and embedded multipliers allow real-time image preprocessing, feature extraction, and machine-vision inference at line rate. The 488 I/O accepts multi-lane Camera Link, CoaXPress, or GigE Vision inputs, while 1.1 V core and Stratix III E architecture deliver low static power for factory-floor deployments. The 780-FBGA package is suitable for PCI/PCIe form-factor machine-vision cards. For multi-axis motor control and industrial Ethernet, the same FPGA can run EtherCAT or PROFINET IP cores alongside vision pipelines.
Recommended
Test and Measurement Instrumentation
The EP3SE50F780C4 is ideal for test and measurement instruments - logic analyzers, protocol testers, arbitrary waveform generators, and bench-top oscilloscopes - where reconfigurable high-density logic accelerates measurement algorithms. With 47.5K LE, the FPGA implements custom trigger engines, real-time DSP for signal conditioning, and protocol decode in firmware. The 488 I/O accept high-speed analog front-end outputs via LVDS or parallel buses, and embedded memory buffers deep capture records. The 780-FBGA's ball pitch supports dense multi-board layouts typical of modular instruments. Designers can also leverage Stratix III transceivers for high-speed serial instrument interfaces such as USB 3.0, PCIe Gen2, or 10 GbE.
Recommended
Recommended Products Summary
Engineering reference data for EP3SE50F780C4 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SE50F780C3 | EP3SE50F780C3N | EP3SE50F780C3G | EP3SE50F780C2 | EP3SE50F780C2N | EP3SE50F780C2G |
|---|---|---|---|---|---|---|---|
| Package | 780-FBGA | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same | 780-FBGA - same |
| Brand | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) | Altera (Intel PSG) |
| Family | Stratix III E | Stratix III E | Stratix III E | Stratix III E | Stratix III E | Stratix III E | Stratix III E |
| Logic Elements | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 |
| Speed Grade | C4 (fastest) | C3 | C3 | C3 | C2 | C2 | C2 |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Embedded Memory (bits) | 5,760,000 | 5,760,000 | 5,760,000 | 5,760,000 | 5,760,000 | 5,760,000 | 5,760,000 |
| Maximum User I/O | 488 | 488 | 488 | 488 | 488 | 488 | 488 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C |
Key Differentiators
- C4 speed grade - fastest commercial option in EP3SE50 family (vs EP3SE50F780C3)
- 47.5K logic elements at the 780-FBGA top-of-stack (vs EP3SE110F780C4)
- Commercial temperature range with full -40C to +100C support via I4 variant (vs EP3SE50F780I4)
Design Notes
Estimated: The EP3SE50F780C4 typically requires at least three power rails - 1.1 V core (VCC), 2.5 V/3.3 V auxiliary (VCCAUX, VCCPD), and a separate 1.2 V/2.5 V transceiver supply (VCCR, VCCT, VCCA). Stratix III power-on sequencing mandates VCC before VCCAUX before VCCIO, with monotonic ramp rates between 1 V/ms and 10 V/ms per Intel/Altera Stratix III handbook. Use a dedicated sequencer or FPGA-supervisor IC such as the LTC2923 to enforce ordering, and place 10 uF + 0.1 uF + 0.01 uF decoupling capacitor networks within 100 mils of every supply pin pair.
The 780-FBGA package has a JEDEC-standard exposed thermal pad that must be soldered to the PCB's inner ground plane for thermal dissipation. Estimated: at 800 MHz internal frequency with typical 60-70% utilization, the device dissipates approximately 5-8 W; a 6-layer PCB with continuous inner ground/power planes (2 oz copper) keeps theta-JA in the 8-12 C/W range. Without the thermal pad soldered, junction temperature can exceed 100C under load. Designers should also include thermal vias (0.3 mm pitch, 0.2 mm drill, plugged on top side) directly under the exposed pad.
Use the manufacturer-supplied package land pattern and breakout routing guidelines. For 780-FBGA at 1.0 mm pitch, escape routing requires microvia (laser-drilled) stack-up with 4-6 mil signal traces. Matched-length differential pairs (within 5 mil) are mandatory for LVDS and DDR memory interfaces. Ground-reference all signal layers to control impedance (50 ohm SE, 100 ohm diff). Place decoupling capacitors on the BOTTOM side of the PCB directly beneath their respective supply pins to minimize loop inductance.
Common pitfalls with Stratix III designs include: (1) failing to configure the device correctly (use JTAG for development, AS mode for production with EPCS serial configuration device); (2) ignoring configuration pins (nCONFIG, nSTATUS, CONF_DONE) which must be pulled high with 10 kohm and monitored by the system controller; (3) crossing I/O bank supply (VCCIO) constraints - each bank supports a single I/O standard and voltage; (4) underestimating in-system debug impact - reserve JTAG pins for SignalTap II logic analyzer usage. Always validate bitstream with Quartus Prime programmer before mass production.
Compliance Information
Compliance status was not available in the verified web data. RoHS and REACH compliance should be verified directly with Intel PSG (formerly Altera) or via the manufacturer datasheet. This FPGA is not automotive-grade - AEC-Q100 is not applicable. For automotive applications, consider Cyclone IV/V or Arria II/10 device families instead.
