EP3SE80F1152I4 - Stratix III E FPGA 80K LE 1152-FCBGA | Intel (Altera)
MPN: EP3SE80F1152I4 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2783.25 | $2,783.25 |
| 10 | $2644.09 | $26,440.90 |
| 100 | $2365.76 | $236,576.00 |
| 250 | $2190 | $547,500.00 |
| 500 | $2050 | $1,025,000.00 |
EP3SE80F1152I4 Overview
An FPGA (Field-Programmable Gate Array) is a programmable logic device that combines a sea of configurable logic blocks, dedicated hardware multipliers, embedded memory blocks, and high-speed serial transceivers on a single die. FPGAs belong to the broader programmable logic family (alongside CPLDs) and are widely used as flexible alternatives to ASICs because the same silicon can be reconfigured for different designs. Stratix III E devices specifically emphasize enhanced logic capacity and DSP throughput for telecom, defense, and high-performance computing systems.
Key features of the EP3SE80F1152I4 include 3,200 Logic Array Blocks (LABs), 80,000 logic elements, 6,843,392 bits of RAM, 744 user I/Os, and an internal operating frequency up to 800 MHz. The 'I' speed grade and '4' device-grade indicator denote an industrial temperature range of -40 °C to +100 °C junction (per the Stratix III nomenclature). The 1152-ball FCBGA package supports vertical migration across Stratix III E densities (EP3SE50, EP3SE80, EP3SE110, EP3SE260) sharing the same 1152-ball footprint.
Architecturally, the Stratix III E uses Altera's Adaptive Logic Module (ALM) and TriMatrix memory blocks, with dedicated DSP blocks delivering up to 600 MHz performance and high-speed transceivers for multi-gigabit serial links. The 65 nm process with 1.1 V core supply balances high performance against dynamic power, and the device supports JTAG IEEE Std 1149.1 boundary-scan test for production board test.
Typical applications include high-performance digital signal processing, ASIC prototyping, telecom line cards, high-end video broadcast equipment, military radar and signal-intelligence systems, and PCIe Gen1/Gen2 endpoint or root-port designs. The large logic capacity and abundant I/O make it well suited to designs requiring wide parallel data buses or multiple high-speed serial channels.
When designing with this FPGA, verify that your Quartus II design software supports the EP3SE80F1152I4 device variant and that the PCB footprint matches the 1152-ball FCBGA land pattern. Confirm pin assignment against the Stratix III device handbook and account for the industrial temperature grade when selecting cooling solutions for harsh environments. Stratix III devices are now in legacy lifecycle status with Intel, so for new designs consider Stratix V, Cyclone V, or Agilex 7 as successors.
Drop-in alternatives for EP3SE80F1152I4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SE80F1152I4 (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, RoHS Status, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SE50F1152I4
✅ Drop-In📋 Reference alternative (not in catalog)
EP3SE110F1152I4
✅ Drop-In✓ In Stock
$1020 / Unit
View Datasheet →EP3SE260F1152I4
✅ Drop-In✓ In Stock
$1750 / Unit
View Datasheet →EP3SE110F1152I3
✅ Drop-In✓ In Stock
$4150 / Unit
View Datasheet →EP3SE260F1152I3
✅ Drop-In✓ In Stock
$16500 / Unit
View Datasheet →EP3SE80F1152I4 Maximum Ratings & Electrical Characteristics
| Family | Stratix III E |
| Logic Elements (LE) | 80,000 |
| Logic Array Blocks (LABs) | 3,200 |
| Embedded Memory (bits) | 6,843,392 |
| User I/Os | 744 |
| Maximum Operating Frequency | 800 MHz |
| Process Technology | 65 nm CMOS |
| Core Supply Voltage | 1.1 V |
| Package | 1152-ball FineLine BGA (FCBGA) |
| Operating Temperature | -40 °C to +100 °C TJ (industrial, 'I' grade) |
| Speed Grade | I4 (fastest industrial) |
| Configuration | JTAG IEEE Std 1149.1 boundary-scan |
| Architecture | ALM-based Adaptive Logic Module |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Lifecycle | Last Time Buy / Legacy (Intel FPGA legacy program) |
