EP3SE80F1152I4LN - Stratix III E FPGA 80K LE 1152-FBGA | Intel
MPN: EP3SE80F1152I4LN ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2620 | $26,200.00 |
| 100 | $2380 | $238,000.00 |
| 250 | $2180 | $545,000.00 |
| 500 | $1995 | $997,500.00 |
EP3SE80F1152I4LN Overview
A Field-Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) -> integrated circuit (IC) -> semiconductor that allows hardware designers to configure digital logic blocks, interconnect, and I/O via a hardware description language after manufacture. FPGAs occupy a unique position between general-purpose microcontrollers and fixed-function ASICs: they offer massively parallel DSP performance, reconfigurable I/O protocols, and hardware-level latency, making them ideal for data-path-heavy workloads that CPUs handle inefficiently.
Key features of the EP3SE80F1152I4LN include 8 transceivers, 488 user I/O pins, 1.1 V core voltage, 0.9 V supply option, 65 nm process technology, and four PLLs plus 48 global clocks for high-speed timing distribution. The I4 speed grade indicates an industrial temperature screening (-40C to +100C junction) with mid-tier performance placement.
Architecturally, the Stratix III E family uses an Adaptive Logic Module (ALM) with 8-input fracturable look-up tables (LUTs), embedded DSP blocks for fixed/floating-point math, and TriMatrix embedded memory supporting single-port, simple dual-port, and true dual-port modes. Partial reconfiguration is supported, allowing portions of the fabric to be reprogrammed while the rest continues operating.
Typical applications include high-speed digital signal processing (radar, software-defined radio), ASIC prototyping, wireline telecom line cards, broadcast video processing, and military/aerospace signal processing systems. The 1152-ball FBGA exposes enough I/O and transceiver bandwidth to drive multi-gigabit serial links.
When designing with this part, plan power sequencing for the 1.1 V core (VCCINT) and 0.9 V analog supply separately, and verify signal integrity on the multi-row BGA escape. The Stratix III E is in production with mature Quartus II tooling, though newer designs should consider Cyclone V or Stratix 10 for lower power.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives from the Stratix III E family, and practical design notes not consolidated in the manufacturer datasheet, providing unique selection and procurement guidance.
Drop-in alternatives for EP3SE80F1152I4LN — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SE80F1152I4LN (same form factor and footprint) — differing in Package, Speed Grade, Operating Temperature, RoHS Status, Maximum Operating Frequency.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SE80F1152I4L
✅ Drop-In✓ In Stock
$2254.38 / Unit
View Datasheet →EP3SE80F1152I4
✅ Drop-In✓ In Stock
$2050 / Unit
View Datasheet →EP3SE80F1152I3N
✅ Drop-In✓ In Stock
$1395 / Unit
View Datasheet →EP3SE80F1152I3
✅ Drop-In✓ In Stock
$1950 / Unit
View Datasheet →EP3SE110F1152I4N
✅ Drop-In✓ In Stock
$2950 / Unit
View Datasheet →EP3SE50F1152I4N
✅ Drop-In📋 Reference alternative (not in catalog)
EP3SE80F1152I4LN Maximum Ratings & Electrical Characteristics
| Family | Stratix III E |
| Logic Elements | 80,000 |
| Embedded Memory Bits | 6,843,392 bits |
| Embedded Multipliers (18x18) | 744 |
| Maximum Operating Frequency | 500 MHz |
| Number of Transceivers | 8 |
| User I/O Pins | 488 |
| Core Voltage (VCCINT) | 1.1 V |
| Supply Voltage | 0.9 V |
| Process Technology | 65 nm |
| Package Type | 1152-BBGA, FC-FBGA (FineLine BGA) |
| Speed Grade | I4 |
| Operating Temperature | -40C to +100C (industrial) |
| PLLs | 4 |
| Global Clocks | 48 |
| Mounting Type | Surface Mount |
EP3SE80F1152I4LN 1152-bbga, fc-fbga (fineline bga) Pin Configuration Guide
Pin configuration for EP3SE80F1152I4LN (1152-bbga, fc-fbga (fineline bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SE80F1152I4LN.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SE80F1152I4LN is suitable for 7 applications: High-Speed Digital Signal Processing, ASIC Prototyping, Wireline Telecom Line Cards, Broadcast Video Processing, Military and Aerospace Signal Processing, Test and Measurement Instrumentation, Industrial Automation and Control.
