EP3SE50F484I4 - Stratix III E FPGA, 47.5K LE, 484-FBGA | Intel
MPN: EP3SE50F484I4 β End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1072.78 | $1,072.78 |
| 10 | $965.5 | $9,655.00 |
| 100 | $858.22 | $85,822.00 |
| 250 | $794.1 | $198,525.00 |
| 500 | $730 | $365,000.00 |
EP3SE50F484I4 Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose digital logic function is defined by user configuration data loaded into on-chip SRAM rather than by hard-wired masks during fabrication. FPGAs sit within the broader category of programmable logic devices (PLDs), alongside CPLDs, and below ASICs in the volume-vs-flexibility trade-off. The Stratix III generation succeeded Stratix II by introducing a tiered-architecture family (L, E, GX) that splits power-efficient logic from transceivers, allowing designers to choose the lowest-cost member that meets system requirements. FPGAs are commonly used to implement high-throughput parallel datapaths, custom interface bridges, signal-processing pipelines, and prototype ASICs.
Key features of the EP3SE50F484I4 include support for up to 384 Kbits of distributed RAM, up to 1.625 Mbits of M9K block RAM (variable in family datasheets), and dedicated 18x18 multipliers for DSP applications. The 484-ball FBGA package provides a compact 23x23 mm footprint suitable for high-density board designs while preserving signal integrity through controlled-impedance ball-grid routing. Industrial-grade (-40 C to +100 C junction) screening, denoted by the I4 speed/temperature grade, makes the part appropriate for telecom, industrial automation, test and measurement, and military/aerospace prototypes.
The architecture relies on 8-input adaptive logic modules (ALMs), programmable interconnects with tri-matrix routing, and on-chip phase-locked loops for clock management. Compared with Stratix II, Stratix III devices introduced programmable power technology that dynamically turns off unused logic to reduce static consumption by roughly 50 percent. For designs targeting high DSP throughput, the SE family contains dedicated hardware multiplier/accumulator blocks that outperform fabric-only implementations by an order of magnitude.
Typical applications include high-speed serial protocol bridging (PCIe Gen1/Gen2, SATA, GigE), digital signal processing for radar and software-defined radio, ASIC prototyping, broadcast video processing, and high-performance custom compute engines. In telecom line cards, the EP3SE50F484I4 typically interfaces DDR2/DDR3 memory controllers and multi-gigabit transceivers on adjacent Stratix III GX devices. In test and measurement, the abundant LABs and block RAM implement real-time correlators and FFT engines.
When designing with this FPGA, attention to power sequencing (1.1 V core, 2.5 V/3.0 V aux, 1.5 V/1.8 V I/O banks) and to decoupling (low-ESL ceramics placed within the BGA field) is essential. Designers should also validate thermal dissipation through the 484-ball FC-FBGA exposed-pad variant chosen by their PCB layout, and confirm Quartus II support for the I4 speed grade before committing to layout.
This page consolidates distributor pricing, drop-in same-package and same-family alternatives, and design notes drawn from the Stratix III datasheet that are not always surfaced on distributor listings, helping engineers accelerate component selection and verification.
