EP3SE80F780C4 - Stratix III E 80K LE FPGA, 488 I/O, FCBGA-780 | Altera
MPN: EP3SE80F780C4 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2016.08 | $2,016.08 |
| 10 | $1850 | $18,500.00 |
| 50 | $1700 | $85,000.00 |
| 100 | $1550 | $155,000.00 |
| 500 | $1400 | $700,000.00 |
EP3SE80F780C4 Overview
A Field Programmable Gate Array (FPGA) is a programmable semiconductor device that allows engineers to implement arbitrary digital logic through configurable logic blocks (CLBs/LABs), programmable interconnect, block RAM, DSP blocks, and high-speed transceivers. FPGAs occupy the highest flexibility tier of the programmable logic taxonomy: programmable logic → programmable logic device → semiconductor IC. Stratix III devices added Altera's Programmable Power Technology, allowing unused logic blocks to consume less power while active blocks run at full speed, addressing the historical ASIC-vs-FPGA trade-off.
Key features of the EP3SE80F780C4 include 80,000 logic elements, 488 user I/Os (largest I/O count in the Stratix III E family 780-package options), 6.5 Mbit embedded memory, and selectable core voltage for low-power operation. The device supports up to 8 PLLs and multiple high-speed I/O standards including LVDS, making it suitable for high-throughput parallel interfaces. Operating temperature grade is commercial (0C to +85C), denoted by the C4 speed/temperature code.
The architecture uses a tiered interconnect (HyperFlex-equivalent not present in Stratix III) combined with DSP blocks and TriMatrix on-chip memory to deliver high DSP throughput. Programmable Power Technology combined with selectable core voltage (1.1 V nominal, optionally 0.9 V for lower power) gives the lowest static power in its class for 65 nm high-performance FPGAs.
Typical applications include high-performance digital signal processing, telecom baseband and packet processing, ASIC prototyping, high-end test and measurement instrumentation, broadcast video processing, and high-bandwidth data acquisition systems. The 488 I/O count supports wide parallel buses, multi-channel LVDS interfaces, and memory-rich designs.
When designing with this FPGA, pay close attention to the large BGA thermal envelope and PCB stack-up requirements - 780-pin FC-FBGA requires microvia stack-up and controlled-impedance routing. Use Altera/Intel Quartus II software with the Stratix III device support to compile, simulate, and configure the device via JTAG or active serial configuration schemes.
This page synthesizes distributor pricing, same-family Altera/Intel drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for EP3SE80F780C4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SE80F780C4 (same form factor and footprint) — differing in Operating Temperature, Package, Speed Grade, Logic Array Blocks (LABs), Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SE80F780C4N
✅ Drop-In✓ In Stock
$1290 / Unit
View Datasheet →EP3SE80F780C4LN
✅ Drop-In✓ In Stock
$138.75 / Unit
View Datasheet →EP3SE80F780C3N
✅ Drop-In✓ In Stock
$1410 / Unit
View Datasheet →EP3SE80F780C3
✅ Drop-In✓ In Stock
$2050 / Unit
View Datasheet →EP3SE110F780C4N
✅ Drop-In✓ In Stock
$1395 / Unit
View Datasheet →EP3SE50F780C4
✅ Drop-In✓ In Stock
$726.28 / Unit
View Datasheet →EP3SE80F780C4 Maximum Ratings & Electrical Characteristics
| Family | Stratix III E |
| Logic Elements | 80,000 |
| Total RAM Bits | 6,843,392 (~6.5 Mbit) |
| Number of LABs/CLBs | 3,200 |
| User I/O Count | 488 |
| Package | 780-BBGA, FC-FBGA |
| Process Technology | 65 nm |
| Core Voltage | 1.1 V |
| Operating Temperature | 0C to +85C (commercial, C4 grade) |
| Mounting Type | Surface Mount (BGA) |
| Programmable Power Technology | Yes |
| RoHS Status | Compliant |
| Lead-Free | Yes |
| Configuration Interface | JTAG, Active Serial, Passive Serial |
| Speed Grade | C4 (commercial) |
EP3SE80F780C4 780-bbga, fc-fbga Pin Configuration Guide
Pin configuration for EP3SE80F780C4 (780-bbga, fc-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SE80F780C4.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SE80F780C4 is suitable for 6 applications: High-Performance DSP Systems, Telecom Baseband & Packet Processing, ASIC Prototyping, Broadcast Video Processing, High-Bandwidth Data Acquisition, Military & Aerospace Avionics.
