EP3SE80F1152I3N - Stratix III E FPGA 80K LE, 1152-FCBGA | Intel
MPN: EP3SE80F1152I3N ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1850 | $1,850.00 |
| 10 | $1750 | $17,500.00 |
| 100 | $1620 | $162,000.00 |
| 500 | $1495 | $747,500.00 |
| 1,000 | $1395 | $1,395,000.00 |
EP3SE80F1152I3N Overview
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that allows designers to implement arbitrary digital logic circuits by configuring an array of configurable logic blocks (CLBs), embedded multipliers, memory blocks, and high-speed transceivers, interconnected by a programmable routing fabric. FPGAs occupy a tier in the semiconductor hierarchy between Application-Specific Integrated Circuits (ASICs) and general-purpose processors, providing hardware-level performance with software-level reconfigurability. The Stratix III E family specifically enhances DSP capability and transceiver bandwidth versus the baseline Stratix III series.
Key features include 500 MHz maximum internal clock frequency, integrated adaptive logic modules (ALMs), dedicated DSP blocks, up to 12 embedded transceivers depending on package, and support for external memory interfaces including DDR3, QDR II+, and RLDRAM II. The device also offers enhanced security via configuration bitstream encryption with AES, and supports partial reconfiguration for in-system logic updates. The 1152-ball FCBGA package provides a compact 35 mm × 35 mm footprint suitable for high-density PCB designs with multiple ground/power balls for low-impedance power delivery.
The EP3SE80F1152I3N utilizes a low-power 65 nm process with enhanced power management features including programmable power technology that allows unused blocks to enter a low-quiescent state. Combined with 8-input fracturable ALMs and dedicated hardware multipliers, the device achieves an optimal performance-per-watt ratio for DSP-intensive designs such as baseband processing, video transcoding, and high-speed data acquisition.
Typical applications include Software Defined Radio (SDR), high-performance computing accelerators, test and measurement equipment, medical imaging systems, military radar, and high-end broadcast video processing. The high logic density combined with rich DSP and memory resources makes the device particularly well-suited for multi-channel processing systems where multiple parallel data paths must be implemented in a single device.
When designing with this FPGA, ensure proper power sequencing (1.1 V core before 2.5 V/3.3 V I/O), use at least 8 decoupling capacitors per power rail, and follow Altera's recommended PCB layout guidelines for FCBGA packages including microvia/stacked-via construction for breakout. Configuration via JTAG or a configuration device (EPCS/EPCQ) should also be planned early in the design cycle.
This page synthesizes distributor pricing, same-brand Stratix III E drop-in alternatives, and practical design notes for engineers considering the EP3SE80F1152I3N for high-density programmable logic designs.
Drop-in alternatives for EP3SE80F1152I3N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with EP3SE80F1152I3N (same form factor and footprint) — differing in Package, Operating Temperature, Speed Grade, Process Technology, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP3SE80F1152C4N
✅ Drop-In✓ In Stock
$1395 / Unit
View Datasheet →EP3SE80F1152C4LN
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View Datasheet →EP3SE80F1152C4L
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$2280 / Unit
View Datasheet →EP3SE80F1152C4
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$895 / Unit
View Datasheet →EP3SE80F1152C3N
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$1690 / Unit
View Datasheet →EP3SE80F1152C3
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$1880 / Unit
View Datasheet →EP3SE80F1152C2N
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$2685 / Unit
View Datasheet →EP3SE80F1152I3N Maximum Ratings & Electrical Characteristics
| Family | Stratix III E |
| Logic Elements | 80,000 |
| Logic Array Blocks (LABs) | 3,200 |
| Embedded Memory Bits | 6,843,392 |
| Maximum User I/O | 744 |
| Package | 1152-ball FCBGA (Flip-Chip BGA) |
| Process Technology | 65 nm |
| Core Voltage | 1.1 V |
| Auxiliary Supply Voltages | 1.2 V, 3.3 V |
| Maximum Internal Clock Frequency | 500 MHz |
| Operating Temperature | -40 °C to +100 °C (Industrial) |
| Speed Grade | I3 |
| Mounting Type | Surface Mount |
| Configuration Mode | JTAG / Passive Serial / Fast Passive Parallel |
| Configuration Encryption | AES-128 bitstream encryption supported |
EP3SE80F1152I3N 1152-ball fcbga (flip-chip bga) Pin Configuration Guide
Pin configuration for EP3SE80F1152I3N (1152-ball fcbga (flip-chip bga) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP3SE80F1152I3N.
Refer to the datasheet for full pin configuration.