High-Speed Digital Signal Processing
The EP3SE80F1152I4LN is well suited for high-speed DSP applications such as multi-channel radar processing, software-defined radio (SDR) baseband, and adaptive beamforming. Its 744 embedded 18x18 multipliers deliver massive parallel MAC throughput, while the 6,843,392 embedded memory bits provide on-chip buffering for FFT windows, FIR taps, and matrix operations without external SRAM access latency. At 500 MHz the fabric sustains gigabit-class DSP data flows, and the 8 integrated transceivers handle multi-gigabit serial I/O between processing blocks and backplane connectors. Designers typically allocate roughly 60-70% of logic for the DSP datapath and reserve the rest for control, memory interfaces, and timing.
Recommended
ASIC Prototyping
The EP3SE80F1152I4LN serves as an ASIC prototyping platform for designs targeting 70-90K ASIC gates. With 80K Stratix III E logic elements and 488 user I/O pins, the FPGA can map mid-complexity ASICs while exposing enough pins to break out interfaces such as DDR2/3 memory, PCIe Gen1, and parallel LVDS. The I4 industrial temperature grade allows prototyping in harsh-environment labs. Quartus II supports RTL-level design import, gate-level simulation, and incremental compile flows that map an ASIC RTL into FPGA fabrics for early software development and system validation.
Recommended
Wireline Telecom Line Cards
Telecom line cards use the EP3SE80F1152I4LN to implement packet processing, traffic shaping, and OTN framer logic. The 8 transceivers support multiple 3.125 Gbps SFI links, while the 488 I/O pins connect to external PHYs and backplane serdes. TriMatrix embedded memory holds packet descriptors and queue heads in on-chip RAM, eliminating off-chip SRAM for many L2/L3 functions. Industrial temperature screening ensures operation in central-office cabinets. The part's mid-range density places it between smaller line-card FPGAs and larger fabric-only chips.
Recommended
Broadcast Video Processing
Broadcast video equipment uses the EP3SE80F1152I4LN for SD/HD/3G-SDI routing, color space conversion, scaling, and overlay processing. The 488 user I/O pins support multiple parallel video buses, while embedded multipliers handle chroma resampling and deinterlacing in real time. The 6.8 Mbit embedded memory buffers multiple video frames for cross-format bridging. Industrial temperature screening allows deployment in 24/7 broadcast environments. The I4 speed grade is sufficient for 1080p60 4:2:2 video pipelines; 4K workflows typically require higher-density Stratix III variants.
Recommended
Military and Aerospace Signal Processing
Military and aerospace platforms use the EP3SE80F1152I4LN for radar, electronic warfare (EW), and secure communications signal processing. The industrial temperature grade (-40C to +100C junction) meets MIL-STD-810 environmental screening, and the 744 embedded multipliers accelerate FFT, pulse compression, and direction-finding algorithms. The 8 transceivers handle digital IF and serial RapidIO links to DSP clusters. Long-term Intel support for Stratix III E and the mature Quartus II toolchain make this part attractive for programs with 15-20 year deployment cycles. Designers must verify radiation-hardness and counterfeit-mitigation requirements program-by-program.
Recommended
Test and Measurement Instrumentation
High-end test and measurement equipment uses the EP3SE80F1152I4LN as the digital backbone for arbitrary waveform generators, logic analyzers, and protocol analyzers. The 744 embedded multipliers implement real-time DSP filtering and modulation, while the 488 user I/O pins drive high-speed ADCs and DACs via LVDS pairs. The 6.8 Mbit embedded memory captures waveform segments on-chip, reducing dead time. Industrial temperature screening allows benchtop-to-rack deployment. The I4 speed grade sustains 500 MHz timing, sufficient for sub-nanosecond TDC resolution and 5 Gbps protocol triggering.
Recommended
Industrial Automation and Control
Industrial automation systems deploy the EP3SE80F1152I4LN for high-speed machine vision, motion control, and deterministic Ethernet protocols such as EtherCAT and PROFINET IRT. The 8 transceivers support real-time serial links to remote I/O stations, while the 744 embedded multipliers accelerate motor-control algorithms such as field-oriented control (FOC) and space-vector PWM. The 6.8 Mbit embedded memory stores vision frame buffers and trajectory tables on-chip, reducing external memory dependency. Industrial temperature screening ensures reliable operation in factory-floor enclosures. The I4 speed grade meets the 100-microsecond cycle budgets of high-axis-count motion controllers.
