EP3SE50F780C2G - Stratix III E FPGA 47.5K LE | Intel | 780-FCBGA
MPN: EP3SE50F780C2G ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2710 | $27,100.00 |
| 100 | $2450 | $245,000.00 |
| 500 | $2200 | $1,100,000.00 |
| 1,000 | $1985 | $1,985,000.00 |
EP3SE50F780C2G Overview
A Field Programmable Gate Array (FPGA) is a type of integrated circuit containing an array of programmable logic blocks, configurable interconnect, and on-chip memory that can be customized after manufacturing to implement virtually any digital logic function. FPGAs occupy the position of programmable logic devices (PLD) within the broader semiconductor hierarchy: PLD -> ASIC family -> logic ICs -> integrated circuits. Stratix III E FPGAs specifically target DSP and high-throughput memory-intensive workloads with dedicated DSP blocks, embedded TriMatrix memory blocks, and high-speed transceivers.
Key features of the EP3SE50F780C2G include 47,500 logic elements, 1,900 Logic Array Blocks (LABs), 5.49 Mbit embedded RAM, 488 maximum user I/Os, and 132 embedded 18x18 multipliers. The device integrates up to 12 embedded transceivers (depending on variant) supporting data rates up to 3.75 Gbps for serial connectivity, and supports DDR2/DDR3 memory interfaces at speeds up to 800 MHz. The C2 speed grade indicates commercial temperature range (0C to +85C) with a moderate timing closure rating.
The device's 65 nm low-k process technology and adaptive logic modules (ALMs) deliver a balanced ratio of register-rich to combinational logic, enabling efficient pipelined DSP and parallel datapath designs. Programmable Power Technology allows unused blocks to be powered down, reducing static consumption relative to comparable fixed-logic architectures.
Typical applications include high-end ASIC prototyping, wireless baseband processing, high-definition video processing, military radar signal chains, and test & measurement equipment. The 780-ball FCBGA package supports high-density board designs where multi-gigabit transceivers and large memory bandwidth are required. The EP3SE50F780C2G is best suited for designs that can fully exploit its DSP blocks and high pin count rather than simple glue-logic applications where a smaller Cyclone device would be more cost-effective.
When designing with this part, ensure adequate thermal management for the FCBGA package - a minimum of four PCB layers with thermal vias under the device is recommended. Quartus II design software is required for synthesis, place-and-route, and bitstream generation; the Quartus Prime Lite edition does not support Stratix III and the Quartus II Subscription Edition is required for the final timing closure and programming files.
This page synthesizes distributor pricing (as of 2026-09-09), drop-in same-package alternatives from the Stratix III E family, and practical design notes not found on a single distributor product page.
Drop-in alternatives for EP3SE50F780C2G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SE50F780C2G (same form factor and footprint) — differing in Package, Speed Grade, Embedded Memory, Operating Temperature, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SE50F780C2
✅ Drop-In✓ In Stock
$1195 / Unit
View Datasheet →EP3SE50F780C3N
✅ Drop-In✓ In Stock
$717.12 / Unit
View Datasheet →EP3SE50F780C4N
✅ Drop-In✓ In Stock
$1430 / Unit
View Datasheet →EP3SL50F780C2N
✅ Drop-In✓ In Stock
$312 / Unit
View Datasheet →EP3SE110F780C2N
✅ Drop-In✓ In Stock
$305 / Unit
View Datasheet →EP3SE50F780C2G Maximum Ratings & Electrical Characteristics
| Series | Stratix III E |
| Logic Elements | 47,500 LE |
| Adaptive Logic Modules (ALMs) | 19,000 ALM |
| Logic Array Blocks (LABs) | 1,900 LAB |
| Embedded Memory | 5.49 Mbit |
| Maximum User I/Os | 488 I/O |
| Number of Pins/Terminals | 780 |
| Package | 780-BBGA, FCBGA |
| Process Technology | 65 nm |
| Core Supply Voltage | 1.1 V |
| Minimum Supply Voltage | 0.86 V |
| Speed Grade | C2 (commercial, moderate speed) |
| Operating Temperature | 0C to +85C |
| Mounting Style | SMD/SMT |
| Embedded Multipliers (18x18) | 132 |
EP3SE50F780C2G 780-bbga, fcbga Pin Configuration Guide
Pin configuration for EP3SE50F780C2G (780-bbga, fcbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SE50F780C2G.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SE50F780C2G is suitable for 6 applications: ASIC Prototyping, Wireless Baseband Processing, High-Definition Video Processing, Military Radar Signal Processing, Test & Measurement Equipment, Telecom Backhaul Aggregation.
ASIC Prototyping
The EP3SE50F780C2G is widely used for ASIC and SoC prototyping where 47.5K logic elements provide sufficient capacity for mid-complexity designs and 488 user I/Os support wide parallel interfaces. Its 5.49 Mbit of embedded memory eliminates many external SRAM accesses, accelerating bring-up. The 780-FCBGA package exposes sufficient I/O for emulating real-world ASIC pin counts. Engineers benefit from Quartus II's incremental compile flow which reduces iteration time when adding logic blocks.
Recommended
Wireless Baseband Processing
The EP3SE50F780C2G's 132 embedded 18x18 multipliers and high-performance DSP blocks make it well suited for wireless baseband signal processing such as LTE and WiMAX channel cards. The 65 nm process delivers high Fmax on DSP-heavy paths, while 488 I/Os accommodate multi-antenna radio chains and CPRI/OBSAI backhaul links. The 780-FCBGA package supports the high pin counts required for parallel antenna processing. Designers use the device's parallel FFT and Viterbi decoder IP cores to accelerate baseband pipelines.