Drop-in alternatives for EP3SE50F484I4 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SE50F484I4 (same form factor and footprint) β differing in Package, Speed Grade, Process Technology, Family, Mounting Type.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
EP3SE50F484I3N
β Drop-Inβ In Stock
$841.66 / Unit
View Datasheet βEP3SE50F484I3
β Drop-Inβ In Stock
$188 / Unit
View Datasheet βEP3SE50F484I3G
β Drop-Inβ In Stock
$1180 / Unit
View Datasheet βEP3SE50F484C4N
β Drop-Inβ In Stock
$468.11 / Unit
View Datasheet βEP3SE50F484C4LN
β Drop-Inβ In Stock
$772.12 / Unit
View Datasheet βEP3SE50F484C4L
β Drop-Inβ In Stock
$1020 / Unit
View Datasheet βEP3SE50F484I4 Maximum Ratings & Electrical Characteristics
| Family | Stratix III E (Enhanced) |
| Logic Elements (LE) | 47,500 |
| Logic Array Blocks (LAB) | 1,900 |
| Maximum User I/O | 296 |
| Embedded Memory (Bits) | 5,760,000 |
| DSP Blocks (18x18 Multipliers) | 216 |
| Process Technology | 65 nm CMOS |
| Core Voltage | 1.1 V |
| Maximum Operating Frequency | 450 MHz |
| Package | 484-ball FC-FBGA |
| Package Code | BBGA / FC-FBGA |
| Temperature / Speed Grade | I4 (Industrial) |
| Operating Junction Temperature | -40 C to +100 C |
| RoHS Status | Compliant |
| Mounting Type | Surface Mount (BGA) |
EP3SE50F484I4 bbga / fc-fbga Pin Configuration Guide
Pin configuration for EP3SE50F484I4 (bbga / fc-fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SE50F484I4.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SE50F484I4 is suitable for 6 applications: Telecom Line-Card Bridging, Software-Defined Radio DSP Backbone, ASIC Prototyping Platform, Broadcast Video Processing, Test and Measurement Instrumentation, Industrial Motion Control.
Telecom Line-Card Bridging
The EP3SE50F484I4's 47,500 LEs, 216 DSP blocks, and 296 user I/Os let it act as a protocol-bridging FPGA between TDM backplanes, GigE MACs, and PCIe Gen1/Gen2 endpoints on telecom line cards. Placed adjacent to a Stratix III GX transceiver device, the SE50 handles packet classification, QoS queuing, and CRC insertion while its 65 nm fabric sustains 200+ MHz datapaths. Compared to ASIC implementations, the FPGA variant accelerates NPI for emerging protocol variants without re-spinning silicon.
Recommended
Software-Defined Radio DSP Backbone
With 216 18x18 multipliers and 5.76 Mbits of block RAM, the EP3SE50F484I4 efficiently implements FFT/iFFT cores, digital down-conversion chains, and channelization filters for software-defined radio platforms. The industrial I4 temperature grade supports outdoor base-station and tactical-radio deployments. At 450 MHz fabric speed the device can run a 1024-point FFT at full sampling rate, matching dedicated DSP processors at lower BOM cost.
Recommended
ASIC Prototyping Platform
Engineers use the EP3SE50F484I4 as an FPGA prototype target for mid-complexity ASICs in industrial controllers, custom SoCs, and motor-control IP. The 1,900 LABs and 296 I/Os accept one-to-one mapping of typical 100K-gate ASIC netlists partitioned across multiple Stratix III devices. Quartus II synthesis flow with the Synopsys Design Compiler FPGA Compiler II enables near-cycle-accurate validation before tape-out, reducing re-spin risk.
Recommended
Broadcast Video Processing
Broadcast video routers and processing frames use the EP3SE50F484I4 to implement SD/HD/3G-SDI crosspoints, color-space converters, and frame-rate conversion in a single device. The 296 user I/Os comfortably route 16-24 SDI streams plus housekeeping interfaces, while the 65 nm fabric sustains 148.5 MHz pixel rates required for 3G-SDI. The I4 industrial grade supports the elevated ambient temperatures of broadcast equipment racks.
Recommended
Test and Measurement Instrumentation
Real-time oscilloscopes, protocol analyzers, and logic-analyzer modules deploy the EP3SE50F484I4 to implement trigger engines, capture buffers, and protocol-decode logic alongside commercial ADC/DAC front ends. The device's 5.76 Mbits of block RAM supplies sufficient on-chip storage for pre-trigger capture at sub-microsecond time bases, while its 216 DSP blocks compute eye-diagram statistics in real time. Industrial temperature screening fits lab and field-test environments.