Recommended
Recommended Products Summary
Engineering reference data for EP3SE80F1152I4LN — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SE80F1152I4L | EP3SE80F1152I4 | EP3SE80F1152I3N | EP3SE80F1152I3 | EP3SE110F1152I4N | EP3SE50F1152I4N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-FBGA, FC-FBGA | 1152-FBGA, FC-FBGA - same | 1152-FBGA, FC-FBGA - same | 1152-FBGA, FC-FBGA - same | 1152-FBGA, FC-FBGA - same | 1152-FBGA, FC-FBGA - same | 1152-FBGA, FC-FBGA - same |
| Logic Elements | 80,000 | 80,000 | 80,000 | 80,000 | 80,000 | 110,000 | 50,000 |
| Embedded Memory Bits | 6,843,392 | 6,843,392 | 6,843,392 | 6,843,392 | 6,843,392 | 8,388,608 | 5,140,608 |
| Embedded Multipliers (18x18) | 744 | 744 | 744 | 744 | 744 | 896 | 384 |
| User I/O Pins | 488 | 488 | 488 | 488 | 488 | 488 | 296 |
| Speed Grade | I4 (industrial) | I4 | I4 | I3 | I3 | I4 | I4 |
| Terminal Finish | Lead-free (RoHS) | Lead-free | Standard | Lead-free | Standard | Lead-free | Lead-free |
Key Differentiators
- Higher logic density than EP3SE50 in same package (vs EP3SE50F1152I4N)
- Industrial temperature grade over commercial C-grade (vs EP3SE80F1152C4N)
- Lead-free RoHS-compliant terminal finish (vs EP3SE80F1152I4N)
- Mid-range density and price point in Stratix III E (vs EP3SE260F1152I4N)
Design Notes
The Stratix III E EP3SE80F1152I4LN requires multiple supply rails: VCCINT (1.1 V core), VCCA (2.5 V PLL analog), VCCPD (2.5/3.0/3.3 V I/O pre-driver), and bank-specific VCCIO. According to the Stratix III E device handbook, power sequencing must enforce VCCINT before VCCIO to avoid latch-up, and the POR (power-on reset) circuit monitors VCCINT ramp rate. Use dedicated LDO regulators for VCCA to minimize PLL jitter, and decouple each rail with a 10 uF bulk cap plus 0.1 uF and 0.01 uF ceramic caps placed within 5 mm of each power pin pair.
Estimated: At 100% utilization with typical toggle rates, the EP3SE80F1152I4LN dissipates approximately 8-12 W. The 1152-FBGA package theta_JA is approximately 12-15 C/W with proper PCB thermal design. To stay below the 100C industrial junction limit, the PCB must include a thermal pad array, 8-12 thermal vias under the package center, and at least 4 layers of 1 oz copper. Designers should run Quartus II PowerPlay early in the design cycle to model actual dissipation and refine thermal strategy.
The 1152-ball FC-FBGA has 1.0 mm ball pitch, requiring HDI PCB technology with laser-drilled microvias. According to Stratix III E hardware guidelines, signal escape from inner rows must use via-in-pad or staggered microvia fan-out to maintain 100 ohm differential impedance for LVDS and transceiver channels. Use 4-6 PCB layers minimum with a dedicated ground plane adjacent to the top signal layer. Decoupling caps must be placed on the bottom side directly under their respective power pins using 0201 or 0402 sizes to minimize loop inductance.
Common Stratix III E design mistakes: (1) leaving JTAG TCK floating causes configuration failures; pull TCK to VCCPD through a 1-10 kohm resistor. (2) ignoring MSL3 moisture sensitivity on FBGA requires dry-pack storage and pre-bake before reflow. (3) configuring PLL feedback mode incorrectly causes frequency drift; consult the clock planning chapter before locking PLLs. (4) using 3.3 V LVCMOS into a 2.5 V VCCIO bank damages I/O - always match VCCIO to signaling standard. (5) failing to configure unused transceiver channels causes excess power; tie MSEL pins for unused GXB to power-down state.
Compliance Information
RoHS compliance inferred from LN suffix (lead-free terminal finish) and Stratix III E family documentation. AEC-Q100 not applicable for FPGAs. Halogen-free status not explicitly stated in distributor listings - consult Intel product declaration documents.