Recommended
High-Definition Video Processing
In HD video processing applications such as broadcast routers and professional video editing systems, the EP3SE50F780C2G provides sufficient logic and memory bandwidth to handle multi-stream SDI routing, color-space conversion, and frame-rate conversion. The 488 I/Os enable parallel SDI, HDMI, and DisplayPort interfaces, while 5.49 Mbit embedded RAM serves as line buffers. Designers pair the FPGA with external DDR2 memory at 800 MHz for full-HD frame buffering. The 780-FCBGA package supports high-frequency video SerDes placement.
Recommended
Military Radar Signal Processing
The EP3SE50F780C2G's combination of 47.5K logic elements, 132 DSP multipliers, and high I/O count makes it suitable for phased-array radar signal processing chains including beamforming, pulse compression, and Doppler filtering. The 780-FCBGA package supports the multi-channel ADC interfaces required for digital receiver arrays. For ruggedized deployments, the I-grade variant EP3SE50F780I2N provides -40C to +100C operation. Designers implement FFT-based pulse compression and adaptive beamforming using the on-chip DSP blocks and external DDR memory.
Recommended
Test & Measurement Equipment
In high-speed oscilloscopes, logic analyzers, and protocol testers, the EP3SE50F780C2G serves as a flexible pattern-generation and acquisition engine. Its 488 I/Os support parallel test interfaces, while the DSP blocks accelerate FFT and statistics calculations on captured waveforms. The 5.49 Mbit embedded RAM functions as deep sample buffers for time-interleaved acquisition. The 780-FCBGA package supports placement of multiple high-speed ADC/DAC companions on a single board. Quartus II's SignalTap II logic analyzer is used for in-system debug.
Recommended
Telecom Backhaul Aggregation
The EP3SE50F780C2G is used in telecom backhaul aggregation switches and cross-connect equipment, where its 12 embedded transceivers (per variant) handle multi-Gigabit Ethernet and SONET/SDH traffic. The 5.49 Mbit embedded memory supports packet queueing and statistics counters, while 488 user I/Os expose enough interfaces for fabric and management ports. The 780-FCBGA package supports high-density board layouts with multi-GBE PHY companions. Designers implement packet classification, policing, and QoS scheduling in the FPGA fabric.
Recommended
Recommended Products Summary
Engineering reference data for EP3SE50F780C2G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SE50F780C2 | EP3SE50F780C3N | EP3SE50F780C4N | EP3SL50F780C2N | EP3SE110F780C2N |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 780-BBGA, FCBGA | 780-BBGA, FCBGA - same | 780-BBGA, FCBGA - same | 780-BBGA, FCBGA - same | 780-BBGA, FCBGA - same | 780-BBGA, FCBGA - same |
| Logic Elements | 47,500 LE | 47,500 LE | 47,500 LE | 47,500 LE | 47,500 LE | 110,000 LE |
| Embedded Memory | 5.49 Mbit | 5.49 Mbit | 5.49 Mbit | 5.49 Mbit | 5.49 Mbit | 8.7 Mbit |
| Speed Grade | C2 (commercial) | C2 | C3 (faster) | C4 (fastest) | C2 | C2 |
| Family Variant | Stratix III E (DSP/enhanced) | Stratix III E | Stratix III E | Stratix III E | Stratix III L (low-power) | Stratix III E |
| Lead-Free (RoHS) | Yes (G suffix) | No (SnPb finish) | Yes (N suffix + lead-free) | Yes | Yes | Yes |
Key Differentiators
- Lead-free RoHS-compliant ball finish in 780-FCBGA footprint (vs EP3SE50F780C2)
- Mid-density 47.5K LE with full DSP/enhanced feature set (vs EP3SL50F780C2N)
- Pin-compatible migration path to higher density within same package (vs EP3SE110F780C2N)
Design Notes
The 780-FCBGA package requires careful thermal management. Estimated: with 100% logic utilization at typical toggle rates (~20%), core power reaches 4-6 W. A minimum 4-layer PCB with continuous ground/power planes beneath the device and a thermal-via array (0.3 mm pitch, 0.2 mm drill) connecting top-side pad to internal copper is required to keep junction below 125C. Active airflow or a heatsink is recommended for sustained workloads.
Use 1.0 mm ball pitch land pattern per JEDEC MS-034 for the 780-FCBGA. Decouple each VCC/VCCPD/VCCPGM pin with a 0.1 uF X7R ceramic placed as close as possible. Add 10 uF bulk capacitors within 1 cm of the device. Match differential pair lengths within 0.13 mm (5 mil) for LVDS signals and within 0.05 mm (2 mil) for transceiver channels. Route high-speed transceivers on the top layer only with a continuous reference plane.
Do not assume Quartus Prime Lite supports this device - Stratix III requires the Quartus II Subscription Edition. Confusing speed grades (C2 vs C3 vs C4) when ordering can leave 10-30% timing margin on the table. The 'G' suffix indicates lead-free RoHS-compliant ball finish; the non-G variant is SnPb. Verify I/O bank voltage assignments match your mixed-voltage design before committing to PCB layout, as bank re-assignment is not possible post-fab.
Compliance Information
RoHS compliance indicated by 'G' suffix on MPN. C2 commercial temperature grade (0C to +85C) - not automotive qualified; for industrial temperature use EP3SE50F780I2 variants.