EP3SE80F1152I4 Pin Configuration
| Pin 1 | VCC — Core supply voltage (1.1 V) - one of multiple VCC balls distributed across the FCBGA grid |
| Pin 2 | IO — User I/O - 744 user I/O balls total in this FCBGA-1152 package |
| Pin 3 | GND — Ground - one of many GND balls distributed across the FCBGA grid |
| Pin 4 | VCCPD — I/O pre-driver supply voltage |
| Pin 5 | CONFIG — Configuration pin (nCONFIG/nSTATUS family) |
| Pin 6 | TCK — JTAG test clock (IEEE 1149.1) |
| Pin 7 | TMS — JTAG test mode select |
| Pin 8 | TDI — JTAG test data in |
| Pin 9 | TDO — JTAG test data out |
| Pin 10 | NC — Not connected - reserved ball per Stratix III pin table |
Typical Applications
EP3SE80F1152I4 is suitable for 6 applications: High-Performance Digital Signal Processing, ASIC Prototyping and Emulation, Telecom Line Cards and Network Processors, Video Broadcast and Image Processing, Military Radar and Signal Intelligence, PCIe Endpoint and Bridge Designs.
High-Performance Digital Signal Processing
The EP3SE80F1152I4's 80,000 logic elements and 3,200 LABs make it well-suited for DSP pipelines such as radar signal processing, software-defined radio baseband, and channelised receivers. The Stratix III E family provides dedicated DSP blocks operating at up to 600 MHz with 18x18-bit multipliers, enabling single-cycle MAC operations and FIR filter throughputs of tens of GMACS per second. The 744 user I/Os in the 1152-ball FCBGA package allow wide parallel data paths to external ADCs/DACs, while the 6.8 Mbit embedded memory delivers buffering for sample streams and coefficient tables.
Recommended
ASIC Prototyping and Emulation
Designers use the EP3SE80F1152I4 to prototype and validate ASIC designs before tape-out, taking advantage of its 80K LE capacity to map multi-million-gate ASICs. The 1152-ball FCBGA package exposes ample I/Os for connecting to ASIC test fixtures, daughter-cards, and logic analysers. Vertical migration to EP3SE110F1152I4 or EP3SE260F1152I4 in the same footprint provides additional capacity as the prototype design grows, without forcing PCB rework. Quartus II synthesis and the TimeQuest timing analyser support incremental prototyping flows.
Recommended
Telecom Line Cards and Network Processors
Stratix III E FPGAs are widely deployed in telecom line cards for packet classification, traffic shaping, and SERDES aggregation. The EP3SE80F1152I4 provides up to 800 MHz logic performance plus high-speed transceivers for multi-gigabit serial links (PCIe, SRIO, XAUI, CEI) needed at line-card backplane rates. The 744 user I/Os accommodate wide external bus interfaces to network processors and lookup memories, while the 6.8 Mbit embedded RAM enables on-die queue and table storage that offloads the network processor.
Recommended
Video Broadcast and Image Processing
The EP3SE80F1152I4's logic density and DSP blocks support real-time video processing pipelines for broadcast studios, medical imaging, and surveillance. Common designs include multi-channel HD/4K upscalers, colour-space converters, and motion-compensated noise reducers. The 744 I/Os provide parallel connections to HDMI, SDI, or DisplayPort PHY chips, while the abundant embedded memory buffers full video frames at 1080p60 or 4K resolutions. Designers can scale up to EP3SE110F1152I4 or EP3SE260F1152I4 in the same FCBGA package if processing complexity grows.
Recommended
Military Radar and Signal Intelligence
The industrial (-40 °C to +100 °C) temperature grade 'I' and the EP3SE80F1152I4's high logic density make it suitable for ruggedised radar, electronic-warfare, and signal-intelligence platforms. Designers implement digital beamforming, pulse compression, FFT engines, and direction-finding algorithms in the 80K logic fabric, with the 744 I/Os connecting to wide ADC/DAC banks. Vertical migration within the 1152-ball FCBGA footprint lets systems scale from EP3SE50 to EP3SE260 as channel counts increase, simplifying logistics across product variants.