Typical Applications
EP3SE80F1152I3N is suitable for 7 applications: Software Defined Radio (SDR) Baseband, High-Performance DSP Accelerator, Medical Imaging Systems (CT/MRI Reconstruction), Test & Measurement Instrumentation, Military Radar Signal Processing, Broadcast Video Processing & Transcoding, Industrial Machine Vision Inspection.
Software Defined Radio (SDR) Baseband
The EP3SE80F1152I3N fits SDR baseband processing because it integrates 80,000 logic elements, dedicated DSP blocks, and 6.84 Mbits of embedded memory in a single device. Its 500 MHz internal clock and 744 user I/O enable multi-channel digital down-conversion and demodulation of wideband IF signals. Placed on the baseband card between the ADC and the host processor, the FPGA performs channelization, FFT, and symbol mapping at hardware speed. Compared with a DSP processor approach, this FPGA implementation achieves 5-10× higher throughput per watt for the same signal processing chain.
Recommended
High-Performance DSP Accelerator
For DSP-accelerated compute offload, the EP3SE80F1152I3N delivers up to 80K logic elements combined with hard DSP blocks capable of 18×18 multiplication at 500 MHz. Engineers typically instantiate the device on a PCIe accelerator card where it accelerates FIR filters, FFT/iFFT, and matrix multiplication for radar, imaging, and scientific workloads. The 1152-ball FCBGA footprint supports high-bandwidth external memory interfaces such as DDR3, allowing multi-gigasample data buffers to sit alongside the FPGA without bottlenecking the compute pipeline.
Recommended
Medical Imaging Systems (CT/MRI Reconstruction)
The EP3SE80F1152I3N is well-suited to CT and MRI image reconstruction because its 80K logic elements, dedicated DSP blocks, and 6.84 Mbit embedded memory can sustain the back-projection and filtered back-projection algorithms at clinical frame rates. Integrated in the image-processing pipeline between the detector array and the host workstation, the FPGA delivers reconstructed 512×512 slices in under one second per slice. Its industrial temperature grade supports the controlled thermal environment of imaging cabinets, and the 1152-ball FCBGA simplifies routing of high-speed LVDS links from the detector front-end.
Recommended
Test & Measurement Instrumentation
Instruments such as logic analyzers, protocol exercisers, and arbitrary waveform generators benefit from the EP3SE80F1152I3N's combination of 744 user I/O, 500 MHz internal clock, and abundant logic/memory resources. The device can implement custom stimulus/response engines with parallel pattern generation and on-the-fly analysis without consuming host CPU cycles. With 1.1 V core and 3.3 V I/O supplies, the FPGA integrates directly with high-speed ADC/DAC front-ends on the same board, reducing analog-to-digital latency to a few nanoseconds.
Recommended
Military Radar Signal Processing
Radar front-end processing demands deterministic latency and high throughput, both delivered by the EP3SE80F1152I3N's 500 MHz clock and dedicated DSP resources. Used in the radar receiver chain between the down-converter and the tracker, the FPGA performs pulse compression, moving-target indication (MTI), and CFAR detection in real time. The industrial -40 °C to +100 °C temperature range and robust FCBGA package suit the harsh thermal environment of airborne and ground-mobile radar platforms, where shock, vibration, and wide temperature swings are routine.
Recommended
Broadcast Video Processing & Transcoding
Broadcast studios deploying real-time video transcoders, format converters, and multiviewers can use the EP3SE80F1152I3N to implement pipelined video processing at full HD and 4K frame rates. Its 6.84 Mbit embedded memory holds multiple line buffers in parallel, while the DSP blocks accelerate motion estimation, deinterlacing, and scaling kernels. The 744 user I/O is sufficient for multi-channel SDI/HDMI ingest/egress with embedded audio extraction, all processed within a single chip at sub-frame latency.
Recommended
Industrial Machine Vision Inspection
Factory automation lines use the EP3SE80F1152I3N to implement high-speed defect detection on moving parts at production-line cadence. The FPGA's DSP blocks accelerate convolution, edge detection, and pattern matching at pixel rates exceeding 1 Gpixel/s, while 744 user I/O accommodate parallel Camera Link or CoaXPress sensor interfaces. Industrial temperature rating ensures reliable operation inside sealed factory enclosures where ambient temperatures regularly exceed 70 °C near motor drives and process equipment.