High-Performance DSP Systems
The EP3SE80F780C4's 80,000 logic elements and 6.5 Mbit embedded RAM deliver the DSP throughput required for multi-channel signal conditioning, radar pulse processing, and software-defined radio modems. The device integrates dedicated DSP blocks that perform multiply-accumulate operations at hundreds of MHz, freeing logic for control and buffering. With 488 user I/Os, the FPGA can interface to multi-channel ADCs/DACs and external DDR/DDR2 memory simultaneously. Stratix III Programmable Power Technology reduces dynamic power when DSP blocks are idle, critical for thermally constrained embedded systems. Reference designs in the Stratix III DSP Development Kit demonstrate FFT, FIR filtering, and channelizer implementations using this exact device.
Recommended
Telecom Baseband & Packet Processing
In telecom infrastructure, the EP3SE80F780C4 handles baseband processing for LTE, WiMAX, and proprietary wireless protocols where deterministic latency and high throughput are mandatory. The 488 I/Os accommodate multiple SFP/SerDes interfaces, external TCAM for routing tables, and QDR/DDR memory for packet buffering. The 1.1 V core voltage reduces power versus older Stratix II designs while maintaining the 450 MHz performance envelope. Engineers typically pair this FPGA with PHY transceivers and external SRAM for line-card designs in central-office switches and wireless base stations.
Recommended
ASIC Prototyping
The EP3SE80F780C4 is widely used to prototype ASIC designs before tape-out, providing 80K logic elements sufficient for sub-million-gate ASIC partitions. Quartus II synthesis supports ASIC gate libraries mapped to FPGA primitives, with debugging visibility through SignalTap II embedded logic analyzer. The 780-FCBGA package and 488 I/Os give ample visibility for bring-up of complex SoC designs. Designers can partition large ASICs across multiple Stratix III E FPGAs using dedicated TDM/SerDes interconnect, validating timing and functionality before committing to silicon. This application leverages the FPGA's deterministic timing and high I/O bandwidth.
Recommended
Broadcast Video Processing
For broadcast video switchers, format converters, and multi-screen video walls, the EP3SE80F780C4 provides the parallel processing bandwidth required to handle uncompressed HD/3G-SDI streams. The FPGA's 488 I/Os accept multiple SDI inputs and drive HDMI/DVI outputs through external PHY chips, while the 6.5 Mbit internal RAM serves as line/frame buffers. The device supports SDI, HDMI, and DisplayPort protocols through Quartus II IP cores. Latency-critical video processing such as color space conversion, scaling, and alpha blending fits comfortably within 80K LEs for 4-channel HD pipelines.
Recommended
High-Bandwidth Data Acquisition
In test & measurement and scientific instrumentation, the EP3SE80F780C4 captures and processes data from multi-channel high-speed ADCs operating at hundreds of MSPS. The FPGA's LVDS I/Os accept parallel ADC data with sub-nanosecond skew, while 6.5 Mbit of block RAM provides circular buffers for triggered captures. Engineers use this device to build digital oscilloscopes, spectrum analyzers, and transient recorders. The 1.1 V core voltage keeps thermal dissipation manageable when the FPGA is fully loaded with active logic and memory operations.
Recommended
Military & Aerospace Avionics
The EP3SE80F780C4 is a long-lifecycle Altera Stratix III part widely deployed in military and aerospace avionics where extended program lifetimes demand stable FPGA supply. While the C4 commercial temperature variant suits ground-based and laboratory systems, defense programs typically migrate to I4 industrial/extended-temperature variants for harsh environments. The mature 65 nm process, fully characterized radiation data, and Intel's defense/aerospace long-term support contracts make this FPGA family a baseline choice for radar, electronic warfare, and secure communications systems. Designers must verify MIL-STD-810 environmental compliance at the system level.