Recommended
PCIe Endpoint and Bridge Designs
Stratix III E FPGAs are commonly used as PCIe Gen1/Gen2 endpoints, root complexes, and protocol-bridging devices (PCIe to local bus, PCIe to memory, PCIe to serial RapidIO). The EP3SE80F1152I4 contains hardened PCIe IP blocks and high-speed transceivers supporting PCIe Gen2 ×4 or ×8 endpoints, with 744 user I/Os exposing local bus, memory, and sideband interfaces. The 6.8 Mbit embedded RAM serves as on-die buffering for DMA and descriptor queues, while the FCBGA package supports the controlled-impedance layout required for 5 Gbps SERDES.
Recommended
Recommended Products Summary
Engineering reference data for EP3SE80F1152I4 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SE50F1152I4 | EP3SE110F1152I4 | EP3SE260F1152I4 | EP3SE110F1152I3 | EP3SE260F1152I3 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 1152-ball FCBGA | 1152-ball FCBGA - same | 1152-ball FCBGA - same | 1152-ball FCBGA - same | 1152-ball FCBGA - same | 1152-ball FCBGA - same |
| Logic Elements | 80,000 | 50,000 | 110,000 | 260,000 | 110,000 | 260,000 |
| User I/Os | 744 | 744 (same) | 744 (same) | 744 (same) | 744 (same) | 744 (same) |
| Maximum Frequency | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 600 MHz (I3) | 600 MHz (I3) |
| Speed Grade | I4 (fastest industrial) | I4 | I4 | I4 | I3 (slower) | I3 (slower) |
| Operating Temperature | -40 °C to +100 °C TJ (industrial) | -40 °C to +100 °C TJ | -40 °C to +100 °C TJ | -40 °C to +100 °C TJ | -40 °C to +100 °C TJ | -40 °C to +100 °C TJ |
Key Differentiators
- Highest density within Stratix III E 1152-ball FCBGA footprint with the fastest speed grade (vs EP3SE50F1152I4)
- Faster I4 speed grade compared to I3 alternatives in the same package (vs EP3SE110F1152I3)
- Industrial temperature grade in legacy product line (vs EP3SE260F1152I4)
Design Notes
The 1152-ball FCBGA package requires a high-density PCB with microvia or stacked-via stack-up, controlled-impedance routing for SERDES, and matched-length pairs for high-speed interfaces. Use at least an 8-layer board with continuous ground planes beneath the BGA fanout; pair each high-speed transceiver differential pair within 150 µm of each other with reference planes intact. Verify the FCBGA land pattern against the manufacturer footprint recommendation before tape-out.
Stratix III E devices can dissipate 10-25 W at high utilization. The FCBGA-1152 package requires a thermal interface material, heat spreader, or heatsink attached to the lid to keep junction temperature within the -40 °C to +100 °C industrial range. Compute worst-case power using the Quartus II Early Power Estimator before final heatsink selection, and validate with on-board thermal sensors during bring-up.
Stratix III E devices require Altera Quartus II (not Quartus Prime) for compilation, since Quartus Prime dropped support for legacy Altera device series. Ensure your design flow uses Quartus II 13.1 or earlier and that the device family library is installed. Also note that Intel has moved Stratix III to the legacy / last-time-buy program, so for new designs consider Stratix V, Cyclone V, or Agilex 7 as successors with active long-term support.
Decouple the EP3SE80F1152I4 with a dense array of 0.1 µF and 10 µF ceramic capacitors placed within 5 mm of each power pin pair. Use separate power planes for VCC (1.1 V core), VCCPD (I/O pre-driver), VCCPGM (configuration), and VCCA_PLL (PLL analog) with ferrite beads or pi-filters at the supply entry point. Keep PLL power quiet by routing the VCCA_PLL trace away from high-speed digital signals.
Compliance Information
RoHS and lead-free compliance inferred from Altera/Intel legacy product page standards. AEC-Q100 is not applicable to FPGAs in this automotive context. Halogen-free status was not confirmed in verified sources and is marked unknown.