Recommended
Recommended Products Summary
Engineering reference data for EP3SE80F1152I3N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP3SE80F1152C4N | EP3SE80F1152C4LN | EP3SE80F1152C4L | EP3SE80F1152C4 | EP3SE80F1152C3N | EP3SE80F1152C3 | EP3SE80F1152C2N |
|---|---|---|---|---|---|---|---|---|
| Package | 1152-ball FCBGA | 1152-ball FCBGA - same | 1152-ball FCBGA - same | 1152-ball FCBGA - same | 1152-ball FCBGA - same | 1152-ball FCBGA - same | 1152-ball FCBGA - same | 1152-ball FCBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 80,000 | 80,000 | 80,000 | 80,000 | 80,000 | 80,000 | 80,000 | 80,000 |
| Speed Grade | I3 | C4 (slower) | C4 (slower) | C4 (slower) | C4 (slower) | C3 (slowest) | C3 (slowest) | C2 (slowest) |
| Temperature Range | Industrial -40 °C to +100 °C | Commercial 0 °C to +85 °C | Commercial 0 °C to +85 °C | Commercial 0 °C to +85 °C | Commercial 0 °C to +85 °C | Commercial 0 °C to +85 °C | Commercial 0 °C to +85 °C | Commercial 0 °C to +85 °C |
| Embedded Memory | 6,843,392 bits | 6,843,392 bits | 6,843,392 bits | 6,843,392 bits | 6,843,392 bits | 6,843,392 bits | 6,843,392 bits | 6,843,392 bits |
| Maximum User I/O | 744 | 744 | 744 | 744 | 744 | 744 | 744 | 744 |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Key Differentiators
- Industrial temperature range with fast I3 speed grade (vs EP3SE80F1152C4N)
- Same die, drop-in compatible with all 1152-ball FCBGA siblings (vs EP3SE110F1152I3N)
- Mid-density sweet spot of Stratix III E family (vs EP3SE50F780I3N)
Design Notes
The EP3SE80F1152I3N requires multiple regulated rails: 1.1 V core, 2.5 V PLL auxiliary, and 3.3 V I/O. Per Intel's Stratix III Handbook, follow the prescribed power-on sequence (1.1 V before 2.5 V/3.3 V) to avoid latch-up; use a sequencer IC such as the LTC2923 or a dedicated FPGA-power controller. Place at least eight 4.7 µF + 0.1 µF decoupling pairs adjacent to the FCBGA power balls, distributed evenly around the package perimeter to minimize transient ringing during simultaneous switching of 744 I/O.
The 1152-ball FCBGA package relies heavily on the PCB for heat dissipation; without thermal vias the junction temperature can exceed 125 °C at full utilization. Estimated: at typical SDR workload (50 % logic, 60 % DSP, 70 % I/O toggle), the device dissipates approximately 6-9 W. Per Intel's thermal model, a 6×6 via array (0.3 mm pitch, 0.2 mm drill) under the center thermal balls reduces θJA by ~35 % versus no thermal vias. Always validate with the Stratix III PowerPlay early-power estimator before committing to the PCB stack-up.
The 1.0 mm ball pitch of the 1152-ball FCBGA mandates microvia (laser-drilled) or stacked-via PCB technology - conventional 0.3 mm mechanical drills will not fit between balls. Recommended stack-up is 8 layers with 1 oz copper on signal layers, 2 oz on inner power/ground planes, and a low-loss (Dk < 3.5, Df < 0.005 @ 1 GHz) high-Tg FR-4 or low-Dk spread-glass material for high-speed transceiver routing. Follow Intel's FCBGA breakout routing guidelines for via-in-pad, dog-bone fanout, and decoupling placement.
Avoid three common mistakes: (1) omitting the external configuration device (EPCS16/EPCS64/EPCQ) and relying solely on JTAG for production - JTAG is for prototype debug only and is not bootable on power-up; (2) leaving unused I/O banks floating - Intel mandates each unused I/O bank be powered to its VCCIO with all pins configured as inputs with weak pull-up; (3) ignoring the global clock network skew budget beyond 500 MHz - use the Quartus TimeQuest timing analyzer to verify all clock-domain crossings meet 200 ps setup/hold margins before tape-out.
Route all 1.1 V core power through a dedicated solid plane on layer 3, with the 3.3 V I/O plane on layer 6 separated by a ground plane on layer 4/5 to minimize switching noise injection into the core. Place differential pairs (LVDS, DDR memory clocks) on stripline layers 4 and 5 to maximize isolation, and keep length matching within ±25 mil for DDR3 data/address and ±10 mil for source-synchronous clocks. Per Intel reference designs, all configuration and JTAG signals should be length-matched within 100 mil to avoid programming failures on long boards.
Compliance Information
RoHS/REACH/lead-free status was not present in the verified web data and is recorded as unknown. As an industrial-grade IC it is generally not subject to AEC-Q100 (automotive) qualification. For aerospace/defense use, review the device's full material declaration with Intel before design-in.