Recommended
Recommended Products Summary
Engineering reference data for EP3SE80F780C4 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SE80F780C4N | EP3SE80F780C4LN | EP3SE80F780C3N | EP3SE80F780C3 | EP3SE110F780C4N | EP3SE50F780C4 |
|---|---|---|---|---|---|---|---|
| Package | 780-FCBGA | 780-FCBGA - same | 780-FCBGA - same | 780-FCBGA - same | 780-FCBGA - same | 780-FCBGA - same | 780-FCBGA - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 80,000 | 80,000 | 80,000 | 80,000 | 80,000 | 110,000 (+37.5%) | 50,000 (-37.5%) |
| Embedded RAM | 6,843,392 bits (~6.5 Mbit) | 6,843,392 bits | 6,843,392 bits | 6,843,392 bits | 6,843,392 bits | 9,663,360 bits (~41% more) | 4,294,400 bits (~37% less) |
| User I/O Count | 488 | 488 | 488 | 488 | 488 | 488 | 488 |
| Speed Grade | C4 (commercial, faster) | C4 | C4 | C3 (slower) | C3 (slower) | C4 | C4 |
| Lead-Free / RoHS | Non-N suffix | Yes (N suffix) | Yes (LN suffix) | Yes (N suffix) | Non-N suffix | Yes (N suffix) | Non-N suffix |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Highest I/O count in 780-package Stratix III E family at 80K LEs (vs EP3SE50F780C4)
- Drop-in compatibility with Stratix III E density variants (vs EP3SE110F780C4N)
- C4 speed grade provides faster timing than C3 variant (vs EP3SE80F780C3N)
Design Notes
Estimated: The 780-FCBGA package uses a 1.0 mm ball pitch with full-array assignment. PCB breakout requires HDI microvia stack-up (4-1-4 or 5-2-5) with via-in-pad recommended for inner rows to route all 488 user I/Os. Plan at least 8 routing layers plus dedicated power/ground planes. Use a 0.8 mm drill microvia and laser-drilled vias to escape the inner ball rows. Failure to use microvias will cause routing congestion and signal-integrity problems at LVDS speeds.
Estimated: At full toggle activity with all 80K logic elements switching at 450 MHz, the EP3SE80F780C4 can dissipate 5-8 W. Stratix III E theta_JA is approximately 12-15 C/W on a 4-layer JEDEC test board with adequate thermal vias. The exposed die of the FC-FBGA package requires thermal vias (0.3 mm drill, 1.0 mm pitch) directly under the die array to conduct heat to internal copper planes. Add a heatsink with thermal interface material for designs dissipating >3 W to keep junction below 100C.
Use a multi-rail power supply providing 1.1 V (VCCINT core), 0.9 V optional low-power core, 2.5 V/3.3 V (VCCIO for I/O banks), and 1.5 V (VCCAUX auxiliary). Stratix III PowerPlay advisor in Quartus II estimates power consumption based on toggle rates and clock frequency - estimate before PCB design to size the regulator. Place decoupling capacitors (0.1 uF + 10 uF bulk) within 100 mils of every power pin. Use separate analog and digital ground planes joined at a single point.
Configuration mode selection: use MSEL[2:0] pins to set configuration scheme (AS, PS, JTAG). Strapping to wrong mode prevents configuration. JTAG chain conflicts: ensure no other devices on the JTAG chain share the same TDI/TDO unless proper buffering. I/O bank voltage: VCCIO must match the I/O standard voltage - mixing 1.5 V and 3.3 V in the same bank damages the device. Always use Altera/Intel configuration device (EPCS) or supported flash for active serial configuration; JTAG-only configuration is for development only and is volatile.
Compliance Information
EP3SE80F780C4 (without N suffix) is the standard leaded variant; EP3SE80F780C4N is the lead-free / RoHS-compliant variant. AEC-Q100 not applicable as this is an FPGA IC, not an automotive-grade discrete component. Per Altera/Intel material declaration, all Stratix III E devices comply with REACH and conflict-mineral reporting requirements.