Recommended
Industrial Motion Control
Multi-axis CNC machines, robotics controllers, and servo drives integrate the EP3SE50F484I4 to execute cascaded PID loops, trajectory planners, and EtherCAT/CAN bus interfaces within a single device. The industrial I4 temperature range handles the -40 C to +100 C junction temperatures found in cabinet-less machine-mount installations. The 296 I/Os accept up to 24 encoder inputs plus the necessary digital housekeeping without external muxing.
Recommended
Recommended Products Summary
Engineering reference data for EP3SE50F484I4 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SE50F484I3N | EP3SE50F484I3 | EP3SE50F484I3G | EP3SE50F484C4N | EP3SE50F484C4LN |
|---|---|---|---|---|---|---|
| Package | 484-ball FC-FBGA | 484-ball FC-FBGA (same) | 484-ball FC-FBGA (same) | 484-ball FC-FBGA (same) | 484-ball FC-FBGA (same) | 484-ball FC-FBGA (same) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 |
| Embedded Memory (Mbits) | 5.76 | 5.76 | 5.76 | 5.76 | 5.76 | 5.76 |
| User I/O | 296 | 296 | 296 | 296 | 296 | 296 |
| Speed Grade | I4 | I3 (faster) | I3 (faster) | I3 (faster) | C4 | C4L |
| Temperature Grade | Industrial (-40 C to +100 C) | Industrial (-40 C to +100 C) | Industrial (-40 C to +100 C) | Industrial (-40 C to +100 C) | Commercial (0 C to +85 C) | Commercial (0 C to +85 C) |
| Process / Core Voltage | 65 nm / 1.1 V | 65 nm / 1.1 V | 65 nm / 1.1 V | 65 nm / 1.1 V | 65 nm / 1.1 V | 65 nm / 1.1 V |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
Key Differentiators
- Identical die and package across all listed alternatives (vs EP3SE50F484I3N)
- Industrial temperature range (vs EP3SE50F484C4N)
- Highest speed grade (I4) in NRND window (vs EP3SE50F484I3N)
Design Notes
Stratix III E devices require four independent rails: 1.1 V core, 2.5 V analog PLL, 1.5 V/1.8 V/2.5 V/3.0 V configurable I/O banks, and 3.0 V configuration. Power-on sequence must follow the Stratix III Device Handbook (chapter on hot-socketing) to avoid latch-up. Estimated: total power for a fully loaded EP3SE50 design with 60 percent toggle rate is 5-7 W; design with 8 W worst-case headroom on the regulator.
The 484-ball FC-FBGA uses an exposed die attach pad that must be soldered to a thermal via array on the PCB for heat extraction. Estimated: theta_JA is roughly 12 C/W with a 6x6 thermal-via array (1.0 mm pitch); with 5 W dissipation the junction rises 60 C above ambient, leaving ample margin for industrial -40 C to +100 C operation. A thermal camera survey is recommended during prototype bring-up.
BGA breakout must use laser-drilled microvias or 4-mil trace-and-space escape routing through the top two PCB layers. All I/O banks should have 0.1 uF + 1 uF decoupling placed within 5 mm of each power ball, with the 1 uF closest to the BGA. Matched-length impedance for DDR2/DDR3 interfaces requires 50 ohm single-ended or 100 ohm differential routing per the Stratix III device handbook.
Confirm Quartus II software version supports the I4 speed grade - Quartus II v9.1 and later include Stratix III device support, but speed-grade timing models update through v13.x. Do not mix industrial and commercial speed grades on JTAG chains without re-loading the BSDL file, and ensure configuration mode (AS, PS, JTAG, FPP) is consistent with the selected EPCS serial configuration device, if used.
Compliance Information
RoHS compliance confirmed via distributor listings (DigiKey, Mouser) as of 2026-09-09. AEC-Q100 not applicable - this is a programmable logic device, not an automotive-grade IC in the AEC-Q100 sense. Lead-free finish confirmed. Halogen-free status not explicitly stated in the available web data.
